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Engineering Data Management (EDM) suite helps engineering teams create RoHS/WEEE compliant products. The database management system enables detailed control over all product design data with emphasis on environmental compliance material content. Supports various versions of RoHS data including RoHS 5 (NIE exemption) and the general RoHS 6 requirements. Can manage all relevant product design data including ECAD (electrical) and MCAD (mechanical) with the capability to create RoHS/WEEE reporting documentation.
 
Functions include BOM versioning, ECO generation, full library and workflow management, and document archival for the engineering work group.

EMA Design Automation, ema-eda.com
Symbion S36 post-reflow automated optical inspection system provides inspection for high productivity and first-pass yield. Wizard & Go operation features a user-friendly graphic wizard interface that reduces set-up time and operator requirements. DPIX detection technology, based on specialized 3-D image acquisition and image processing techniques, reportedly ensures high accuracy detection with minimized false calls and without compromising speed. Produces measurement and attribute data for statistical process control (SPC). Integrated ADVISOR software allows users real-time access to data for continual process analysis and improvement.

 
Orbotech Ltd.,  orbotech.com

Green Monster! ESD stencil wiping rolls prevent static buildup and do not use weak paper or tissue fibers.  Paper or tissue is typically only held together by weak hydrogen bonds which are quickly destroyed when wet. Instead, they use thicker and coarser rayon fibers that absorb solvents.

 
With coarse fibers, the porosity is higher, more vacuum can be used to clean solder paste from the apertures, and they are conducive to an aggressive cleaning surface. 

 
High-Tech Conversions, high-techconversions.com
32K443-800 connector has a four-hole flange mounting structure, with a separate center contact pin soldered to the signal via the board. The connector is reusable, extra center contact pins are available. Said to have excellent electrical performance up to 18 GHz.
 
SMCC (surface mount coaxial connector) products provide an impedance match if the signal trace or signal via on the board is 50 Ohm.
 
Rosenberger provides custom footprints to its customers, developed based on the connector and board models that optimize RF performance.

 
Rosenberger of North America, rosenbergerna.com

GÖPEL electronic and Scorpion Technologies have developed a JTAG/Boundary Scan option for the Scorpion Flying Probe Tester (FPT).

 
Is based on the integration of the Cascon Galaxy software and Scanflex hardware into the FPT with up to 24 probes that can be freely positioned and used as virtual Boundary Scan pins.
 
Bettina Becker, marketing and international sales manager for GÖPEL, said: “The direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each probe acting as additional virtual scan pin in a Boundary Scan test.  The user is now able to achieve a significant increase in test coverage for digital as well as mixed signal ICs, whereby Boundary Scan procedures already utilized in the lab can be completely reused without modifications.”
 
The integration is based on PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively.  The connection to the UUT is realized using a transceiver model SFX-TAP4/C, which provides four parallel TAP and up to eight programmable interface parameters for adaptation to the UUT. The UUT is connected by means of the standard FPT interface. The reliable TAP-Transceiver with CION-Interface enables direct control of UUTs up to 1.5 m. No additional electronics are required. 32 dynamic I/O pins are available on the hardware.
 
All Cascon software editions can run on the FPT.
 
GÖPEL electronic, goepel.com
 
Scorpion Technologies AG, scorpion-tech.com
 
Novatec, a French research laboratory, announces an new tool for board support ¾ VacuNest Shape Memory Tooling.

 
Board support is critical in printers, dispensers and pick-and-place machines to run a repeatable process.
 
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules.
 
Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will hold for weeks/days/months until the vacuum is released. The modules return to their original form, awaiting the next version of board.
 
Cuts risk of damage to a component due to the pin/printing pressure; supports forces evenly spread over the entire board.
 Can handle high-density boards and requires little to no lead-time.
 
Guarantees board flatness and is not sensitive to solder paste contamination.
 
Novatec, novatec-eap.com
AirMax VS high-speed connector system includes mezzanine, co-planar, high-power, I/O and backplane header versions. Said to offer scalability, flexibility, high density and performance headroom through its use of air as the dielectric and its Insert Molded Leadframe Assembly (IMLA).
 
Uses edge-coupling technology and an air dielectric between adjacent conductors, delivering high signal density with low insertion loss and low crosstalk, without metal shields. 
 
Dual-beam receptacle contact provides two points of contact, one on each side of the header blade. Vertical header features a robust housing providing generous “lead in.” Comes with protective cover that also serves as press-in block during connector installation.
 
Comprised of a full set of building blocks for backplane, co-planar, mezzanine and cable-to-board applications. Are scaleable to the number of columns; available with housings in various IMLA counts. 
 
Allow for custom pin assignments (differential or single-ended signals as well as power), so system data rates can grow from 2.5 Gb/s to over 12 Gb/s without re-design of the basic platform. 
 
FCI, fciconnect.com/airmax
 
Owens Design partnered with Questar Products International to develop a line of automatic wire bonders built on Kulicke and Soffa’s former Hybrid bonder platforms. Capabilities include fine pitch, large table travel and ball bumping, with user friendly, customizable software. The Questar Q2100 series bonders are designed for a range of complex devices.
 
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
 
Questar Products International, questarinc.com
Owens Design, owensdesign.com
Speedline Technologies will unveil several new options for its MPM Accela printer as well as an upgrade of its MPM UltraPrint 2000 printer at Apex 2006. 
 
Speedline will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions in booth #1207.
 
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce:
·        A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making. 
·        An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software.  Provides data management down to the board (within the panel) level in the printer.
·        An option for closed loop control of the printer using external inspection information.
 
Speedline Technologies, speedlinetech.com
Apex booth 1207

Speedline Technologies will unveil several new options for its MPM Accela printer as well as an upgrade of its MPM UltraPrint 2000 printer .  The company will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions .
 
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce:
·        A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making. 
·        An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software.  Provides data management down to the board (within the panel) level in the printer.
·        An option for closed loop control of the printer using external inspection information.
 
Speedline Technologies, speedlinetech.com
Apex booth 1207
IS640-280 has a nominal dielectric constant of 2.80 at 10 GHz and a dissipation factor of 0.0028 at 10 GHz. Available in 20, 30 and 60 mil thickness configurations. Other configurations available on request.
 
IS640-280, IS640-333, IS640-338, IS640-345, IS640-325, IS640-320 and IS640-300 are manufactured in Isola’s Chandler, AZ, facility. Data sheets for each are available for download on the Website.
 
Isola Group, isola-group.com
RVSI Inspection will showcase the WS-2800 Wafer Inspection System in HTL Co.’s booth, #10A-101, at the Semicon Japan show, taking place Dec. 7-9.
 
WS-2800 is said to provide superior yield management for defect inspection throughout post-fab processes for both standard and flip chip wafers up to 200 mm in diameter.
 
Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact production yields and time-to-market. The inspection system locates wafer defects and classifies them to reduce process costs and improve yield.
 
Benefits include: high-speed surface defect inspection, 100% inspection that ensures no escapes and an integrated inspection tool for fast response to process variations.
 
RVSI Inspection, rvsi.com

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