Aquanox A4520T Aqueous Chemistry for flush mounted and fine-pitch componentsis designed to clean under low standoffs and in the tight spaces caused by smaller, more heavily populated devices. Said to be effective on all lead-free, no-clean and eutectic materials available today, while providing the low cost of ownership.
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, effective without sump side additives. Also features a long bath life, is RoHS compliant.
Can clean numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites in addition to most precious metals. The biodegradable aqueous solution is non-flammable and non-corrosive.
Available commercially in one, five and 55 gallon containers.
For the past year, RVSI Inspection has offered customers the opportunity to replace the core inspection module of their MicroMap 3-D based LS series tools. The company will now expand the program.
In the past, these upgrades were done at the RVSI factory by exchanging a series of parts. Under the new plan, RVSI Inspection ships a fully functioning/fully tested inspection cabinet to the customer site, where it is exchanged with the older cabinet, taking full advantage of the handler that is already part of the system. This “replacement” can occur at less than half the price of a new tool yet performs at 2X the speed on average. This replacement concept reduces shipping time.
The program is offered on LS-3950, LS-7100 and LS-7700 model RVSI Lead Scanner systems.
NuSil Technology, a manufacturer of silicone-based materials for military, aerospace, electronics and photonics, has expanded its line of electronic packaging materials (EPMs).
All materials in this line will have low outgassing properties to prevent contamination. They have undergone extensive processing and maintain weight losses of less than 1% after exposure to temperatures exceeding 275°C for one hour. Other materials used in this industry are said to exhibit weight losses four to five times that of the NuSil materials.
Among the new offerings are potting and encapsulating materials; static-dissipative and glop top materials; dielectric gels; and thermal interface materials (TIMs), which come in grease, adhesive and gel forms.
VISULA 8 features three core areas of improvement: layout, library tools and CAM tools. Layout developments include enhancements to functionality associated with the use of starpoint components, which can now be simply added to a design. Thermal relief on vias has been extended to allow relief at 45-degrees as well as the existing 90-degree setting. Other layout features include allowing the user to display areas of different types using different colors, introduction of a 'necked width violations' report, identification of component pads that violate via keep-out areas supported by batch and interactive checking and the option of coloring trunk* items within the design.
Users can now print using the standard Windows printing dialog in the Databook Designer, in addition to the PostScript printing option. Tabular display option makes adding gate suffixes to elements within the Library Editor much simpler. Search results from the Library Searcher can also be output in CSV format.
Use of CAM tools allows the employment of standard page sizes for printing PDF outputs, and the user can specify the default plot file extension for post-processing output files in their MDF database.
Version 8 is free of charge for all current customers with a maintenance agreement.
TherMoire PS200 lab tool is the result of customer feedback and changing industry needs. The new JEDEC standard for temperature-dependent warpage measurement of packages (JESD22B112) now requires faster heating and cooling rates, and this tool delivers improvements in both. Allows the user to more precisely replicate a temperature profile, while taking real-time flatness measurements. New ergonomic design and better user interface improve ease-of-use.
LineMoire PS16 is a room-temperature flatness measurement system, designed for both QA/QC and high-volume production settings. Capable of both package and PCB flatness measurements. Can measure global and local area warpage with a 1 sec. data acquisition time.
AERIAL L4 is the latest addition to Seica's Pilot line, and is for customers who need to implement test strategies for prototype verification, pre-screen for manufacturing defects,and fault diagnostics after functional maintenance tests.
Being based on the VIVA Integrated Platform (VIP) it integrates the core VIP hardware and software, and is fully compatible with the other Seica test products including the PILOT Flying Probe, STRATEGY In-circuit and VALID Functional testers.
Uses four independent, mobile test probes to carry out tests on both sides of the UUT (two on each side). The vertical board clamping system is said to eliminate vibration of the board under test and allows a compact footprint. Offers a board test area of 24 x 24 in. (610 x 610 mm).
ZESTRON America will showcase its latest Pb-free cleaning services during Apex. The company will also feature recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the conference’s technical sessions, Zestron’s Application Technology Manager, Umut Tosun, will discuss “Cleaning Lead-Free Prior to Conformal Coating? Risks and Implications.” The presentation will take place on Wed., Feb. 8 at 1:30: Quality Reliability and Testing.
Multi-Seals offers a free engineering sample kit of Uni-form epoxy preforms. Includes a variety of epoxy preform configurations along with an information pack. Free evaluation samples in specified dimensions and epoxy systems are also available for specific applications. The preforms are an alternative to liquid epoxy for high-volume epoxy sealing applications.
Preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch ensure uniform results.
Can be dispensed at 200 to 600 parts/min. with little or no operator training. Said to eliminate pot-life concerns and cleanup procedures.
LeadHound RoHS/Pb-Free Verification System will verify Pb-free or leaded components, sub-assemblies, PCBs and other items in as little as 15 sec.
Using micro-focus x-ray fluorescence (XRF), can detect the presence of lead, cadmium, mercury, chromium and bromine, as well as other elements, in a safe working environment and provide the percentage of each element found in a tested item. This enables shops to determine if an item complies with RoHS/WEEE directives or military and avionics specifications.
Can test several items in one session and generate a report for most requirements in 30 sec. Generates a report after each test that can be printed or stored as a file to meet applicable documentation needs.
In addition to testing boards and components, can detect lead in BGA spheres and solder paste in pots.
Can identify which items pass/fail the test and take appropriate action for a facility’s production requirements. In-depth reporting capabilities can tell the percentages or ppm of specified elements in each item.
Runs on a stand-alone, Windows XP-based computer. The x-ray system can be standardized at lunch or dinner breaks midway through production shifts. Power-up automatically initiates a standardization which takes approximately 3 min.
Pentaplex Inc.’s High Energy Pulse Discharge capacitors reportedly set new standards of Low Equivalent Series Inductance and High Pulse Discharge Current. ESLs as low as 5 nanoHenrys and pulse discharge currents of 100,000 Amps have been achieved for a 100 KV 4.0 nanoFarad unit.
This was achieved by combining the oldest known inorganic dielectric, MICA, with a new proprietary manufacturing process based upon Pentaplex’s low-out gassing PCB technology at Fermi National Accelerator Laboratory.
Additional advantages: completely solid-state construction with no sealed containers to rupture or oil to leak. Form-factor is completely flexible; units can be custom made to thicknesses less than 1/2 cm for planar transmission line installation to a standard rectangular form factor to drop-in replace lower performance capacitors.
Temperature rating to 150°C thanks to the inert nature of the specially processed mica dielectric.
Range from 0.1 to100 nF and from 20,000 to 200,000 Volts.
VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape, etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
TSD-100 thermal shock chamber can meet the Mil-Std 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. Overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
Measurer 44” wide, resulting in a 40% smaller footprint than the ETS4-2CW. Overall power consumption (full-load amps) has been reduced by 60%. Have Copeland brand Scroll refrigeration compressors and touch-screen controller mounted on the door.
Has an interior of 28 x 16”.
STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. It adjusts the soak period according to how much product is being tested.
Other features include: a flexible cabling tube (for monitoring or powering samples) that comes out the side, rather than a moving pipe that sticks out the top; a cool-down mode; an option for a window to check on the samples r.
Built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included.