A new ProLINE-RoadRunner in-line programming solution is configured specifically for Siemens X-Series placement machines.
 
Support is designed for the Siemens Flexible Feeder Interface ("FFI").  The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
 
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
 
Mounts directly onto the placement machine, with no additional floor space requirements.
 
Data I/O Corp., www.dataio.com

Concept FX is a multi-axis, x-ray inspection system featuring configuration flexibility with 80/90/130 kV x-ray source options, six axes of motion control, operator-friendly ergonomic design and a no-clamp sample tray for fast load and unload.
 
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
 

Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing. 
 
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
 
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs.  Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
 
Henkel, electronics.henkel.com

Version 2.5 of the Environmental Material Aggregation and Reporting System (EMARS) completely supports the IPC-1752 Material Declarations standard for the RoHS directive.

"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS.  Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."

EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.

Synapsis Technology, synapsistech.com

MicroLine 350Ci laser system offers stress-free depaneling of assembled PCBs. Uses a laser technology featuring higher cutting speeds then mechanical depaneling methods and requires no expensive artwork related tooling.
 
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
 
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
 

Heraeus, 4cmd.com

Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with CSP lead pitches of 0.5 mm and 0.4 mm.  As lead-free manufacturing becomes the norm, the ability to reliably process finer pitched devices within Pb-free parameters will be vital. 
 
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance.  Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
 
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection . 
 
Classified as ROL0 to ANSI/J-STD-004. 
 
Henkel, electronics.henkel.com

 

 

Series 1522 Inflow Dust Containment Cabinets are available in a variety of sizes and styles, with a painted steel finish compatible with typical cleanroom environments. They provide an effective solution for mailroom protection, hazardous materials and biosafety applications.

Feature an acrylic hood for durability and long life, with minimal required maintenance. Custom options are available upon request.

The system draws air into wall-mounted filters where it is filtered and
discharged back into the workspace. The HEPA system consists of two parts:
the absolute HEPA filter and a flexible duct to form a modular component.
HEPA filters meet Mil Standard 282 and are tested for leakage for 99.99% removal of all particulate contaminants greater than 0.3 micron. 

Before the HEPA filter there are two stages of prefiltering, the second of
which can be an optional charcoal filter. The prefilter is made of
disposable, non-woven framed fiberglass media, with a nominal efficiency of
40%.

Clean Air Products, cleanairproducts.com

Articulation LLC, developer of the Reflower prototype SMT reflow oven controller, has released a new software package for managing reflow oven temperature profiles. Reflower PC application allows users to maintain an unlimited number of temperature profiles on their computer's hard disk through a series of tabbed dialogs.  The application also allows the user to control oven through a point and click user interface.

Controls a standard countertop convection oven to perform prototype and small batch surface-mount solder reflowing operations. Can control ovens rated up to 1800W or 15A and comes with a 36" bare junction thermocouple, an RS232 cable for connection to a PC and the Reflower PC application.

Using the TempTell Reflower and the techniques outlined at
http://articulationllc.home.comcast.net/sm0402.htm , SMT is now available to hobbyists and small hardware development shops.
 
Articulation LLC, articulationllc.com

Landrex Technologies introduced two second-generation Optima 7300-series AOI systems at Apex. The Optima II 7301 Express offers the same performance as the  Optima 7300 post-reflow system but at a  lower cost. The Optima II 7310 Extreme provides higher speeds. 
  
 “With the introduction of the low-cost Optima II 7301 Express and the Optima II 7310 Extreme, Landrex is very well positioned to increase our market share,” said Jim Gibson, CEO, Landrex Technologies.  “We now have a cost-effective product for small- to medium-size manufacturers and high-speed AOI for demanding, high-throughput markets like automotive and high-volume Contract Manufacturers. Our strategy is to provide high-performance systems at competitive prices and always be on the leading edge of AOI technology.”
  
 The 7310 Extreme features scanning rates up to 70% faster than the original 7300. This speed improvement results from high-speed cameras, a high-speed computer and high-speed auto-width adjustable staging conveyors. 
  
The 7301 Express is available at about 40% price reduction from the 7300. 
  
Both systems are equipped with new E.0 software, which includes improvements in the graphical user interface and optional barcode reading through the camera and offline programming. Offline programming supports multiple systems from one workstation. E.0 software also supports optional Review Pro™ repair-station software, which speeds defect diagnosis and repair.
  
Landrex Technologies, www.landrex-us.com