Image capture and processing speed is up to 200% faster than previous models with an inspection time of less than 30 sec. for both sides of an 18 x 20” substrate. Is fully automatic, and programming is simple. Has Windows XP user interface, can be linked to the VS Series verification stations.

 
The Christopher Group Inc., christopherweb.com

Tyco Electronics recently upgraded its custom and pre-print label product line. New additions include improved adhesive-backed labels for use in industrial, commercial and consumer product applications. The range of materials, adhesives and printing methods make the custom and pre-print labels suitable for use in aerospace, telecom, datacom, electronics, military hardware, shipboard systems, medical equipment, pharmaceuticals and many other industries.
 
Can be designed by Tyco Electronics or originate from existing customer-specific logos, artwork or brand markings. Color matching, custom shapes and UL & CSA certified materials are available. Tyco Electronics also offers custom data printing for sequential numbering, 2-D data matrix, bar coding and other customization.
 
Offers four major printing technologies for custom and pre-print labels including: Flexography printing for general-purpose, high-volume, six-color printing; hot foil printing, a three-color process for various materials; thermal transfer for serial and barcode printing needs and laser engraving for the highest level of durability.
 
Printing substrates include: white polyester, clear polyester, metalized polyester, white vinyl, nylon cloth, vinyl cloth, polyimide film, polyvinvlfluoride, tamper-evident materials, stainless steel, polyolefin cable markers and heat shrinkable markers & sleeves.
 

ALPHA EF-6100 low-solids wave solder flux is the latest addition to Cookson’s EF-Series environmentally-friendly fluxes designed for Pb-free as well as SnPb processes. The no-clean, alcohol-based flux passes all international reliability standards including IPC, Bellcore and JIS.
 
Leaves minimal colorless, non-tacky, clear  flux residue that spreads uniformly over the surface of PCBs. Provides resistance to connector bridging across a range of process conditions. It is compatible with all common pad finish types and improves yield by reducing defects, minimizing rework and increasing throughput.
 
Cookson Electronics Assembly Materials, cooksonelectronics.com

Servo-Flo 404 System is a compact shot meter and integrated dispense valve for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The positive rod displacement and servo-motor design can dispense abrasive and filled adhesives and sealants such as epoxies, silicones and urethanes.
 
Has a quick-change Tip-Seal dispense valve for accurate start-stop of material flow. Can be mounted to a robot wrist, moving automation or fixed mounted. System design selections include volume size, temperature control, valve selection, vision and system integration.
 
Closed-loop processor provides precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
 

Self-Cleaning Squeegee system was showcased at the IPC Innovative Product Showcase during Apex.  A panel chose 10 products out of 556 entrants.    
 
Both Pb-free and traditional solder paste printing processes exhibit a high degree of solder paste sticking. This produces undesirable affects, such as paste bleeding defects, premature contamination of the stencil surface and requirement for more cleaning interruption.  Process cycle time is affected negatively as the paste requires time to drop off the squeegee after each print stroke. 
 
The Permalex Paste Manager achieves lower overall sticking compared to normal dual squeegees, and the system reduces the migration of solder paste within the print area. 
 
Reportedly offer improved printing in Pb-free environments.  
 
Transition Automation, www.transitionautomation.com

SCS Precisioncoat and Precisioncoat EL spray coating systems precisely spray and dispense a variety of solvent-based, water-based and 100% solids coatings to printed circuit assemblies and other substrates. 
 
The systems are controlled and operated by proprietary SCS software on a Windows XP operating system with a point-and-click interface. The two systems include internal Ethernet connectivity, and they both meet SMEMA conventions for manufacturing system integration.
 
The standard configuration applies coatings on three axes, with optional tilt and rotate capabilities. This enables coating of both simple and complex assemblies, devices and components used in the electronics, military, medical and automotive industries.
Custom configurations are also available, including optional bar code readers, vision systems, offline programming and CAD or Gerber download. The entry-level Precisioncoat EL is offered for those with smaller production runs or less demanding coating needs.
 
Specialty Coating Systems, scscoatings.com

Arlink 8000 modular workstations offer flexibility to accommodate changing or future needs.  Ideal for a variety of applications, such as assembly, computing environments, service, repair, research and technical work, can be assembled and reconfigured quickly.   
 
Arlink workstation products have been integrated into Lista International’s technical workstation offering.
 
Each workstation can be configured in a variety of heights and lengths to suit specific needs.  Available in five standard industry widths and in three different heights up to 84”.  The “starter and adder” system, with the option of back-to-back configurations, enables unlimited layout possibilities to adapt to any space or support any process requirements.
 
Definite Positioning System makes relocating or adjusting worksurfaces, storage, shelving, lights, power beams, footrests, etc. fast, easy and safe. The virtually tool-free assembly process allows the user to make unlimited changes to the workstation with minimal effort or cost. Worksurfaces are available in standard laminate or static dissipative. Available on casters to create mobile workstations or parts carts.
 
Lista International Corp., listaintl.com

nanotom is a high resolution computed tomography x-ray analysis system in a compact package. The 160 kV nanofocus computed tomography system is tailored for the special needs of material science, micro mechanics, electronics and biological applications. 
 
The compact system consists of a granite based CT-construction with a 160 kV high-power nanofocus x-ray tube and a special digital detector to reach a voxel resolution of < 500 nm. The fully digital detector has 5 Megapixel resolution and a measurement range expansion for the highest possible resolution. 
 
Can examine samples with diameters up to 120 mm (4.7”) and a weight up to  1 kg (2.2 pounds). Special door construction and advanced sample fixture permit simple, precise positioning of the samples.
 
Comes with CT-software, datos|x. This software offers easy, intuitive operation and requires minimal training. An available PC cluster further reduces reconstruction times.
 
Suitable for the 3-D examination of sensors, complex mechatronic samples, micro electronic components and material samples in every type like synthetic materials, ceramics, composite materials, rock samples and more.
 
phoenix|x-ray Systems + Services Inc., phoenix-xray.com

EP76M is a two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive. Has a one to one mix ratio by weight or volume. Has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. Thermal conductivity is 8-9 BTU/in/ft²/hr/°F. Readily develops a tensile shear strength of 2,000 psi when measured and cured at room temperature.
 
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
 
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
 
Master Bond Inc.,  www.masterbond.com

A new ProLINE-RoadRunner in-line programming solution is configured specifically for Siemens X-Series placement machines.
 
Support is designed for the Siemens Flexible Feeder Interface ("FFI").  The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
 
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
 
Mounts directly onto the placement machine, with no additional floor space requirements.
 
Data I/O Corp., www.dataio.com

Concept FX is a multi-axis, x-ray inspection system featuring configuration flexibility with 80/90/130 kV x-ray source options, six axes of motion control, operator-friendly ergonomic design and a no-clamp sample tray for fast load and unload.
 
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
 

Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing. 
 
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
 
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs.  Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
 
Henkel, electronics.henkel.com