Chassis Carts are ideal for 19" chassis handling for box build. Offer fully adjustable rails to fit all chassis sizes. Open-top cart design accommodates vacuum lift heads to place chassis in and out of the cart. Also available: ESD Softsurface material on the top, bottom and side of the rails, and front vertical post edges of the cart. This protects the chassis from scratches and dents during handling. The cart can hold up to 1,000 lb.
Kester’s Apex booth will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Featured products include: EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure K100 lead-free bar solder alloy, along with technical services to help manufacturers assemble Pb-free. An interconnecting materials catalog will be debuted.
VectraElite soldering system will make its North American debut at Apex. It expands on the core subsystems of the Vectra wave soldering system. In addition to improved system wide access, a new rollout solder pot design and an advanced control system, it features UltraFill nozzles, upper High Velocity Convection (HVC) preheat module and a ServoJet fluxing system.
The company will also preview its Post Wave Cooling (PWC) module and the Optima ultrasonic spray fluxing system featuring Ultra-Spray technology.
Speedline will also preview new options for its MPM Accela printing system as well as spotlight an array of its MPM printing, Camalot dispensing, and Electrovert soldering and cleaning solutions.
SFX-TAP4/CR is the newest member of ScanflexTAP transceivers, developed for integration in Flying Probe Testers (FPT) offering four parallel independent TAP.
This seventh TAP transceiver can be freely combined with all Scanflex controllers on PCI, PXI, USB or LAN basis, with distances up to five meters. Each TAP offers programmable input and output impedance, stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz, programmable delay compensation, read-back of output signals and a relay controlled power signal. This enables an optimal UUT configuration over distances up to 1.5 m. Feature captive CION interface chips (ASIC) and additional safety measures. Features 32 voltage-programmable dynamic I/O, two analog I/O channels, three statistic I/O and trigger lines.
All TAP signals and PIO channels are galvanically isolated from the UUT, and can be tested for operation directly in the system by means of an integrated Built-In-Test (BIT).
The transceiver has a particular slot for coupling with Scanflex I/O modules; or various SFX I/O modules can be connected via an SFX/LS interface.
Supported by software System Cascon from version 4.2.1 on and is compliant with standards IEEE 1149.1, IEEE 1149.4, IEEE 1149.6, IEEE 1532 and JESD71. The software automatically recognizes the transceiver by the AutoDetect Feature.
Aegis introduces the "MCAD" system to support box and mechanical product documentation, tracking, quality and materials management. Customers may now support any discrete assembly processes—from circuit boards to full system level assembly—in a single information system.
MCAD functionality is inherently incorporated within the Web-centric manufacturing execution system (MES). Shop-floor operators can step through and drill into iView's existing sequential assembly process feature with intelligent cross-reference to the mechanical components.
MES also supports multi-level assemblies and material setup validation at any work station, and these assemblies are now better depicted in the visual aids.
Features include:
·Support for common mechanical CAD vector file formats;
·Simple digitizing for 2-D capture from a 3-D drawing with the desired user-controlled perspective;
·A mechanical Shape Library permits re-use of commonly used items and components;
·A color-coded parts list display for easy cross-referencing to the drawing.
The module is a cost option available in the upcoming 6.1 release; existing customers have been offered this option at no charge.
Enhanced Concept 129 Intelli-Drill includes a companion Database and Search Utility. These tools inspect and measure internal layer movement, then assist in using this information to improve process yields.
Database is loaded by the CNC-7 Controller during panel inspection. Search Utility allows the user to search for data and perform statistical analysis. This data is then fed back to the beginning of the PCB design process to improve production process yields
Wave Surfer is a self-contained measurement system for wave solder machines that provides critical data on wave solder machine setup and its process. As a wave solder machine profile fixture, it has five embedded thermocouples, and works in conjunction with the SlimKIC 2000 for quick and easy profiling and setup.
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure process data including peak temperature, dwell time, parallelism and conveyor speed.
FX-1R High-speed Chip Shooter is equipped with a double head system driven by two independent linear motors. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser. This technology simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time. Placement rate is 27,000 cph (IPC 9850), component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Placement accuracy is ±40µm (3 Sigma).
EnviroMark 907 (EM907) is a no-clean, lead-free solder paste designed for high-yield lead-free manufacturing. Said to offer a long stencil life and Pb-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains print quality at high print speeds — up to 6 in/sec. (150 mm/sec.). Said to have excellent cold and hot slump behavior to prevent bridges and solder ball formation.
Reportedly has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features high levels of solderability to a wide array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, comparable to 63/37, even in air reflow. The paste leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites, has printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Vertical PC Board Cart is available in a variety of standard sizes, and is infinitely adjustable. Offers custom slotted, ESD-safe plastic panels on the shelves to protect the edges of PCBs and the sheet metal panels attached to high-end PCBs. Feature a “fish mouth” entrance to the slot to make it easy for the operator to slide PCBs into the shelf. Available for single-sided or double-sided applications. Hundreds of PCBs can be stored in the cart; fully enclosed models are available.
Glenbrook Technologies offers real-time x-ray systems with x-ray microscope technology to meet the demands of both production and laboratory environments for PCB and BGA inspection. RTX series for production monitoring, and the Jewel Box series for process development and failure analysis, help reduce manufacturing costs and feature compact designs. RTX series provides rapid, reliable in-process inspection at high volumes for PCBs with advanced components such as BGAs, micro BGAs and flip chips. Compact size, light weight and wheeled design make it easy to move and position in tight quarters. To support advanced research, process development and failure analysis in the laboratory, Jewel Box series offers high magnification, with continuous zoom from 7x to 2000x. Micro-focus x-ray tubes provide ultra-high resolution and detail. A five-axis positioner allows x-ray imaging from any angle. Glenbrook Technologies, glenbrooktech.com
PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.
Four different optional finishes available for 8 x 10" boards: OSP, ImSn, ImAg and ENIG.
Each test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions and user manual.