Products
Rohm and Haas Electronic Materials is exhibiting at Productronica in Munich, November 15 – 18, in Hall B4, Stand 205.
The company will present new processes for both the printed circuit, packaging and finishing markets.
Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process.
The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium.
In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF.
The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask.
The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
The company will present new processes for both the printed circuit, packaging and finishing markets.
Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process.
The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium.
In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF.
The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask.
The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
Rohm and Haas, rohmhaas.com
IMPACT T22 is an intelligent camera designed as a drop-in replacement for obsolete or underpowered vision systems. An extension to the T-series, the image processing computer is contained inside the camera, enabling it to be deployed without additional image processing hardware.
Has ½-inch CCD, is interchangeable with older, camera-based vision systems, enabling manufacturers to upgrade older vision engines to achieve real-time inspection while reusing existing optical and lighting components. Suitable for analog and digital systems.
PPT VISION, pptvision.com
Has ½-inch CCD, is interchangeable with older, camera-based vision systems, enabling manufacturers to upgrade older vision engines to achieve real-time inspection while reusing existing optical and lighting components. Suitable for analog and digital systems.
PPT VISION, pptvision.com
The OptiCon series AOI platform can inspect components on PCBs with an angled view by using a newly developed optics module. Can execute inspections in 45° angle from four directions. Uses telecentric imaging and high resolution.
The modular AOI platform enables individual configuration of OptiCon systems. Typical applications for Quattro angled view are the evaluation of hard to see solder joints and components (e.g. at J-lead pins of PLCC and SOJ models or SMT connectors) but major gains will be in next-generation components such as OFNs.
GÖPEL electronic, goepel.com
The modular AOI platform enables individual configuration of OptiCon systems. Typical applications for Quattro angled view are the evaluation of hard to see solder joints and components (e.g. at J-lead pins of PLCC and SOJ models or SMT connectors) but major gains will be in next-generation components such as OFNs.
GÖPEL electronic, goepel.com
HARRISBURG, PA -- Tyco Electronics has introduced a low profile, single connector, microminiature RF interconnect to meet the demand for direct board-to-board connections.
Available in three different lengths for board spacing of 6.65, 10 and 14 mm, and is supplied in trays for easy pick-and-place compatibility. Has an operating temperature range of –40 to +125°C, impedance of 50 Ohms and can operate effectively at frequencies up to 6 GHz. Return loss is specified as a minimum –20 dB at frequencies up to 2.1 GHz. Tolerance against axial misalignments from the nominal board stacking height is ±1.0 mm for the 10 and 14 mm versions, and ±0.3 mm for the 6.65 mm version. Tolerance against radial misalignment is ±0.8 mm from centerline, in any direction, for all three versions. Target pads can be tin plated, or a gold-plated disc can be applied to the mating PCB.
Tyco Electronics, tycoelectronics.com
Traditionally, board-to-board RF connections have been achieved with either two cable connectors or two board connectors with a third, spacer or bullet, between. Compression Coax Board-to-Board Blindmate product eliminates the need for multiple connectors – and their added cost – by offering a single connector assembly with spring-loaded contact. One side is soldered on the base circuit board surface and the other side mates directly on the opposite target board using applied spring pressure. One piece design offers an easy connection with large radial and axial misalignment, and eliminates the risk of breaking soldered connections when mating or un-mating.
Available in three different lengths for board spacing of 6.65, 10 and 14 mm, and is supplied in trays for easy pick-and-place compatibility. Has an operating temperature range of –40 to +125°C, impedance of 50 Ohms and can operate effectively at frequencies up to 6 GHz. Return loss is specified as a minimum –20 dB at frequencies up to 2.1 GHz. Tolerance against axial misalignments from the nominal board stacking height is ±1.0 mm for the 10 and 14 mm versions, and ±0.3 mm for the 6.65 mm version. Tolerance against radial misalignment is ±0.8 mm from centerline, in any direction, for all three versions. Target pads can be tin plated, or a gold-plated disc can be applied to the mating PCB.
Tyco Electronics, tycoelectronics.com
Viscom’s high-speed S6056 AOI system will debut during Productronica in November. The system features parallel inspection of two PCBS with a double-track system.
Uses 4M sensor technology and EasyPro operating environment.
Three different inspection concepts can be implemented, depending on the customers requirements. In addition to selective inspection using single or double-tracks, it also offers parallel inspection to meet very high throughput rate requirements.
System configuration is fitted with a double-track and two sensor modules, permitting simultaneous inspection of two PCBs per transport lane. Has no size limitations on PCBs up to 457 x 355 mm. Integrated shuttle is available for the twin-track, on the input or output side, obviating the need for external switching points for single-line production.
Has integrated switchgear cabinet with a hinged frame for ease of maintenance.
Is lead-free capable – as ensured by algorithm rules-based analysis, which is capable of obtaining optimum results under even highly varying contrast conditions.
Viscom, viscom.de
Productronica, Hall A2, Stand 475
Uses 4M sensor technology and EasyPro operating environment.
Three different inspection concepts can be implemented, depending on the customers requirements. In addition to selective inspection using single or double-tracks, it also offers parallel inspection to meet very high throughput rate requirements.
System configuration is fitted with a double-track and two sensor modules, permitting simultaneous inspection of two PCBs per transport lane. Has no size limitations on PCBs up to 457 x 355 mm. Integrated shuttle is available for the twin-track, on the input or output side, obviating the need for external switching points for single-line production.
Has integrated switchgear cabinet with a hinged frame for ease of maintenance.
Is lead-free capable – as ensured by algorithm rules-based analysis, which is capable of obtaining optimum results under even highly varying contrast conditions.
Viscom, viscom.de
Productronica, Hall A2, Stand 475
Thermo Electron’s NITON Analyzers business unit has released a new version of software for its NITON XLt 797 portable XRF (x-ray fluorescence) analyzer. Version 4.4, enables users to establish thresholds for rapid screening of solder bars, circuit boards and their components, then displays pass or fail symbols for each regulated element.
Whether manufacturers are segregating Pb and Pb-free stock, performing due diligence testing to verify supplier certifications or controlling solder chemistry as part of process quality control, the analyzer and software allows companies to employ non-technical personnel for these critical tasks. Easy-to-use data entry includes a virtual keyboard and integrated barcode scanner.
Capable of storing more than 3000 legally defensible measurements for later download. All readings are encrypted to prevent accidental or intentional tampering with the analytical result, yet may be easily incorporated into database or spreadsheet packages for reference to the company’s manufacturing and/or quality control systems.
Whether manufacturers are segregating Pb and Pb-free stock, performing due diligence testing to verify supplier certifications or controlling solder chemistry as part of process quality control, the analyzer and software allows companies to employ non-technical personnel for these critical tasks. Easy-to-use data entry includes a virtual keyboard and integrated barcode scanner.
Capable of storing more than 3000 legally defensible measurements for later download. All readings are encrypted to prevent accidental or intentional tampering with the analytical result, yet may be easily incorporated into database or spreadsheet packages for reference to the company’s manufacturing and/or quality control systems.
Thermo Electron, www.thermo.com/elemental
Microscan’s miniature mega pixel imager Quadrus MINI high-resolution imager offers true auto-focus for industrial product identification. It will be introduced at ATExpo, September 27 – 29, in Booth 5729.
In the past, to achieve adjustable focus in changing applications, the imager’s hardware had to be physically calibrated for each new symbol distance. When using the MINI, all the operator needs to do is plug it in.
“The MINI imager performs much like an off the shelf digital camera,” said Microscan president Dennis Kaill. “You point it at the object of interest, in this case the symbol, and push the EZ button. It automatically focuses on the symbol and sets the exposure time, gain and illumination intensity. ”
Designed for demanding, high performance applications in electronics manufacturing, it reads both linear bar codes and 2-D codes such as Data Matrix directly marked on boards and components. Ultra compact size (1.8” x 2.10” x 1”, weight less than 2 ounces) and high resolution optics provide a wide scan window.
Featuring a mega pixel sensor with an extra wide field of view and proprietary algorithms, reads long bar codes omni-directionally and high density 2-D symbols. Has auto-focus, EZ button setup and green flash good read indicator. Customizable data output and Windows’ based interface allows integration into existing platforms with minimal programming.
Microscan, microscan.com
In the past, to achieve adjustable focus in changing applications, the imager’s hardware had to be physically calibrated for each new symbol distance. When using the MINI, all the operator needs to do is plug it in.
“The MINI imager performs much like an off the shelf digital camera,” said Microscan president Dennis Kaill. “You point it at the object of interest, in this case the symbol, and push the EZ button. It automatically focuses on the symbol and sets the exposure time, gain and illumination intensity. ”
Designed for demanding, high performance applications in electronics manufacturing, it reads both linear bar codes and 2-D codes such as Data Matrix directly marked on boards and components. Ultra compact size (1.8” x 2.10” x 1”, weight less than 2 ounces) and high resolution optics provide a wide scan window.
Featuring a mega pixel sensor with an extra wide field of view and proprietary algorithms, reads long bar codes omni-directionally and high density 2-D symbols. Has auto-focus, EZ button setup and green flash good read indicator. Customizable data output and Windows’ based interface allows integration into existing platforms with minimal programming.
Microscan, microscan.com
STOCKHOLM, SWEDEN – At Productronica booth A5:337, MYDATA automation will unveil the MY500 stencil-free printer.
The machine uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/sec. (1.8 million dots/h).
Because it needs no stencils, operators can change the print program in a matter of seconds and can control the volume of solder paste deposits for each pad.
Other benefits to stencil-free production include:
• No waiting for stencils to arrive from manufacturers
• No stencil production costs
• No hazardous solvents to clean stencils
• Instant control over paste volumes on pads
• Flexible programming possibilities
• Reduction of errors associated with screen printers
• Lower consumption of solder paste.
The machine uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/sec. (1.8 million dots/h).
Because it needs no stencils, operators can change the print program in a matter of seconds and can control the volume of solder paste deposits for each pad.
Other benefits to stencil-free production include:
• No waiting for stencils to arrive from manufacturers
• No stencil production costs
• No hazardous solvents to clean stencils
• Instant control over paste volumes on pads
• Flexible programming possibilities
• Reduction of errors associated with screen printers
• Lower consumption of solder paste.
To develop the jet printing technology, the company teamed up with solder paste suppliers such as NIHON ALMIT Co. and Senju Metal Industry Co.
ASHBURN, VA – Zestron America will showcase its latest lead-free cleaning process solutions at booth 5609 during ATExpo from Sept. 27-29 in Rosemont, IL. The company will also feature its recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
DEK will launch the VectorGuard Nickel Laser Cut stencil range at ATExpo on Sept. 27-29. The event will include DEK’s high accuracy mass imaging solutions in booth 5400.
The stencils are designed to address the challenges presented by lead-free, accommodating the effects of changing paste rheology on aperture release characteristics. Said to deliver a high level of paste volume repeatability to optimize process yield and uniformity.
DEK representatives will provide lead-free advice to delegates wanting to learn more. Clive Ashmore, global applied process engineering group manager at DEK, will also be presenting a lead-free paper - Mass Imaging of Lead-Free Material.
DEK, dek.com
Haverhill, MA – Ultrasonic Systems’ Optima Fluxing System has an Ultra-Spray head that produces a more vertical spray pattern, ensuring through-hole penetration on the wide, thick circuit boards.
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
FRANKLIN, MA – Speedline Technologies will showcase MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo booth 5710.
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
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