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BP Win 4.58 offers support for very small package (VSP) devices. 

Offered exclusively on BP Win Automated Programming Systems, support for VSP devices currently includes MSOP8, TSOC6, and the smallest device, SOT23, with dimensions of 1.63 x 2.95 mm. Other VSP devices may be supported by entering a device request through BP Micro’s web page.
 
Modifications to the software allowed the use of the existing CyberOptics laser alignment vision system to accurately pick and place VSP devices without degradations to system throughput. 
 
BP Microsystems, bpmicro.com

Today’s highly flexible, fast SMT placement machines are designed for just-in-time manufacturing; they can run multiple jobs at once, have 300 or more ‘smart’ feeders loaded at any time with the entire range of components from 0201s up to 55 x 55 mm at high speeds. As feeders index components for pick up and placement, repeatable accuracy is critical. CeTaQ announces the availability of a machine Capability Analysis (MCA) service that verifies feeder and shuttle motion repeatability.
 
Michael Sivigny, general manager, said, “One of the consequences of the move to lead-free assembly is less tolerance for even slight variations in placement accuracy. Components do not self-center as easily during reflow with lead-free solders. Consequently, placement accuracy is more important than ever. While there are other aspects of pick and place machine accuracy addressed by our services, this approach specifically addresses issues with feeders. Our feeder calibration service is critical to ensure repeatability of pick location, feeder indexing, component location, and sprocket repeatability. This is of particular importance for handling components such as tiny 0201 and 01005 chips.”
 
CeTaQ’s service involves the use of a ‘smart’ camera that works in conjunction with its mobile metrology system. Additionally, the service dovetails with a feeder maintenance program designed to ensure continued accuracy once feeder accuracy and repeatability issues have been corrected. The service and methodology can also be applied to die feeders and picked die from cutting.
 
CeTaQ Americas, cetaq-americas.com

TREK StandAlone Wash Module is a SMEMA compatible module that can interface with any existing conveyorized inline washer, regardless of manufacturer.
 
The module provides chemistry cleaning capability to an existing cleaner that may not support a chemical wash process, or may have poor chemical isolation. Ideal for manufacturers faced with conversion to Pb-free soldering processes where chemistry cleaning is required, but not supported by the current washer.
 
Provides a heated recirculated spray wash in addition to chemical isolation, turning any
washer into a chemistry compatible cleaning system. Can be optioned with Liquid Lock technology, which reportedly reduces consumption of cleaning solution and power. By sealing the wash zone with an entry and exit laminar flow of fluid, it traps the atomized spray in the wash chamber, essentially eliminating atomized spray mist exhaust.
 
Options include: presoak stage, filtration, automatic chemical injection, top belt and various levels of spray pump performance packages.
 
Stoelting, stoelting.com
CAM350  Release 9.1 is the latest version of the software for the verification and optimization of PCBs. Streams Rule Check is now included at no additional charge in the mid-level CAM-350 configurations. The release also enhances the interfaces to major CAD systems including Mentor, Cadence and AutoCAD.
 
Streams Rule Check allows Design Rule checks, Design for Manufacturing checks and Netlist Comparison checks to be run simultaneously (or all in one “stream”), shortening the time it takes to analyze a design. It also allows a designer to save the stream based on technology, manufacturing capabilities or other requirements and recall it for use on future designs. The company will also deliver this functionality to customers under maintenance.
 
Other enhancements include: DFF analysis checks; interface updates; soldermask analysis enhancements; enhancements to minimum space and minimum width analyses; Latium updates; full screen mode; and defect fixes
 
DownStream Technologies, downstreamtech.com
CP0402 family of High Directivity LGA Termination Couplers provides high frequency performance and rugged construction for reliable automatic assembly. This miniature component is ideal for mobile communications, satellite TV receivers, GPS, vehicle location systems and wireless LANs.
 
The low-profile couplers, in frequencies from 400 MHz to 6 GHz, feature 3W continuous power dissipation, low insertion loss and high directivity (>20db). Available in Pb-free versions, with the parts providing excellent solderability and self-alignment during reflow.  
 
AVX Corp., avx.com
The Solderite product line has been developed for hand soldering stations and reportedly provides a cost effective solution to Pb-free solder implementation.
 
Addresses RoHS Compliance by providing substantial changes in the design of the soldering station. The three foremost properties of any soldering station are: Power, Temperature Control and Soldering Tip. The patented technology and design of the power supply and temperature sensing in these new products reportedly produce the fastest temperature recovery time on the market. Electroplated soldering tips ensure quality soldering and extended tip life.
 
Soldering stations underwent strict testing from lab, contract manufacturing and Pb-free soldering training centers. The tip life has averaged a two-to-one rate compared to standard soldering tips. Tip replacement cost did not exceed the cost of standard soldering tips.

 
Technology Asset Services, solderite.com
Crossbow connector platform features Crossbow Matrix for orthogonal midplane architectures and Crossbow 2mm+ for standard backplane configurations. The differential connector is optimized for orthogonal midplane configurations, and enables data rates up to 25 Gb/s.

 
The connector is designed so the differential pairs on each side of the midplane share vias. This direct path approach and the connector's footprint eliminates most electrical problems associated with the traditional backplane via stub, including elimination of cross-talk in the footprint, reflections and impedance mismatches. Said to reduce board layer count by as much as 50% and eliminate the need for backdrilling.

 
Exhibits less than 0.6% crosstalk at 50 ps and 25 db below transmission across the entire link (past 10GHz). It also demonstrates 100+/- 5% ohms matched impedance across a full link and includes features that compensate for skew.

 
The 2mm+ connector supports 12.5 Gb/s data rates in a high-density (63 pair/in) configuration. Demonstrates crosstalk less than 1.5% at 50 ps and is designed to complement Crossbow Matrix. Both versions fit on the same rear organizing stiffener, allowing designers to configure a single connector to support orthogonal midplane connections and route high-speed signal lines across the backplane in hybrid architectures.

 
Incorporates the GbX (R) 0.018" compliant pin and mating interface to ensure mechanical robustness. Both connectors include unique features on the backplane modules that reduce the potential for bent pins.

 
The Matrix platform includes a 6 x 6 (differential pairs) and 4 x 4 version. The 2mm+ features five differential pairs per column. Both connectors include power and guidance.

 
Amphenol TCS

ASYS introduced a laser marking island during Apex. The island consists of a Board Destacker, Laser Marker, an optional Flip Station and a Restacker. Can handle a throughput of up to 510 PCBs per hour including code verification. The optional Flip Station, which is completely controlled by the laser marker, can flip the boards for double-sided marking requirements. The marker can handle all industry standard 1-D and 2-D codes, text and graphics in a maximum range of 18 x 18”. The island is less than 8.5 feet long and can be upgraded with multiple options.

ASYS Automation, asys-llc.com
The Christopher Group has introduced the DaiNippon Screen (Kyoto, Japan) FP 8000 final visual inspection system. Using DaiNippon Screen’s advanced color imaging system, it inspects both sides of the substrate automatically for surface defects including scratches, chips, exposed metal surfaces, discoloration, solder mask on pads, and other surface defects. Can inspect gold, copper, solder mask and legend ink, as well as the underlying patterns. Substrates with multiple surface finishes can also be inspected.

 
Image capture and processing speed is up to 200% faster than previous models with an inspection time of less than 30 sec. for both sides of an 18 x 20” substrate. Is fully automatic, and programming is simple. Has Windows XP user interface, can be linked to the VS Series verification stations.

 
The Christopher Group Inc., christopherweb.com
Tyco Electronics recently upgraded its custom and pre-print label product line. New additions include improved adhesive-backed labels for use in industrial, commercial and consumer product applications. The range of materials, adhesives and printing methods make the custom and pre-print labels suitable for use in aerospace, telecom, datacom, electronics, military hardware, shipboard systems, medical equipment, pharmaceuticals and many other industries.
 
Can be designed by Tyco Electronics or originate from existing customer-specific logos, artwork or brand markings. Color matching, custom shapes and UL & CSA certified materials are available. Tyco Electronics also offers custom data printing for sequential numbering, 2-D data matrix, bar coding and other customization.
 
Offers four major printing technologies for custom and pre-print labels including: Flexography printing for general-purpose, high-volume, six-color printing; hot foil printing, a three-color process for various materials; thermal transfer for serial and barcode printing needs and laser engraving for the highest level of durability.
 
Printing substrates include: white polyester, clear polyester, metalized polyester, white vinyl, nylon cloth, vinyl cloth, polyimide film, polyvinvlfluoride, tamper-evident materials, stainless steel, polyolefin cable markers and heat shrinkable markers & sleeves.
 
Tyco Electronics, www.tycoelectronics.com

ALPHA EF-6100 low-solids wave solder flux is the latest addition to Cookson’s EF-Series environmentally-friendly fluxes designed for Pb-free as well as SnPb processes. The no-clean, alcohol-based flux passes all international reliability standards including IPC, Bellcore and JIS.
 
Leaves minimal colorless, non-tacky, clear  flux residue that spreads uniformly over the surface of PCBs. Provides resistance to connector bridging across a range of process conditions. It is compatible with all common pad finish types and improves yield by reducing defects, minimizing rework and increasing throughput.
 
Cookson Electronics Assembly Materials, cooksonelectronics.com
Servo-Flo 404 System is a compact shot meter and integrated dispense valve for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The positive rod displacement and servo-motor design can dispense abrasive and filled adhesives and sealants such as epoxies, silicones and urethanes.
 
Has a quick-change Tip-Seal dispense valve for accurate start-stop of material flow. Can be mounted to a robot wrist, moving automation or fixed mounted. System design selections include volume size, temperature control, valve selection, vision and system integration.
 
Closed-loop processor provides precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and material volume and the automation selects stored flow-rate and shot-volume programs for different parts.
 
Sealant Equipment & Engineering, sealantequipment.com

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