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AMS 2.0 Advanced Manufacturing Suite recognizes that fast, error-free NPI, minimization of changeovers and labor costs, and logistical efficiency demand that the component placement function is integrated into the overall production environment.  Focuses on maximizing the performance of Assembléon machines and providing connectivity to other machines and software in the factory. 

Moves many production preparation functions off-line, assures error-free set-ups and eliminates bottlenecks and component starvation.

Rapid NPI is achieved by decoupling preparation tasks from board production through off-line implementation of operations such as creation of vision files and data preparation, electrical verification of R, C and L values, and checking of the barcodes on reels. Provides a central database for programs and vision files.

Has production scheduling and line optimization functionality. Generates placement programs and feeder set-ups for every machine in the production line. A feeder viewer enables analysis and allows dynamic re-assignment of feeders.

Has off-line and on-line verification of set-ups, with an optional CLi interface using RFID technology for automatic set-up verification.  Provides line control and data transfer with all machines in the line, with functionality including production line start/stop, upload/download of programs and component database information to the line, MIS data download and line warm-up. Can enable remote line monitoring and operation.

Data from set-up verification supports logistics by monitoring component usage and tracking inventory, issuing an alert on potential shortages to avert component starvation. Timely information to the operator indicates how many boards can still be produced or how many production hours remain with the available on-machine component inventory. The component tracking software also forms the foundation for the lot traceability system, which tracks complete production details on a real-time basis for possible future product recalls.

User interface matches the Assembléon machine user interface.

Assembléon, assembleon.com

Threaded PEM ReelFast SMT spacers/nuts are available in more thread sizes to satisfy a range of application requirements. The fasteners are suited to space or stack PCBs or (as nuts) to mount boards or attach components. They install on PC boards in the same manner and at the same time as other surface-mount components prior to the automated reflow solder process.
 
Said to reduce the risk of damage to boards (and resulting scrap) that may occur when improperly installing fasteners with off-line equipment; reduce handling of loose parts; and speed assembly by eliminating secondary operations.
 
Threaded types are offered in sizes #2-56 through #8-32 and M2 through M4; thru-hole (non-threaded) types are available in sizes .116”, .143”, 3.6 mm and 4.2 mm. Lengths range from .065 to .375” and 2 to 10 mm. All types can be installed in boards as thin as .060” and all are RoHS compliant.
 
Tape-and-reel packaging for their automated installation conforms with industry standards and preferences for other surface-mount components.  Each reel carries up to 1,500 parts, depending on fastener size.  Fasteners are supplied with Kapton patch for vacuum pickup.
 
PennEngineering, pemnet.com
 
Feinfocus and Xradia announce a new  3-D x-ray inspection technology for the semiconductor packaging and medical device industries.
 
The microXCT defect detection system uses non-destructive 3-D tomography to view the complete structure of advanced packages. Unlike conventional x-ray imaging systems that lose resolution during tomography, this system scans packages in 3-D at full resolution. Multiple resolution modes allow users to switch from navigation at 30µm to high-resolution defect localization and characterization at 1 µm. Automated 3-D tomography features virtual cross-section capability, eliminating the need for sample preparation. Can image and construct a high-resolution 3-D Volumetric dataset with up to 1000 cross-sectional slices in 15min. Has a compact design.
 
FEINFOCUS, .ch
LDC LDC-319 Micro-Probe is a micro size radiometric detector developed for medical and photobiological applications as well as general radiometry.
 
Mmeasures 2.5 x 2.5 x 20 mm, enabling it to operate in remote limited space applications.
In combination with a single or multi-channel optometer, irradiance from 1 nanowatt/cm² to 3 watts/cm² (limited exposures) over a 250 to 1100 nm spectral range can be measured and monitored.
 
Stainless steel housing makes it suitable for medical use; includes a 2.3 x 5 mm RADIN diffuser for cosine corrected measurements.
 
Certification of absolute calibration in watts/cm² at any or all wavelengths between 250 to 1100nm including relative spectral responsivity plot, is supplied for each detector.
 
Gigahertz Optik Inc., gigahertz-optik.com

OmniFlex 10 Reflow Oven is designed to optimize operating efficiencies, reduce maintenance intervals, and lower life-cycle costs.  Said to feature advanced heating and cooling transfer technologies, energy efficient design concepts and reduced maintenance requirements. Up to 50% less power and 35% less nitrogen is required than comparable platforms– due to new designs and features including standard, variable-speed closed-loop blower control, power limiting, balanced gas flow and a dual chamber heating design.
 
Process Width: 508 mm (20"); Heated Length: 3810 mm (148"); Cooling Length: 1285 mm (50.5"); and Maximum Operating Temperature: 350°C (662°F).
 
Electrovert VectraElite wave soldering system features a host of improvements. 
Combines UltraFill nozzles and the upper High Velocity Convection pre-heat (HVC) module.  The ServoJet spray fluxer is coupled with the Performa and Opti-Flux II.  Has a new roll-out solder pot design, and additional enhancements.
 
Speedline Technologies,speedlinetech.com
The μCT-FOX 2D/3D x-ray inspection system now offers hardware-based modular high-end volumetric isotropic rendering. Combines high-resolution 2-D x-ray technology with 3-D computed tomography techniques for inspection and analysis of complex electronic devices. Using dedicated hardware processors, the added hardware and software capability enhances defect detection, ideal for complex electromechanical component inspection applications.
 
A hardware and software based CT solution represents the next-generation of CT user interface. Has improved volumetric isotropic rendering, volumes can be produced that reveal the depth value required for a full 3-D analysis. Modular CT package can gather data sets from 2-D x-ray inspection systems and process them through a CT reconstruction engine. The resulting high-resolution CT images can be instantaneously uploaded to the internet, in real-time, using proprietary iView technology developed by TeraRecon. This feature allows F/A service labs to transmit CT imagery instantly using a secure internet connection. The software is integrated into Feinfocus GUI version 2.2, allowing users to save digital images in JPG, TIF, or BMP formats.
 
 
FEINFOCUS, comet.ch

Version 5.0 of CXInsight for Electronics is a powerful project content management system that allows internal and external collaboration between project members across OEM and manufacturing sites. The release delivers functionality for flexible server-to-server connectivity across the electronics supply chain, based upon a peer-to-peer structure.
 
With server-to-server connectivity and appropriate authorisation, server owners can connect to other servers and work with their own fixed clients on all linked servers across different projects and through different firewalls. This allows partners to access data, track changes and perform required tasks while maintaining data integrity. A ‘two phase commit’ protocol ensures that data is intact and correct at all times, at all locations.
 
Jan Keijzer, managing director, said, “For true freedom in supply chain collaboration, server-to-server connectivity allows for multiple connections between the ‘owner’ of the data and all its external partners – in a secure and controlled environment, without compromise to rights control and management. It also allows customers to establish new collaborations with ease and flexibility, unlike in a client-server configuration. Since the launch of CXInsight, we are making good business in the OEM sector, where this added functionality is certainly required.”
 
 
Adeon Technologies, cxinsight.com
JTAG chain debugger helps reduce debug and test times for engineers designing and testing complex PCBs. Features a range of debug options which allow designers to trace signals around the board and immediately find the location of any problems within the JTAG chain. Engineers can get boards up and running quickly, rapidly diagnose faults and speed up the development process.
 
“With the addition of the chain debugger to the XJTAG system, engineers now have an ‘out-of-the-box’ solution for debugging and testing boards populated with JTAG devices,” said Dominic Plunkett, CTO. “Design engineers can now debug and test their printed circuits in hours as opposed to days/weeks with other competitive systems.”
 
In addition to the chain debugger, the XJTAG Development System has other new features to speed up board design and prototype testing. The connection test now includes built-in testing of pull-up and pull-down resistors, along with more precise fault detection. Within XJAnalyser, BSDL file auto-detection has been improved and the library of reusable JTAG scripts has been expanded. It is quicker to set up non-JTAG devices following enhancements to the Devscript utility for XJEase.
 
The Development System meets the need for testing tightly-packed PCBs populated with BG) and chip scale devices, which cannot be tested by traditional methods.
 
Designed to cut the cost and shorten the development cycle of electronic products, can test JTAG or non-JTAG devices. Can test a high proportion of a circuit including BGA and chip scale devices, SDRAMs, Ethernet controllers, video interfaces, Flash memories, FPGAs, microprocessors and other devices. Enables In-System Programming of FPGAs, CPLDs  and Flash memories.
 
XJTAG, xjtag.com
Data I/O announced support for the Renesas R8C/11 “Tiny” series of microcontrollers beginning with support for the R5F211 on Data I/O’s FlashCore programming systems. 
 
The FlashCore family includes the FlashPAK desktop programmer, the ProLine RoadRunner for inline automated handling and programming (attaching directly to the SMT feeder) and the PS offline automated handler and programming systems.
 
The  microcontrollers are targeted at multiple applications including automotive products, consumer products, PC/networking and industrial environments.  Based on the M16C architecture, the series is small in size but optimized for embedded systems applications.

 
Renesas Technology Corp., renesas.com
 
Data I/O Corp.,  dataio.com
High Energy Pulse Discharge capacitors reportedly set new standards of low equivalent series inductance and high pulse discharge current.  ESLs of 5 nanoHenrys  and pulse discharge currents of 100,000 Amps have been achieved for a 100 KV 4.0 nanoFarad unit. 
The capacitors combine the oldest known inorganic dielectric, MICA, with a proprietary manufacturing process based on low-out gassing PCB technology used at Fermi National Accelerator Laboratory.

Advantages include completely solid-state construction with no sealed containers to rupture or oil to leak. Form-factor is completely flexible; units can be custom made to thicknesses less than 1/2 cm for planar transmission line installation to a standard rectangular form factor to drop-in replace lower performance capacitors.  Temperature rating is 150°C.
 
Available ranging from 0.1 to 100 nF and from 20,000 to 200,000 Volts. 

Pentaplex Inc., pentaplexinc.com
RVI58 Series Incremental Rotary Encoders provide incremental measurement outputs up to 10,000 ppr and an IP65-rated 58 mm diameter aluminum housing. Said to be good for harsh application environments requiring extremely high accuracy.
 
The series comes standard with a shielded cable or round connector, and features quadrature and index outputs or quadrature and index plus complementary outputs. Also features a servo or clamping flange, 6 mm or 10 mm diameter shaft, alarm output and 10-30 VDC or 5 VDC power capability.
 
Pepperl+Fuchs, am.pepperl-fuchs.com

Point of Use Ionizing Blower Model 6422/6422e is a small-footprint ionizer for semiconductor assembly and test processes including die preparation, bonding, molding and other robotic tool, final assembly applications. Features an operational failure alarm and a Facility Monitoring System (FMS) interface connection (model 6422e).
 
Both models feature steady-state DC ion emission for a high degree of air ion delivery sophistication with low ion recombination rates. The blower also features patented IsoStat balancing technology, so the ionizer never needs calibration and always stays in balance.
 
Powered by 24 VAC line power or 24 VDC tool power. A specialized mounting bracket allows installation into tight spaces for increased versatility.
 
Ion,  ion.com

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