Highlighted systems at booth 2C01 include:

Camalot inline liquid dispensing system for low-to-medium production requirements. Ideal for SMT and hybrid applications, including glob top, solder paste, corner bond, gasketing and glue dotting functions.  Features fast, accurate dispensing, up to 13,000 dots per hour; reliable construction with welded steel frame and cast aluminum gantry supports; and Camalot pump technology for process control.

Uses lead screws and servo motors (with closed-loop encoders) on all three axes to assure smooth, precise and accurate dispensing with an enhanced GUI.

With a 0.9 x 0.9 m footprint, and dispensing area of 254 x 254 mm. Options include a touch-probe z-axis sensor, hot plate and auto needle calibrator.

MPM AccuFlex stencil printer, for moderate-volume, high-mix printing, combines accuracy and flexibility in a compact footprint. Offers a range of options for future expansion. Designed for production of about 8,000 boards per week with two or more product changeovers per shift, handles boards from 3 x 2" to 23 x 20" and can print 12-mil pitch devices with consistent accuracy. 

MPM Gel-Flex Tooling System supports the circuit board during stencil printing. Consists of non-conductive polyurethane elastomer gel enclosed in a durable membrane shell and mounted to a magnetic base. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000 and UltraFlex BBP printers.

For local information contact Wei Feng, business manager, China:weifeng@speedlinetech.com.                                                       

Speedline Technologies Asia Pte Ltd., speedlinetech.com                                  

 

The latest upgrade to the VISULA PCB design environment reportedly enables users to integrate with the firm’s high-speed design solution, CR-5000 Lightning. Users can now take advantage of CR-5000 Lightning’s high-speed routing and simulation technology to explore different design scenarios and signal integrity trade-offs.
 

Zurich, Switzerland -- DEK has developed a high-throughput backside wafer coating process, which is hosted on a mass imaging platform capable of exceeding the +/- 12.5 um total thickness variation (TTV) required by most wafer processing specialists. The process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50 m thickness to the backside of semiconductor wafers prior to singulation.

“For any backside wafer coating process, TTV is the critical success factor,” said Clive Ashmore, global applied process engineering group manager. “With this latest application advancement, we are helping semiconductor packaging manufacturers increase throughput and reduce the cost per package by using high accuracy mass imaging.”

According to the company, the use of an optional wafer handler, flexible printing platform and reflow oven achieves more flexibility than dedicated backside coating machines. The system can be re-deployed for other processing requirements.

The backside wafer coating process is compatible with the company’s metal stencil and emulsion screen technologies. Metal stencils enable materials with larger filler particles, such as encapsulation materials, to be applied with a totally smooth surface finish. Mesh stencils allow other materials such as thermoplastic adhesives to be deposited accurately and at high speed. In each case, the capabilities of the machine and stencil technology are key to achieving control over the print thickness and ensuring uniformity at high volumes.

DEK, dek.com

Launched at the Semicon Europa show in April, two of the LDS3300 C models have already been delivered to the North American fab of a major semiconductor manufacturer. Additonal installations for this client are expected soon in European facilities.

“Conceived for perfect integration into automated fab lines, our new system combines micro and macro defect detection for all 300-mm wafer applications,” said Thomas Breser, strategic marketing & communications director. “This is an important part of why our client chose the LDS3300 C.”

As part of the automated macro inspection process, provides automated reticle and fuse inspection capabilities. High throughput (up to 130 wafers/hour) helps increase yield and reduce cost of ownership.

Focal plane analysis has high accuracy and efficiency in scanner focus calibration and monitoring, and scanner e-chuck flatness measurement and monitoring.

Leica Microsystems, leica-microsystems.com

Ashburn, VA – Zestron’s VIGON A 200 recently passed extensive surface insulation resistance (SIR) testing conducted in accordance with J-STD 001.

To conduct the testing, an IPC B24 test comb structure was cleaned with the water-based cleaning agent in a spray-in-air process. During the four-day procedure, the climatic storage temperature was calibrated at 77^oF / 25^oC, while the relative humidity was set at 60%. The test comb’s SIR values were continuously monitored and were reportedly consistently well-above the required 100 ΜΩ. Further inspection did not reveal any dendrites or corrosion effects.

The cleaner is designed to remove flux residues from electronic assemblies.

For complete results of the testing, contact the Application Technology Department at (888) 999-9116.

WS330 is a compact wave soldering machine for small- and mid-size volumes in standard and lead-free technology. Solder width up to 330 mm and the universal pallet transport system allows for a variety of PCBs. Equipped with a dual-wave technology, allowing THT and SMD components to be soldered.

Includes full convection preheating, spray fluxing system and composite coated parts.

Said to offer small delta-T values, precise hot air flows and a closed loop.

Microprocessor-controlled temperature cycles ensure fast preheating. High temperature efficiency enables a shorter preheat zone

Coating of the solder pot and wave elements enables production with lead-free solder. The coating is applied after the complete pot is finished, eliminating possible problem areas. All parts in contact with the solder are coated (pot, pump, channel).

Available with spray or foam fluxer. Spray fluxing features automatic board detection.

Equipped with a universal palette transportation system based on an antistatic belt. Has ergonomic loading/unloading heights.

ESSEMTEC AG, essemtec.com

 

 

A-Tek LLC introduces High Speed Ink Jet Marking to the North American

electronics PCB manufacturing environment by offering Getech's HSM1000.

A-Tek offers high speed ink jet marking from Getech. HSM1000 is an in-line automatic board marking system usizing robotic manipulators for handling.

Getech is ISO 9001:2000 certified, manufacturing standard end-of-line automation machines since 1992. 

Additional Getech products marketed include fully automatic PCBA in-line and stand-alone routers, odd-form component pick-and-place machines and flex-circuit depanelizing machines.   

A-Tek, atekllc.com

BergStik un-shrouded headers with simplex-plated contacts meet environmental requirements for lead-free and RoHS-compatible components. Feature standard 0.025” (0.64 mm) sq. post contacts on 0.100” (2.54 mm) pitch.

Simplex plated posts with gold or GXT (gold flash over palladium-nickel) contact finish have no tin content. Headers can be ordered with insulators molded using high-temperature thermoplastic capable of withstanding lead-free reflow soldering temperatures.  

“BergStik headers with simplex precious-metal contact finish provide a low- risk path for electronics manufacturers to completely eliminate lead from un-shrouded headers,” said Alejandro Aguirre, product manager.

FCI, fciconnect.com

The latest version of CAM350, for verification and optimization of PCBs, now includes Streams Rule Check - a new method of performing PCB design analysis. Allows users to shorten the time to analyze a design by performing Design Rule checks, Design for Manufacturing checks and Netlist Comparison checks simultaneously.

“Analyzing Gerber layers in CAM systems is often a tedious and time-consuming procedure. For each type of design analysis to be performed, a PCB designer needs to set up and execute it separately, then view the results separately,” said Rick Almeida, founder. “With Streams Rule Check, a designer can set-up once and execute a variety of analysis simultaneously - or all in one ‘stream’ - saving time and increasing productivity.”

It also allows the user to run different analysis in High Technology areas such as BGA or Wire Bond while running “standard” analysis on the balance of the design.

Enhancements to existing DFF and DRC functions include new negative plane checks, missing soldermask and floating antennas as well as other enhancements and corrections.

The new version is available at no additional charge to existing customers with a valid maintenance agreement.

DownStream Technologies, downstreamtech.com

PPT VISION has announced two new intelligent camera models, the IMPACT T26 and T27. The T-series are intelligent cameras with full-scale vision image processing capabilities built into the camera.

“Both cameras are designed to give manufacturers greater accuracy and improved defect detection, compared to standard resolution vision systems,” said Joe Christenson, president.  “The T26 incorporates a 1280 X 1024 CMOS high resolution imager that provides an economical machine vision solution with all the features of a full-scale high-resolution system. The T27 is the industry’s highest resolution intelligent camera. With a 1600 X 1200 CCD imager, it is ideal for the most accurate and repeatable defect detection even at high production speeds.”

The T-series family contains a high performance microprocessor and real-time operating system, plus a digital imaging sensor. The electronic components are contained into a sealed industrial unit which can be installed directly into assembly lines and manufacturing equipment.

PPT VISION, pptvision.com

Roll-A-Round base provides mobility and space-saving convenience for Prolite illuminated magnifiers. Most magnifiers are mounted to a table or workbench; the new base allows a magnifier to go mobile instantly when needed elsewhere. The base brings task lighting and magnification where it is needed. This includes the model builder’s bench, craft hobbyist’s table, or for bedside lighting, reading, knitting, crocheting, tying flies, sewing, stamp and coin collecting and review, and other uses where cool, natural, full-spectrum lighting and magnification are desired.

The heavy-duty base features a five-leg caster system for stability, and is compatible with most magnifiers or other bench-mounted lighting fixtures that use a standard 1/2" bottom mounting pin. Chair-height base includes a weight underneath for resistance to tipping. The base is 32" high.

The O.C. White Co., www.ocwhite.com

A new conveyor chain is gentle to soft products and is said to offer increased efficiency and service life, even in environments where dust and particulates are a problem. Features smooth surfaces and link interfaces for improved gentleness and minimum dust generation in product handling. Link interfaces are designed to minimize dust intrusion to the conveyors. Chain and slide rail contact optimised to enhance service life and minimize friction.

FlexLink, flexlink.com