The Automation Group of Tyco Electronics will highlight the P350 x-y insertion machine in booth 5438 at AT Expo.
 
Used for the automatic insertion of reeled pin, tab and receptacle products into PCBs, can apply both through-hole solder and press-fit components. 
 
Can be equipped with up to three product-specific insertion heads. Each incorporates a rotary insertion finger to allow products to be inserted at different angles without having to rotate the PCB.
 
Is SMEMA compatible for inline operation. PCBs are positioned under the insertion head by an x-y table that is driven by servo motors. A multi-tasking controller drives the motors and monitors the insertion process.
 
Programming can be executed through the Windows-based interface, off-line or by converting CAD data of various formats.
 
Features: high-speed AC servo motors for the x-y table and insertion head for reduced cycle times; automatic tool change feature for up to three insertion heads; SMEMA compatibility; optical sensors for automatic position correction; PCB thickness measurement; rotary insertion finger to apply products at various angles without reducing cycle time; and monitoring of the insertion forces of press-fit components.
 
Inserts up to 300 pins/min., has maximum insertion area of 450 x 450 mm and features 0.02 mm repeatability.
 
Tyco Electronics Automation Group (TEAG), http://automation.tycoelectronics.com

Essemtec will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, in booth 5800 at the upcoming AT Expo.
 
Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Also, tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
 
Fulfills the requirements of high-mix/low-volume SMT production with a wide application range. Benefits include a feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
 
Lightplacer Windows-based software features a fully graphical man-machine interface. Large feeder capacity and automatic recognition of intelligent feeders ensure minimum changeover times and error-free placement. Tape feeders are electrically driven and the pitch is programmable. Can be programmed on- or offline. Barcode labels on feeders and components guarantee correct feeder setup using a barcode reader.
 
Has a footprint of 80 x 80 cm.
 

Rohm and Haas Electronic Materials is exhibiting at Productronica in Munich, November 15 – 18, in Hall B4, Stand 205.
The company will present new processes for both the printed circuit, packaging and finishing markets.
 
Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process.
 
The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium.
 
In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF.
 
The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask.
 
The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
 
 

IMPACT T22 is an intelligent camera designed as a drop-in replacement for obsolete or underpowered vision systems. An extension to the T-series, the image processing computer is contained inside the camera, enabling it to be deployed without additional image processing hardware.

Has ½-inch CCD, is interchangeable with older, camera-based vision systems, enabling manufacturers to upgrade older vision engines to achieve real-time inspection while reusing existing optical and lighting components. Suitable for analog and digital systems.

PPT VISION, pptvision.com

The OptiCon series AOI platform can inspect components on PCBs with an angled view by using a newly developed optics module. Can execute inspections in 45° angle from four directions. Uses telecentric imaging and high resolution.
 
The modular AOI platform enables individual configuration of OptiCon systems. Typical applications for Quattro angled view are the evaluation of hard to see solder joints and components (e.g. at J-lead pins of PLCC and SOJ models or SMT connectors) but major gains will be in next-generation components such as OFNs.
 
 
GÖPEL electronic, goepel.com

HARRISBURG, PA -- Tyco Electronics has introduced a low profile, single connector, microminiature RF interconnect to meet the demand for direct board-to-board connections. 
 

Available in three different lengths for board spacing of 6.65, 10 and 14 mm, and is supplied in trays for easy pick-and-place compatibility.  Has an operating temperature range of –40 to +125°C, impedance of 50 Ohms and can operate effectively at frequencies up to 6 GHz.  Return loss is specified as a minimum –20 dB at frequencies up to 2.1 GHz.  Tolerance against axial misalignments from the nominal board stacking height is ±1.0 mm for the 10 and 14 mm versions, and ±0.3 mm for the 6.65 mm version. Tolerance against radial misalignment is ±0.8 mm from centerline, in any direction, for all three versions. Target pads can be tin plated, or a gold-plated disc can be applied to the mating PCB. 

Viscom’s high-speed S6056 AOI system will debut during Productronica in November. The system features parallel inspection of two PCBS with a double-track system.
 
Uses 4M sensor technology and EasyPro operating environment.
 
Three different inspection concepts can be implemented, depending on the customers requirements. In addition to selective inspection using single or double-tracks, it also offers parallel inspection to meet very high throughput rate requirements.
 
System configuration is fitted with a double-track and two sensor modules, permitting simultaneous inspection of two PCBs per transport lane. Has no size limitations on PCBs up to 457 x 355 mm. Integrated shuttle is available for the twin-track, on the input or output side, obviating the need for external switching points for single-line production.
 
Has integrated switchgear cabinet with a hinged frame for ease of maintenance.
 
Is lead-free capable – as ensured by algorithm rules-based analysis, which is capable of obtaining optimum results under even highly varying contrast conditions.

Viscom, viscom.de
Productronica, Hall A2, Stand 475

Thermo Electron’s NITON Analyzers business unit has released a new version of software for its NITON XLt 797 portable XRF (x-ray fluorescence) analyzer. Version 4.4, enables users to establish thresholds for rapid screening of solder bars, circuit boards and their components, then displays pass or fail symbols for each regulated element.
 
Whether manufacturers are segregating Pb and Pb-free stock, performing due diligence testing to verify supplier certifications or controlling solder chemistry as part of process quality control, the analyzer and software allows companies to employ non-technical personnel for these critical tasks. Easy-to-use data entry includes a virtual keyboard and integrated barcode scanner.
 
Capable of storing more than 3000 legally defensible measurements for later download. All readings are encrypted to prevent accidental or intentional tampering with the analytical result, yet may be easily incorporated into database or spreadsheet packages for reference to the company’s manufacturing and/or quality control systems.
 

Microscan’s miniature mega pixel imager Quadrus MINI high-resolution imager offers true auto-focus for industrial product identification. It will be introduced at ATExpo, September 27 – 29, in Booth 5729.
 
In the past, to achieve adjustable focus in changing applications, the imager’s hardware had to be physically calibrated for each new symbol distance. When using the MINI, all the operator needs to do is plug it in.
 
“The MINI imager performs much like an off the shelf digital camera,” said Microscan president Dennis Kaill. “You point it at the object of interest, in this case the symbol, and push the EZ button. It automatically focuses on the symbol and sets the exposure time, gain and illumination intensity. ” 
 
Designed for demanding, high performance applications in electronics manufacturing, it reads both linear bar codes and 2-D codes such as Data Matrix directly marked on boards and components. Ultra compact size (1.8”  x  2.10” x 1”, weight less than 2 ounces) and high resolution optics provide a wide scan window.
 
Featuring a mega pixel sensor with an extra wide field of view and proprietary algorithms, reads long bar codes omni-directionally and high density 2-D symbols. Has auto-focus, EZ button setup and green flash good read indicator.  Customizable data output and Windows’ based interface allows integration into existing platforms with minimal programming.
 
Microscan, microscan.com

STOCKHOLM, SWEDEN – At Productronica booth A5:337, MYDATA automation will unveil the MY500 stencil-free printer.
 
The machine uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/sec. (1.8 million dots/h).
 
Because it needs no stencils, operators can change the print program in a matter of seconds and can control the volume of solder paste deposits for each pad.
 
Other benefits to stencil-free production include:
• No waiting for stencils to arrive from manufacturers
• No stencil production costs
• No hazardous solvents to clean stencils
• Instant control over paste volumes on pads
• Flexible programming possibilities
• Reduction of errors associated with screen printers
• Lower consumption of solder paste.
 

ASHBURN, VA – Zestron America will showcase its latest lead-free cleaning process solutions at booth 5609 during ATExpo from Sept. 27-29 in Rosemont, IL. The company will also feature its recent advances in PCB, stencil/misprint and maintenance cleaning applications. 
 
The applications technology and sales team will be available to answer precision cleaning questions.
 
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
 
Zestron America, zestronusa.com