Used for tracking semiconductor wafers through the manufacturing process, In-Sight 1721 offers a slimmer package and twice the speed of its predecessors, yet maintains mounting and functional compatibility with them.

“As fabs move toward full wafer traceability, they are more dependent than ever on reliable automated wafer identification,” said Justin Testa, Senior VP of ID Products. “This newest member of Cognex’s series of industry-leading wafer readers reads faster with higher yield under difficult real world process conditions.”

Advanced image formation technology and OCR, 2-D matrix and barcode recognition algorithms deliver reliable reading performance on SEMI-standard scribes. Said to provide high read rates on wafer marks that have been affected by CMP, edge beads, copper metallization, blue or green nitride coating and other process effects.

Offers flexible mounting options for easy installation on wafer sorters, ion implanters, probers and other tools. GUI simplifies set up, automatic tuning minimizes operator intervention. Built-in network and serial communications provide connectivity to other process tools and the fab network.

Available in September.

Cognex Corp., www.cognex.com.

Profiler is a technology dedicated to post-reflow inspection. Profiler technology is fully integrated into the AOI software suite and the standard model library comes equipped with preset test parameters. A user-friendly auto-setting wizard quickens the programming time and the fine-tuning of inspection programs.

Unique algorithms analyze the grey level profile of leads and joints, eliminating the need for angled camera systems which are difficult to program and give high levels of false failures. Highly robust algorithms in combination with a custom built proprietary color lighting source, enable the detection of lifted leads, total or partial lack of solder, impurities and co-planarity defects, reportedly surpassing the test coverage of a number of multiple cameras systems.

ViTechnology, vitechnology.com

CSM7100 SMD pick-and-place fulfils the requirements of a high-mix/low-volume production. The low-cost system places components from 0402 to 33 x 33 mm QFP. The narrow built feeders are intelligent and programmable to reduce changeover time and avoid setup errors.

The large number of feeders (up to 100 x 8 mm) enables manufacturing of complex PCBs in one run and allows for a broad range of standard components. Changeover effort is minimum. High feeder variety provides a wide application range and high flexibility. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Tall components (15 mm height) can be placed.

All components are aligned "on-the-fly" with a laser centring system. With this touch-less technology components are measured exactly and no damage can occur. Furthermore, the laser alignment system is self-calibrating and requires no maintenance.

Has placement rate of 4,000 cph. Footprint is 80 x 80 cm, with a placement area of 380x250 mm. LIGHTPLACER Windows-based software features a fully graphical man-machine interface. Can be programmed online or offline. Barcode labels on feeders and components guarantee the correct, quick feeder setup using a barcode reader.

The combination of the pick-and-place with a dispenser saves the cost and floor space of additional equipment. A time/pressure or screw valve dispenser can be integrated.

ESSEMTEC AG, www.essemtec.com

SML5050RBG1K-TR is a low-profile, surface-mount, full-spectrum RGB LED. Said to provide excellent performance and terrific visibility in a compact size of 5.5 x 5.5 mm. The RGB diodes emit high-intensity light in a viewing angle of 120°. The red diode's wavelength varies between 620 and 630 nm; the green diode’s is between 520 and 535 nm; and the blue operates between 460 and 475 nm. Luminous intensities range from 150 to 500 mcd at 20 mA current. A water clear lens protects the diode array.

Use with s OptiLED Light Pipes to simplify the spatial relationship between the PCB and remote indicator illumination points. Light pipes channel the LED-generated light to the exact location where the light is required. Compatibility with infrared and vapor phase reflow soldering processes and pick-and-place automated equipment make the LED series cost effective. Broadens the illumination options available for back lighting computer panels, handheld instruments like PDAs, data- and tele-communication status indicators, etc. Solid-state design renders LEDs impervious to electrical and mechanical shock, vibration, frequent switching and environmental extremes. Average life span of 100,000-plus hours (11 years.

LEDtronics Inc., www.ledtronics.com

Flux Pen is a precise, inexpensive, handy tool for applying liquid flux to tiny chip components and individual solder joints. Can be used with different types of fluxes. Its fine tip allows the user to apply flux to very small areas in densely populated assemblies. Cuts down on waste and prevents over-fluxing, reducing possible cleaning time and preventing contamination.

Transparent cartridge allows the user to see the amount of remaining material in the pen; has small, compact size and large capacity. Flux is dispensed by lightly squeezing the barrel; the user controls the amount of flux flow. A snug-fitting cap prevents flux evaporation in the barrel. Constructed of rugged polypropylene, the refillable pen features an ergonomic design, and is compact enough to fit into the top pocket of a lab coat.

Cobar Solder Products (U.S.); contact Bob Silveri: cspbob@aol.com.

GÖPEL electronic announces the availability of the first products for extended JTAG/boundary scan solutions based on the hardware platform Scanflex. Add new capabilities for analog and mixed-signal test.

Three PCI-based boundary scan controllers (SFX Controller) of various performance classes will be available, with six different TAP-Transceivers (SFX Transceiver) and an I/O module (SFX Module) for parallel, digital I/O. The product family will be expanded to include USB, PXI, VXI and fire wire controllers as well as TAP 8 and TAP 16 gang tranceivers.

A Scanflex system is controlled by a SFX controller. The PCI-based SFX/PCI1149 is available in three performance classes: A, B and C, with a max. TCK frequency of 20, 50 or 80 MHz, respectively. Integrated Fastscale technology allows upgrades “on the fly” through software while it is inside the host PC. Controllers include the ADYCS II feature to compensate for signal propagation delay, as well as HYSCAN for  data synchronization of serial and parallel vectors.

The portfolio transceivers includes desktop solutions for 2, 4, 6 and 8 TAP configurations, as well as compact versions with 2 and 4 TAP for more rugged environments. Include 32 dynamic, parallel digital I/O, two analog I/O channels, three static digital I/O and trigger lines. Have removable TAP Interface Cards (TIC). The first available TIC – a single ended interface with line drivers supporting TAP cable up to 5 feet long – provides programmability for input threshold, output voltage, input and output impedance, TCK frequency, delay compensation, a relay controlled power signal and read-back capability of TAP output signals.

SFX5296 provides 96 parallel I/O channels. Each is individually configurable as input, output, bi-directional or Tri-State. Feature Unstress protection and voltage programmability for groups of 32 I/O. 

GÖPEL electronic GmbH, goepel.com

FEINFOCUS, a business unit of COMET, announces the HDX-ray 16-bit Imaging Chain for FOX x-ray inspection systems. Captures high-resolution images with film-like quality, even in real-time. Provides sharp digital images for thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects, hybrids and encapsulants.

Fully-integrated 2.6 mega pixel imaging subsystem features more than 65,000 grey scales with freely-selectable frame rates from 1 to 30 fps, for imaging of low-contrast, low-density and high-contrast, high-density structures and materials at the same time.  Powered by the Feinfocus GUI.

FOX nanofocus x-ray inspection system provides xy feature recognition of 300 nm (0.3 µm) and asmallest focal spot size (less than 1 µm). Employs a modular concept, available in multiple configurations. Offers geometric magnification up to 2,720x (total magnification up to 8,120x).

COMET, comet.ch

Xpert3 kit works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Distills recipe development into three steps: Create Signature; Plan Target; and Set & Verify.

Signature Wizard helps create an oven signature file for your reflow oven at a given convection rate. With that oven selection in place you plan robust target profiles, choosing from the 400 solder paste formulations in the database. Entering Assembly Properties information completes the planning stage and Set & Verify delivers the oven recipe.

A solder paste specification may be set to your choice of Ramp-Soak-Spike or a Ramp-to-Spike profile. Converting an existing process to a Pb-free paste is quick and easy. Qualify your oven's Pb-free capability by observing if the required zone setpoints per conveyor speed exceed the oven's maximum capability. The Transpose command immediately converts a profile to your new oven, and the system works with any reflow oven.

ECD, www.ecd.com

ProFlow enclosed print head is a key element of the lead-free portfolio DEK has created to help the transition to high-quality, repeatable lead-free processing. When implementing lead-free assembly, high accuracy mass imaging using the print head reportedly maximises the process window, compared to conventional squeegee blades.

Reduces the number of variables – such as paste rheology and ambient humidity – that need to be controlled for lead-free utilisation. The result is a simplified paste evaluation process and confident vendor selection, supported by repeatable results to justify procurement decisions.

In operational use, the greater transfer force maximises stencil aperture fill and paste release efficiency. Has repeatable aperture filling, low paste wastage and high throughput.

DEK, www.dek.com/lead-free

According to Christopher Associates, OEM requirements for improved manufacturing yields have led to strong demand for the Koh Young 3 dimensional solder paste inspection systems.

The KY 3030VAXL (24 x 27” panel size) high-speed 3-D solder paste inspection system was developed to inspect very high density, high technology telecommunications substrates for 100% volumetric and shape defects. Designed, manufactured and delivered within 10 weeks of receipt of order to a large EMS manufacturer.

Additional installations include a number of the KY 3030VAL (18 x 20” substrate) systems installed at a major EMS manufacturer; a major automotive electronics manufacturer has also ordered multiple systems. Among the advantages cited after extensive evaluations by each customer were ease of use, accuracy and speed.  

Christopher Associates Inc., christopherweb.com

St. Louis -- HIGHLIGHTER multi-directional LED ring light uses a simple mouse to control the direction of the lights, as well as the intensity and number of LEDs illuminated. Works on all makes of microscopes, as well as the speckFINDER  Video Microscope.

Inspection and quality control workers can view surface defects and overcome visibility problems. Hard-to-see imperfections in plastic and metal surfaces, defects in solder joints and details on translucent surfaces all become apparent when highlighted.

Users can direct up to 40 LEDS either clockwise or counter clockwise by rotating the mouse control.  A left mouse click activates automatic continuous rotation of 1 to 39 LEDS so the operator can compare and contrast the image under different lighting, without having to move the object being viewed. A right click of the mouse alters light intensity to meet optical instrument and individual requirements.  The dimmable ring light offers five settings from 100 to 2%. 

The ergonomic mouse occupies minimal workspace and eliminates “big box” controls.

Davor Manufacturing Corp., dazor.com 

1075-EXR 44 wave solder flux is developed specifically for Pb-free wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies.

Is water-based and non-flammable, eliminating special storage requirements and reducing VOC emissions. Said to provide excellent surface wetting, eliminate cleaning and reduce solder balling. Can also be used for Sn/Pb assemblies. 

Indium Corp., www.indium.com