Designed as a low cost interconnection between two perpendicular power bus bars, the Power Clip is used in “N+1” rectifier, power supply and switching power supply applications.
High-performance contact provides low-voltage drop and superior amperage carrying capability. Accepts a solid .125” thick nickel- or gold-plated rectangular bus bar tab, eliminating need for a mating connector.
Evaluated to UL1977 and CSA standard C22.2 No. 182.3-M1987, rated for up to 300 amps of continuous service. Is also UL-approved for true hot plug current interruption of 100A at 48V and 200A at 42V using a gold bus bar tab. Anderson Power Products,andersonpower.com
JTAG Technologies, a provider of boundary-scan tools, has announced a graphical software tool that supports the new SCANSTA476 analog voltage monitor from National Semiconductor Corp. STA476 Utility program works with an evaluation board from National Semiconductor to perform and report DC measurements on eight analog/mixed-signal input channels.
Measurement of mixed-signal levels can be a beneficial troubleshooting technique during product development, environmental screening, functional testing and in-field service to verify power supply and reference voltages. The technique can be used to perform health monitoring and prognostic functions while in operation, via an embedded boundary-scan structure.
The GUI allows selection of any of the eight analog inputs on the evaluation board. Measurements can then be conducted on the selected channel(s) using a preselected controller to initiate the test and access the results over a standard 1149.1 boundary-scan interface.
The utility program is available free-of-charge for customers at the Customer Service Area of the JTAG Technologies website. JTAG Technologies, jtag.com
CADSTAR 8.0, the latest version of the desktop PCB design solution, features improvements in schematic design and library management, support for variants, lead-free component technology and jumpers. Also has enhanced placement, routing and advanced signal integrity analysis tools.
Schematic Manager features significant usability enhancements for engineers. Pin names and numbers can now be rotated in the schematic symbol, pin labels can be assigned in the library, multi-line text can be justified and text can be aligned and rotated while supporting readability.
Component management is now simple; users can search components within multiple libraries while maintaining data integrity required for carrying out necessary design processes such as ECO updates, checks and post process procedures.
Includes the latest in functionality for new technology that has evolved from the European WEEE and RoHS Directives and continued innovation in design processes and fabrication such as lea- free soldering. Electrical connections using jumper technology is now supported. Users can add jumpers on the fly (like a normal via) in the P.R.Editor XR 2000 L4 (or higher version). Rounded rectangle pads are also supported. The Variant Manager now supports text per variant, eliminating separate supporting documentation for manufacturing. Hyperlinks and documentation in Microsoft Word and Adobe PDF can also be added to the variant text.
The hard work has been taken out of complex routing with major enhancements to the P.R.Editor. Trunking allows designers to perform auto-interactive routing more efficiently. Trunks address issues associated with handling different routes, busses or differential pairs collectively as one entity, enabling users to quickly sketch routes, facilitating fast up-front planning and manipulation of a collection of signals as a group. All interconnects can be concurrently considered when routing at the ends of a trunk using the trunk end router function, combating design complexity as the board density increases; which can be performed in combination with an improved 45° angled pusher.
Includes an accurate FEM field solver for considering frequency dependent losses and the proximity effects on strong couplings. Eye diagrams can be generated for performing eye-mask verification and for providing analysis based on multi-bit sequence stimuli. Includes RF models for passive devices; waveform verification can be performed at die level.
Will be available from in November 2005, visit cadstarworld.com/cadstar8.
Service Pack 3 (SP3) is now available for P-CAD 2004, the PCB design system. Available as a free download to existing licensed customers, the upgrade has over 160 new features and enhancements.
Productivity enhancements include variants, layer stack up and configuration of options. A significant upgrade was made to the P-CAD TIES Viewlogic/ePD interface, which now supports eProduct Designer (ePD) 2004 SP1. It allows the transfer of electrical design information between the Viewlogic/ePD CAE design tools and P-CAD’s tools, and offers cross-probing plus forward/backward annotation. The PADS / P-CAD translator now handles non-English characters.
The number of component libraries has been significantly increased; includes 80,000 total available components.
Has an increased number of CAM file export options. Users can output an IPC-D-356A formatted net list, including netlist connectivity data and blind and buried via information. Default settings for apertures, design rules, grid settings,and pad styles can now be stored and applied automatically to new designs. Library Executive has also been enhanced with a “Save to File” option.
content life cycle from change orders through release approval, dissemination and training. Allows firms to improve enterprise-wide visibility of process changes, reduce risk and labor costs associated with use of erroneous and outdated procedures, and demonstrate regulatory compliance.
Provides an intuitive workflow environment to manage the entire lifecycle of content (procedures, specifications, drawings, etc.) via integrated change orders, version control and training tasks.
Benefits include: • Managing and distributing content, including SOPs, procedures, drawings and datasheets. • Facilitating compliance with regulatory requirements and standards including cGMP, ISO 9000, 21 CFR Part 11, SOX, and HIPAA • Making relevant content easy to locate, view, print, e-mail and download. • Providing full text search across the entire content repository. • Automatic notification regarding new, updated and recalled documents. • Supervisors can manage employees, assign new hire document training and training for new roles and document monthly activity. • Content managers define a document’s affected areas, automatically set training tasks and access rights and also receive automatic notifications of document change request status.
DX dispensing system includes a mobile hand-held dispenser with a refill station, for two-component material dispensing.
Can dispense 1:1, 1.5:1, 2:1, 4:1 and 10:1 ratios for two-component reactive resins. Multiple hand-held dispensers can quickly be refilled with one DXR refill station. The refill station uses two transfer pumps that feed from five-gallon bulk containers of material, each equipped with follower plates to handle a range of viscosities. Is lightweight, compact. MIXPAC Equipment, mixpacequipment.com
ESD Drawer Storage Cabinets are certified to meet specific electrical property requirements, assuring static dissipation at a safe rate. Can be protected by static dissipative powder coat finishes in five standard colors. Drawer interiors can contain conductive plastic boxes and conductive slotted grooved trays for additional protection.
Cabinet drawers feature a 440 lb. load capacity each and are available in seven full sidewall heights for maximum cubic storage capacity. Extend 100% from the housing for complete use of the furthest corners and easy accessibility to all the contents.
Additional ergonomic and safety features include drawer handles positioned at the top of each drawer and flush with the face of the housing. Also, the one-drawer-at-a-time PrevenTip safety system prevents accidental cabinet tipping.
AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.
Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking.
Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure.
The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials.
The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.
SAC4-XM7S solder-paste provides the desired properties for lead-free applications without the use of nitrogen blanketing or extended profiles to minimize ΔTs.
Said to deliver excellent results in applications requiring extended heating profiles. Remains stable and active during extended heating at elevated temperatures and offers a robust printing window. Available in most common SAC-alloys and in several powder classes.
CXInsight for Electronics, a project content management system, allows internal and external collaboration between project members across OEM and manufacturing sites with the latest web security.
Is a product-oriented content management and e-collaboration toolset for use in electronics design, NPI and production environments that require management of structured and unstructured content. Flexible, Web-based server/client system operates independent of OS or application software, and is developed specifically for OEMs and manufacturers working together on projects, regardless of geographic location, language or time zone.
Manages and supports distributed development and NPI across global supply chains via secure (SSL) Internet communication. Handles four key areas:
Development product data management system (PDM Light) Product oriented, single point of data access for internal/external project members Graphical product and project file browser Full project flow control and event logging/tracking system (development and engineering)
Positioned as a PDM-light application, views and controls the complete project flow from project management, task and workload management, through to ECO modification processes, full traceability and event logging. Adeon Technologies, adeon.nl or cxinsight.com
CDS6250 can dispense up to 150 drops per second (540,000 drops/hr.). The Microjet dispensing valve produces dots of down to 2 nl. The three-axes dispensing system is said to be easily programmable.
Dispenses adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist or conformal coating. Almost all media with a viscosity between 50 and 200.000 mPas can be dispensed.
Unlike other needle based dispensing systems, the gap between the jet valve and the substrate can vary. Dispenser can travel at a fixed height while the substrate’s height changes.
The volume of a single drop can be as small as 2 nl. Very thin ropes can be dispensed by jetting one drop next to the other or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) and at high temperatures (up to 100 °C).
The Di-Series family of C‑size VXI-based digital test instruments builds upon the M9‑Series by increasing performance and adding key new features for emerging applications. Features highly configurable, independently programmed channels to address a test requirements from board through subassembly test.
Four key attributes: Compatibility with the M9-Series and other instruments is preserved ; Flexibility is well suited to the highest levels of assembly, such as box-level LRU (Line Replaceable Units) or WRA (Weapons Replaceable Assemblies). In addition, Di-Series cards can be partitioned to form multiple autonomous “virtual” instruments, each of which can simultaneously address different portions of the test problem while interacting with the UUT; Performance enhancements include the ability to directly test differential logic, including high-speed LVDS (Low Voltage Differential Signaling). Usability is enhanced by the per-channel programming of signal timing and levels and by iStudio development and debugging software. Teradyne, teradyne.com