Kester, kester.com
Apex booth 1085

The company will also preview its Post Wave Cooling (PWC) module and the Optima ultrasonic spray fluxing system featuring Ultra-Spray technology.

Speedline will also preview new options for its MPM Accela printing system as well as spotlight an array of its MPM printing, Camalot dispensing, and Electrovert soldering and cleaning solutions.
 

SFX-TAP4/CR is the newest member of Scanflex TAP transceivers, developed for integration in Flying Probe Testers (FPT) offering four parallel independent TAP.
 
This seventh TAP transceiver can be freely combined with all Scanflex controllers on PCI, PXI, USB or LAN basis, with distances up to five meters. Each TAP offers programmable input and output impedance, stepwise (250Hz/1MHz) programmable TCK frequency to 80MHz, programmable delay compensation, read-back of output signals and a relay controlled power signal. This enables an optimal UUT configuration over distances up to 1.5 m. Feature captive CION interface chips (ASIC) and additional safety measures. Features 32 voltage-programmable dynamic I/O, two analog I/O channels, three statistic I/O and trigger lines.
 
All TAP signals and PIO channels are galvanically isolated from the UUT, and can be tested for operation directly in the system by means of an integrated Built-In-Test (BIT).
 
The transceiver has a particular slot for coupling with Scanflex I/O modules; or various SFX I/O modules can be connected via an SFX/LS interface.
 
Supported by software System Cascon from version 4.2.1 on and is compliant with standards IEEE 1149.1, IEEE 1149.4, IEEE 1149.6, IEEE 1532 and JESD71. The software automatically recognizes the transceiver by the AutoDetect Feature. 
 
GÖPEL electronic, www.goepel.com

Enhanced Concept 129 Intelli-Drill includes a companion Database and Search Utility. These tools inspect and measure internal layer movement, then assist in using this information to improve process yields.
 
Database is loaded by the CNC-7 Controller during panel inspection. Search Utility allows the user to search for data and perform statistical analysis. This data is then fed back to the beginning of the PCB design process to improve production process yields
 
Database can be searched from any networked PC.

Excellon Automation, excellon.com
Booth 2031
 

 

Excellon Automation, excellon.com
Booth 2031

Wave Surfer is a self-contained measurement system for wave solder machines that provides critical data on wave solder machine setup and its process.  As a wave solder machine profile fixture, it has five embedded thermocouples, and works in conjunction with the SlimKIC 2000 for quick and easy profiling and setup. 
 
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure process data including peak temperature, dwell time, parallelism and conveyor speed. 
 
Apex booth 363

FX-1R High-speed Chip Shooter is equipped with a double head system driven by two independent linear motors. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser. This technology simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time.

Placement rate is 27,000 cph  (IPC 9850), component range from 0201s to 11 x 26.5 mm to 20 x 20 mm. Placement accuracy is  ±40µm (3 Sigma).
 
Juki Automation Systems, jas-smt.com
Apex booth 1069

EnviroMark 907 (EM907)  is a no-clean, lead-free solder paste designed for high-yield lead-free manufacturing. Said to offer a long stencil life and Pb-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains print quality at high print speeds — up to 6 in/sec. (150 mm/sec.). Said to have excellent cold and hot slump behavior to prevent bridges and solder ball formation.
 
Reportedly has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features high levels of solderability to a wide array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, comparable to 63/37, even in air reflow. The paste leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites, has printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
 
Kester, kester.com
Booth 1085

Vertical PC Board Cart is available in a variety of standard sizes, and is infinitely adjustable. Offers custom slotted, ESD-safe plastic panels on the shelves to protect the edges of PCBs and the sheet metal panels attached to high-end PCBs. Feature a “fish mouth” entrance to the slot to make it easy for the operator to slide PCBs into the shelf. Available for single-sided or double-sided applications. Hundreds of PCBs can be stored in the cart; fully enclosed models are available.

Bliss Industries, blissindustries.com
Booth 857

Glenbrook Technologies offers real-time x-ray systems with x-ray microscope technology to meet the demands of both production and laboratory environments for PCB and BGA inspection.
 
RTX series for production monitoring, and the Jewel Box series for process development and failure analysis, help reduce manufacturing costs and feature compact designs.
 
RTX series provides rapid, reliable in-process inspection at high volumes for PCBs with advanced components such as BGAs, micro BGAs and flip chips. Compact size, light weight and wheeled design make it easy to move and position in tight quarters.
 
To support advanced research, process development and failure analysis in the laboratory, Jewel Box series offers high magnification, with continuous zoom from 7x to 2000x. Micro-focus x-ray tubes provide ultra-high resolution and detail. A five-axis positioner allows x-ray imaging from any angle.
 
Glenbrook Technologies, glenbrooktech.com

PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
 
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.