For customers requiring a small footprint solution that can sort PASS/FAIL products after AOI, Promationhas updated its ENB-700 conveyorized station.
The inline handling solution houses a single, removable magazine. PCBs that “PASS” inspections are transferred through the ENB station to the next process through use of standard SMEMA. PCBs that “FAIL” inspection are transferred into a “50 slot” removable magazine, and stored for future inspection and/or rework.
Features include “One Touch” control panel, PCB counter, selectable pitch (10 to 50 mm) and sliding magazine platform (for ergonomic removal of full magazine).
DataMan 7500 series handheld direct part mark readers read all printed and Direct Part Mark (DPM) codes for manufacturers implementing part traceability programs in the automotive, aerospace, electronics, healthcare and defense industries. “Rapid adoption of DPM identification for part traceability has manufacturers demanding a rugged, self-contained reader that performs consistently on all types of codes and parts,” said Justin Testa, Sr. VP, ID Products. “The DataMan 7500 sets a new performance standard for handheld DPM readers, reliably reading everything from the most challenging DPM codes to the easiest printed barcodes. And the new reader is rugged enough to withstand up to 50 drops to concrete from two meters.” The handheld ID readers combine IDMax code reading software with an UltraLight illumination technology to read codes regardless of marking method, part material, shape or surface texture. The series includes the 7500 corded and 7550 cordless models. Cognex teamed with Hand Held Products on the development of the readers. Cognex Corp., cognex.com Hand Held Products, handheld.com
Promation has developed a line of 200 and 300 mm wafer handling systems for loading and unloading the line.
EWL-700 (loader) and EWU-700 (unloader) are single cassette handling systems that are 10K clean room compliant. Wafers may be safely transported from and into Fluoroware or other type magazine cassettes within a small footprint.
Visiprise Manufacturing 4.1 builds on its integrated manufacturing platform rolled out earlier this year. Said to provide increased performance and scalability while improving system security. New features include: Integrated Product Dashboard: allows users to view work instructions, assembly components and data collection requirements through a single, configurable dashboard. Device History Record Reports: for manufacturers producing items requiring compliance, displays a complete history of a product through a single view or record. Time-based Component Traceability: includes feeder staging for faster machine changeover for electronics manufacturers. Lightweight Directory Access Protocol (LDAP): permits authentication using secure, single sign-on when accessing the application across the Internet. Enhanced Data Collection: enables manufacturers to require that certain data be approved and validated and supports the use of formulas.
Speedprint Technology Ltd., a division of Blakell Europlacer Group, is offering Novatec’s VacuNest Shape Memory Tool on its printer platforms through an OEM supply agreement.
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Simply place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. The shape will be held until the vacuum is released, and the modules return to their original form awaiting the next version of board.
Will not damage a component due to the pin/printing pressure, support forces are evenly spread over the entire board, provides firm and precise support and can be simply reset when a board version changes.
Eliminates the cost of a custom tooling plate as well as pin tooling. Can handle high-density boards with ease and requires little to no lead-time.
Said to guarantee board flatness; is not sensitive to solder paste contamination.
Wickgun Desoldering Braid Dispenser is a hand-held tool that allows users to dispense, position and cut-off braid using one hand while holding a soldering iron in the other. Features a braid with no clean flux (for use with Pb-free solder), is said to eliminate handling braid, reduces waste and speeds desoldering.
Available in four braid sizes from 0.035” to 0.110” W, the replaceable cassettes are preloaded with 15 ft. of braid and are easy to change. Braid is advanced and retracted using a thumbwheel can be cut-off by squeezing the trigger.
A hand-held X-Ray Fluorescence (XRF) NITON analyzer is equipped with a helium purging mechanism for direct analysis of “light elements.” The analyzers provide immediate chemical analysis of alloys, electronic materials, coatings, plastics and more. NITON XLt 898He system has the added ability to quantitatively analyze the elements Mg, Al, Si, and P in most alloy materials. Now, field sorters and inspectors are capable of light element sorting and light alloy chemistries, both non-destructively and on-site. Thousands of added alloy grades can now be determined with the single hand-held, non-destructive alloy analyzer. Trade-ins are available for current NITON alloy analyzer users. For recycle applications, alloy sorters can determine directly aluminum alloys, Al in titanium alloys and Al/Si in bronzes. For industrial applications, the non-destructive nature of the XRF technique allows testing of finished or sensitive parts.
SCC-700 Cooling Conveyor station provides a quick PCB cool down that occupies a minimal amount of floor space.
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine. Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr. Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
ETCO Mighty-T Press is a bench-top semi-automatic press and wire terminal applicator for low volume users that replaces hand crimping. Features a rigid one-piece cast iron frame, employs a 40 mm stroke with 4,450 lbs. of crimping force and includes a footswitch, safety interlock and reel arm. Wire terminal applicator has a two-piece anvil to crimp wire and insulation ear sections in a single stroke. Eliminates hand crimping and has an open architecture for easy feed adjustment and tooling changes.
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
Building on its portfolio of high-speed backplane connectors, Tyco has introduced the Z-PACK MAX connector as a cost-effective interconnect for backplane applications where high speed, high density and high performance are needed. “In listening to our customers we heard the need for a cost effective high-speed product and quickly focused significant resources in responding to that need. The result of that effort is the Z-PACK MAX product line,” said Bob Hnatuck, high-speed backplane connector product manager. “One of our goals is to offer a portfolio of products which provides our customers with options and gives them the flexibility to meet their requirements. The Z-PACK MAX backplane connector system performs at speeds up to 10 Gbps and beyond for applications including servers, storage devices, switches, routers and similar high-speed signal applications.” To achieve the 10+ Gbps speed, ground contacts are positioned within each connector column and are combined with lead frame arrangements within the connector to achieve low crosstalk and high throughput. Employs a shield-less design. Dual point contact mating and compliant pin board mounting help ensure reliability. Meet Telcordia requirements and are RoHS compliant. Available in a five-pair version (with 26 pairs per 10 mm, or 66 differential pairs per in.), or a four-pair version (with 21 pairs per 10 mm, or 53 differential pairs per in.). Accommodate 25.40 mm (five pair) and 20.32mm (four pair) card slot spacing. Planned product extensions include a three-pair version for narrow card pitch applications, right angle pin headers for coplanar applications, vertical receptacles for mezzanine applications and high-speed cable assemblies. Tyco Electronics, www.tycoelectronics.com
K2000 motorized circular blade depanelizer separates prescored PCBs without dust or scrap. Available with XY table for improved board handling. PCB panels are singulated by passing the scoreline between two circular blades. Front and back blade guards assure operator safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area. When using the XY table, the operator places the PCB onto the guide rails of the table and brings the scoreline between the top and bottom blade guards to pass it to the cutting area. The motor driven lower blade of the K2000 will pull the PCB through to separate the panels. Two cutting speeds are available for optimal PCB separation. Singulates panels up to 12.5 in. Blades are made of tool steel and can be re-sharpened. The tooling plate for Simm cards allows exact placement of the PCB matrix onto the moveable base. The plate is positioned on the right side for singulating the carrier strip on the left of the panels and then moved to the other side to singulate the remaining carrier strip. Adjustable end stops for the tooling plate allow for positioning of the scoreline with the circular blades. Tooling pins and support rails for either side of the panel provide safe placement and support of the SIMM cards. The rails can be adjusted to insure that there is no contact with the components on the cards. FKN Systek, Fknsystek.com