A-TEK is the exclusive distributor of the CSR 1200 Stand-Alone Depaneling machine manufactured by Getech Pte Ltd. The depaneler addresses the stringent electrical and safety requirements for CE certification.
 
Stand-alone unit features two independent processing tables for continuous operation and system optimization. Can handle panel sizes up to 13.8 x 13.8” (350 x 350 mm). Larger panels up to 20.8 x 20.8” (528 x 528 mm) can be prcessed on the CSR1280.
 
A-Tek, atekllc.com

A full range of precious metal clad products for fabricating micro-switches, connectors and components used in high-reliability medical, military and consumer products is available from Anomet.
 
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
 
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly  more ductile and formable.
 
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties.  Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium. 
 
Anomet Products, www.anometproducts.com

Micro HVR addresses the high-volume rework market  where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder.  All steps are automated. 
 
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips. 

A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated.  An additional fast linear axis accomodates large substrates. 
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
 
Can be configured with solder paste dispense for 0201 devices.  Can perform for extended periods of time at elevated temperatures.
 
Finetech, finetechusa.com
Booth 1481

IBIS, the Interferometric Bump Inspection System, offers production volume solder bump inspection on chip carriers. It inspects and reports on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that carriers are within specification for chip attachment.
 
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.

Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086

CDS6250 automatic system can dispense up to 150 drops/sec. (540,000 drops/hr.). Nanojet dispensing valve produces dots down to 2 nl. Three-axis system is programmable and can dispense adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist, conformal coating and more. Almost all media with a viscosity between 50 and 200,000 mPas can be dispensed.
 
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
 
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.

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Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
 
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N₂ option.


Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift. 
 
Essemtec, essemtec.com
Apex booth 2433

Auto-Focus software automatically selects the best reflow oven recipe for new products without running a profile by evaluating a database of previously setup products and extrapolating a new oven recipe based on product and oven characteristics. Instead of relying on a technician’s guess, the user enters the product’s length, width and weight. After a dozen products that cover the required range have been set up properly, the accuracy and quality of the oven recipes developed is so high that most users may no longer find it necessary to run a verification profile.
 
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
 
KIC, kicthermal.com
Booth 363

The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system. 
 
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
 
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
 
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
 
Finetech Inc., finetechusa.com
Booth 1481

MS2 molten solder surfactant eliminates dross in wave soldering. Available for both leaded and lead-free processes, does not mix with the metal but forms a thin floating layer that covers the entire solder surface except the wave, which it does not disturb. Prevents dross from forming on the surface and immediately converts any dross generated by the wave back into usable metal. Said to reduce solder usage by as much as 40 to 75% and result in other dross-related cost savings.
 
P. Kay Metal, pkaymetal.com
Apex booth 2635

The easy-wire CH2 high-voltage wiring harness/backplane tester offers test voltages to 1500VDC and 1000VAC in a modular system. Can be ordered with as few as 160 test points and expanded to 20,000.  Future capability to 100,000 points is expected.
 
Runs on Windows-based easy-wire software. 
 
Can self-learn the wiring pattern from a sample assembly. Can be programmed through its onboard wirelist editor, or test programs can be imported from CAD/CAE generated data files. Measures resistance from .1 to 1MW in standard two-wire mode, and as low as .001W in four-wire mode. Detect sshorts in <1 sec. and checks for opens, shorts, mis-wires and high-resistance errors, as well as testing components in the assembly.  High voltage tests verify insulation up to 1GW.
 
Can also be used as a zero-defect wiring assembly aid, guiding the operator through the assembly process with on-screen connector graphics and red/green LED indicators.
 
Cirris Systems Corp., cirris.com

Concept FX II high-resolution x-ray inspection system features configuration flexibility. Has six axes of motion control, ergonomic design and a no-clamp sample tray for fast load and unloading.  The x-ray source and detector tilt off-axis in relation to the sample for oblique object viewing of PCBs up to 20x24”. 
 
VIPx is offers advanced image processing and failure analysis for manual and semi-automated x-ray inspection. Said to provide robust analytical measurement tools and image enhancement filters suitable for upgrading almost any x-ray inspection system, manual or semi-automated, with PC-based functionality. 
 
FocalSpot, focalspot.com
Booth 843

 
The option allows for leads to be inspected during the insertion process and has been adapted to the company’s odd form assembly systems.
 
A camera has been mounted to a programmable X-Y stage below the board and inspects the leads once they have been inserted. The programmable stage allows the camera to move with the robot to each new location on the board as well as to multiple locations on the board for each insertion required for large parts.
 
"Driven by our customer demands to trap defects of Odd Form thru-hole components during the board assembly and not at a distant test station, Chad Industries developed a new vision tool and process to meet these needs," said Scott Klimczak, president of Chad Industries. "With this new design we are inspecting the component leads where it matters, after the part has been inserted."
 
The tool uses Adept Vision sAVI.
 
Chad Industries, chadindustries.net