FLX2010-LCV flexible pick-and-place system is designed for high-mix/low-volume production. The company claims to feature the largest board size and feeder capacity in the industry while also taking up one of the smallest footprints.
 
FLX series offers changeover without downtime, via intelligent feeders, large feeder capacity and offline programming and job planning. Start at 5,000 CPH with 150 feeders inline and can expand to 15,000 CPH with over 470 feeders.
 

Can accept nearly any kind of feeding system, even an independent unit such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. Equipped with laser and vision alignment systems. 
 

 

 

Booth 915

60-W Diode Laser Cell in-line soldering station combines easy-to-use software and precision movement to selective solder most bottom-side applications. Offers over 10,000 hours of useful soldering life and does not require that the solder remain preheated during non-soldering times. Equipped with a precision four-axis Cartesian robot with enhanced Adept motion and vision guidance (with fiducial recognition system and dynamic compensation).
End effector allows the soldering head and automatic solder feeder to be independently adjustable. Variable beam selection ranges from 0.7 to 2.5 mm. Approach and angle are controlled through software.

Pin-to-pin acceleration can be as aggressive as 0.1 sec. Can move 1.2 meter/sec. at 1G acceleration; however, most soldering is accomplished at 50% of this level. The vision system may be programmed to look for known fiducial points, analyze them and automatically center to that point. Variable beam size allows operators to program in desired size (from 0.7 to 2.5 mm. 
 

Is lightweight, has rugged industrial construction and is suitable for all stencil materials, even plastic. Suitable for all printable materials, including paste, inks, resists and SMD adhesives. Advanced Transducer Autotuning system results in optimum cleaning performance.

FLIP Solder Bath for  Pb-free reflow soldering features Linear Induction Pumping, in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, which moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils.  Developed for use in reflow and selective solder systems.
 
Uses 300 kg of solder, instead of 450 kg, and generates less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. Offers open space to access inside side bath and easy nozzle cleaning and maintenance. Does not have motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types.
 
Tamura H.A. Machinery Inc., tamura-ha.com

Model 1800A adds a motor-controlled board support table to facilitate automated, hands-free site scavenging on the Summit 1800 rework system. Supports automated alignment and reduces operator intervention. Options include component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
 


Features standard board handling of 18 x 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40X.

VJ Electronix Inc., vjelectronix.com

Champion 6809 is a servo-driven, automated dispensing system for precision processes. Has easy-to-use proprietary software and GUI that allows for intuitive programming and control. Includes a large, bright, high-contrast color TFT display. Can be configured to match application requirements from dots to underfills. Placement accuarcy is within 3 µm.
 
Dispenses dot diameters to 0.003" with bead width down to 0.003". Volumes are below 0.5 nanoliters. Dispense area is 5.5 x 12.0", with resolution and repeatability of ±0.00008" (2 μm) for all axes.
 

Creative Automation, creativedispensing.com
Booth 279

A pre-screener for industry-accepted flying probe test  (FPT) systems, Eliminator 6 eliminates test points to be tested by FPT. Leverages FPT advantages of fixtureless, quick test preparation and programming, adding faster test times per PCB  to be suitable for all volumes of production . Panel test application niches include rigid PCB, I/C package and PCB inner layers.   
    
Scans PCB panels at a rate of 76.2  mm (3")/sec. regardless of PCB density, test pad size and pitch, or number of PCB images per panel. Resulting elimination rates of 85-92% per panel permits FPT test times of less than 2 min./panel.