DX dispensing system includes a mobile hand-held dispenser with a refill station, for two-component material dispensing. 

AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.

Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking. 

Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure. 
 

The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials. 
 

The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.

CPS Corp., alsic.com

SAC4-XM7S solder-paste provides the desired properties for lead-free applications without the use of nitrogen blanketing or extended profiles to minimize ΔTs.

Cobar, cobar.com

CDS6250 can dispense up to 150 drops per second (540,000 drops/hr.). The Microjet dispensing valve produces dots of down to 2 nl. The three-axes dispensing system is said to be easily programmable.

Arlink, arlink.com

Customization options are available for 300L and 400L selective soldering machines. Features include combination mini-wave and full-wave soldering, dual pot systems, xy fluxers and endoscope process cameras. Additional options include custom nozzles, rotating landing tables, stamp soldering and batch conveyors. Both are compatible with lead-free alloys. 300L is the economical solution for selective soldering of through-hole components after reflow and includes bare board or mask grippers, internal spray or drop jet fluxers, and installation of various soldering nozzles ranging from 4 to 30 mm in diameter. The high-end 400L offers a three-stage inline system for a high-speed, automated soldering process.

Assembléon will introduces new capabilities at Productronica, from enhanced machine multifunctionality to full-functioned remote operation of multiple production lines making ‘lights-out’ manufacturing in the mid-volume sector a reality.

New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing  and robot-level modularity.  

AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output.  It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.

With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions.  A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.  

AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment.  It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing  standalone or multiple mid-volume machines.  Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.