As the deadline for lead-free compliance looms, Grayline Inc. has announced that their manufactured flexible tubing products meet these standards. The EU directives apply to a wide range of products, including electrical and electronic equipment in which much of the tubing Grayline manufactures is used.

Grayline uses non-hazardous compounds to produce its PVC flexible tubing and can supply customers with certification of compliance if needed to verify that the compounds used in the manufacturing process are free of hazardous chemicals banned in the standards.

"Companies seeking to give their product the CE mark can feel confident that Grayline manufactured tubing will meet these standards," said Michael A. Mason, president.

Grayline Inc., graylineinc.com

 

FRANKLIN, MA -- Speedline Technologies will showcase various solutions and technologies in Booth 4D29 at Nepcon Thailand on June 16-19 in Bangkok.

Exhibits and demonstrations include:

The MPM AccuFlex stencil printer, suited for moderate volume high-mix printing. Combines accuracy and flexibility in a compact footprint. Offers a full range of options for future expansion. Designed for production of 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3 x 2" to 23 x 20" and is capable of printing 12-mil pitch devices with consistent accuracy. 

The accurate, flexible and configurable Camalot XyflexPro dispensing system features a calibration-free linear gantry drive system, small footprint and ability to meet any application need through easy-to-add options. Whether dispensing micro dots of silver epoxy, solder paste for high-frequency devices and wafer-level packages, adhesive for 0201 components, or underfill for flip-chip packages or flip- chip-on-board, the system provides the accuracy to maintain process control.

The MPM Gel-Flex Tooling System is a cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, is a true conformal board-support system.

Compressible gel provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. Available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.

Speedline Technologies, http://www.speedlinetech.com

 

 

The Smart Tweezer is an exciting answer to the old problem of testing and troubleshooting SMD components. With the use of only one hand, the lightweight unit can quickly evaluate all types of SMD components. Can automatically identify and measure inductance, capacitance and resistance.

Has two display modes: primary and secondary. The primary display, located in the middle of the display, is the larger of the two available. It shows the present reading, while a secondary display (on top) shows the present reading of additional parameters or measurement conditions when the primary display shows some other feature (L,C).  When multiple features are present, the secondary display shows one of the values.  

A bar graph located at the bottom of the display that provides an analog indication of the measured input. Can measure DC voltage from 100uV to 800mV, has an oscilloscope-like picture of AC voltage. Designed to measure continuity, has a beeper for resistance reading below threshold, or to indicate a momentary open circuit.

Performs fully automatic auto range measurement for resistance, inductance and capacitance. Most measurement functions also have a manual mode, which can be selected by using the jog dial button. The manual setting is used to measure a specific parameter or when better accuracy is required.

Combines an R-L-C meter in a pair of tweezers. Designed for production line component evaluation, on-board impedance testing and SMD components sorting.

Operates on three 1.5V batteries and comes with a 1 year warranty. 

Excelta Corp.

QuikLaze 50ST2 Laser Cutting System for quick, easy removal of a variety of materialsfeatures multiple wavelength coverage and user-selectable repetition rates from single shot to 50-Hz continuous. Suited for semiconductor design verification, failure analysis and LCD repair. Specific applications include removal of ITO shorts in LCD panels, removal of polyimide prior to FIB edits and color-filter repairs.

Enables precise cutting on a microscopic level. Selectable repetition rates facilitate fast throughput. Multiple user-selectable wavelengths (1064, 532, 355 and/or 266 nm) provide the ability to cut a variety of materials and selectively remove certain materials while leaving others unaffected. A standard, motorized X-Y aperture or high-resolution X-Y aperture allows for accurate cutting control.

The system's intuitive, microprocessor-based remote control panel is optimized for simple, straightforward operation. Alternately, the device can be controlled through an RS-232 interface.
 
Compact laser head mounts on high-volume production gantries as well as on most major-brand FA microscopes. Available with a wide range of options including microscopes, stages and accessories.
 
New Wave Research, www.new-wave.com 

 

MYDATA automation AB announces a new version of its machine control software: TPSys 2.4.3. Designed for high-mix production with sophisticated vision technology and networking capabilities. New features include faster assembly speed and a new calibration method (patent pending).

Placement area calibration methods tend to depend on large, dot-matrix calibration boards that are difficult to manufacture accurately, and are very sensitive to heat and moisture. The new calibration method utilizes a much smaller calibration device that is automatically moved to a number of predefined positions within the placement area. An advanced mathematical algorithm then combines the measurements from each position and calculates the correction data for the entire area. The result is more accurate calibration, using a calibration device that is insensitive to handling and storage conditions.   A number of functions for faster assembly speed have also been implemented. Improvements such as faster tool changes, faster conveyor board changes and faster board level measurement, along with improved optimization, can reportedly boost actual throughput by up to 15%. Features a simplified user interface for operators, and auto-teach of components up to 132 x 26 mm

Developments in the field of electronics manufacturing are characterized by growing demands on quality and throughput rate, as well as the increased use of miniaturization. Automatic optical inspection (AOI) has become one of the pre-requisites in satisfying the demand for zero-defect manufacturing concepts, particularly in small to medium-sized electronics production facilities. Viscom has responded to the requirements of the market and, with the S3088AV, now proudly offers a new AOI system with an attractive price-performance ratio.
 
S3088AV is a cost-optimised system with full reflow inspection capability. The inspection of PCBs is operated in single track mode, enabling the inspection of assemblies up to 400 x 350 mm (14.7 x 13.8"). Full program compatibility with the S6055 is guaranteed.
 
The 4M sensor technology is also used in this system, detecting defects in paste print, component placement and solder joints. The additional use of angled camera modules ensures full-depth inspection and detection of critical errors, such as lifted leads in the fine pitch range.
 
Further highlights include quick and easy program creation using EasyPro and simple program transfer. Additional modules are also available, including a rework station, post-classification station and off-line programming and SPC analysis.
 
Viscom AG, www.viscom.de

 

BP-3106 BGA Bumping Solder Paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil.

Applied using existing equipment, increasing the BGA substrate panel size and printing speed without extra investment in equipment such as BGA ball placement hoppers.

Said to exhibit excellent release properties, robust slump resistance and ultra-low voiding. Can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.

Standard packaging includes 500 g jars and 700 g Semco cartridges. Can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.   

Indium Corp., www.indium.com

 

 

Multicore TTC-LF allows soldering irons to be re-tinned, even when conventional methods such as sponges, pads or rosin-cored solder wire are not effective.

 

Applicable for lead and lead-free applications, the product is a small block of electronics lead-free grade solder powder and flux formed into the shape of a thick disk. For cleaning and de-wetting soldering irons, users need only wipe the tip of the soldering iron gently across the surface to produce local melting and then wipe as normal on a damp sponge to ready the iron for re-use.

Benefits include minimal residues, activators that thermally decompose into inert components and the ability to clean heavily oxidized metal surfaces such as copper and iron plated soldering tips.

Henkel, www.electronics.henkel.com

 

Polyclad Laminates Inc., a business of Cookson Electronics, has introduced Polyclad 250HR laminate and prepreg materials. With a 150°C glass transition temperature (Tg) and 350°C decomposition temperature (Td), is suited for mid-Tg, lead-free applications. The CAF-resistant materials maintain low expansion rates while retaining FR-4 processability.
 
Used in the manufacture of automobiles, computer servers, telecommunications devices and other electronics, said to offer exceptional IST thermal performance and reliability. Contains a multifunctional epoxy resin technology for reduced CTE.
 
Compatible with all commonly used FR-4 fabrication process techniques. Mechanical, chemical and moisture resistance meet or exceed the performance of competitive FR-4 material. Is laser fluorescing and UV blocking for maximum compatibility with AOI systems, optical positioning systems and photoimageable solder mask imaging.
 
Polyclad Laminates, www.polyclad.com 

A major upgrade to the CR-5000 enterprise-wide PCB design suite of tools includes 44 productivity enhancements in schematic capture, layout and simulation.

Version 8.01 is aimed at designers of high-complexity boards that use extreme miniaturization technologies such as embedded passives, flex circuits, high-density interconnects and FPGAs. Capabilities include RF design, design re-use and design partitioning  with core design strengths that meet the requirements of consumer and high-tech electronics applications. Built on the design structure and methodology of version 7.

Enhancements to schematic capture and analysis module include a net connect view, the ability to import and export net label and pin information in CSV format, new fault analysis functions and a property viewer that can be used during symbol re-load. The upgrades to the Board Designer placement and routing module mean that users have use of automatic area correction functionality, benefit from even deeper integration with mechanical CAD and can achieve more consistent star-point connections. The board layout tool can space tracks automatically based on the electrical potential difference between them, and has support for multiple bond wires.

Zuken, www.zuken.com

 

Vibration Isolation Mounts are ideal when designing or retrofitting sensitive OEM equipment where external isolation is not desired or is not suited to the application. Available in a variety of shapes and sizes with load capacities ranging from 200 to 20,000 lbs, and standard heights of 4", 6", 12" and 24".
 
Provide vertical and horizontal vibration isolation with low natural frequencies, automatic leveling and height control to within 0.005", and internal damping for improved stability. Have a standard blue polyurethane finish and are Class 100 cleanroom compatible.
 
Offered in active and slave configurations. Active mounts use the VIBRALEVEL Air Servo Valve to feed or bleed air from the mounts to maintain preset "zero deflection" and compensate for load changes. Slave mounts do not have Air Servo Valves but are controlled by one of the active mounts.
 
Options include a damping tank, a portable air compressor and a white epoxy-powder-coat finish for Class 10 cleanroom compatibility. 
 
Can also be used for steppers, laser trimmers, automated wafer inspection, profilometers and surface-measurement instruments.
 
Kinetic Systems Inc., www.kineticsystems.com

 

At SEMICON West, Speedline Technologies will spotlight the latest platform enhancements and developments of its soon to be released XyflexPro⁺Dispensing System.
 
Delivering an increased speed rating of more than 30% and twice the accuracy,
It features an advanced composite gantry design and linear drive system using motion control drive technology. Available as a standalone or in-line system, can be configured for a range of dispense applications within the electronics, automotive and medical industries.

Also on demonstration at booth 8705:  The XyflexPro HVB dual head dispense system and the Accel MicroCel cleaning platform.  
 
Speedline Technologies, speedlinetech.com