Products
AirMax VS signal connectors have passed both the RoHS and FCI Lead-Free qualification. While the AirMax VS Guides have always been available only as lead-free parts, the qualification of the signal connectors is the next step in ensuring that the VS family meets the environmental specification.
RoHS qualification included testing both receptacles and headers for insertion, retention and repair. The FCI lead-free qualification is an internal six-month test for whisker growth.
The test documentation report will be available in approximately three weeks.
VS connector system offers high-speed computing and networking designers versatility in structuring their backplane signal routing.
VS power connectors are in the process of being RoHS-qualified.
FCI, fciconnect.com
RoHS qualification included testing both receptacles and headers for insertion, retention and repair. The FCI lead-free qualification is an internal six-month test for whisker growth.
The test documentation report will be available in approximately three weeks.
VS connector system offers high-speed computing and networking designers versatility in structuring their backplane signal routing.
VS power connectors are in the process of being RoHS-qualified.
FCI, fciconnect.com
Mill-Max now offers a 7” mini reel to accommodate 8 & 12 mm carrier tapes.
Offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated pick-and-place equipment. A 7” reel holds about one quarter the parts of a 13” reel. Is more economic and convenient for smaller volume customers.
Two types of receptacles are available on carrier tape: surface-mount, flat types, which sit on the surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered.
Thru-hole (tubular) receptacles have an Organic Fibre Plug barrier which prevents solder paste or flux from contaminating the spring contact. After soldering, the barrier is pushed out of the receptacle when the device is plugged in.
Lead free plating options are available. Instead of traditional tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors can be specified.
Mill-Max Mfg. Corp., mill-max.com
Offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated pick-and-place equipment. A 7” reel holds about one quarter the parts of a 13” reel. Is more economic and convenient for smaller volume customers.
Two types of receptacles are available on carrier tape: surface-mount, flat types, which sit on the surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered.
Thru-hole (tubular) receptacles have an Organic Fibre Plug barrier which prevents solder paste or flux from contaminating the spring contact. After soldering, the barrier is pushed out of the receptacle when the device is plugged in.
Lead free plating options are available. Instead of traditional tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors can be specified.
Mill-Max Mfg. Corp., mill-max.com
Ground Pro ground integrity meter measures tool and facility ground parameters, including connectivity and noise.
The handheld, portable instrument measures impedance in compliance with ANSI 6.1 and ESDA S20.20 requirements.
Measures three important ground parameters:
1) Impedance Meter - Measures the true value in Ohms on ground regardless of ground currents and noise/EMI that is common on working tools, with alarm threshold settings.
2) High Frequency (EMI) Signal Meter - Measures the peak and average of the high frequency (EMI) signals traveling in the tool or facility ground. User defined alarm thresholds will audibly warn of high frequency (EMI) signals above preset levels.
3) AC Voltage Meter - Measures the AC voltage on ground, if ground is miswired accidentally, as with the other features, an audible alarm indication with notify the user.
Credence Technologies, credencetech.com
The handheld, portable instrument measures impedance in compliance with ANSI 6.1 and ESDA S20.20 requirements.
Measures three important ground parameters:
1) Impedance Meter - Measures the true value in Ohms on ground regardless of ground currents and noise/EMI that is common on working tools, with alarm threshold settings.
2) High Frequency (EMI) Signal Meter - Measures the peak and average of the high frequency (EMI) signals traveling in the tool or facility ground. User defined alarm thresholds will audibly warn of high frequency (EMI) signals above preset levels.
3) AC Voltage Meter - Measures the AC voltage on ground, if ground is miswired accidentally, as with the other features, an audible alarm indication with notify the user.
Credence Technologies, credencetech.com
Speedline offers two options for its Electrovert Electra, Vectra and Econopak Gold wave soldering systems .
The Quick-Change Solder Pot allows for easy changeover between tin/lead and lead-free alloys. It is inserted in a cart on rollers, making it simple to move the pot to and from a storage location.
Cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 315ºC (600ºF). All stainless steel components that come into contact with the solder are composed of ElectroCoat corrosion-resistive surface conversion as a standard feature, or titanium as an option.
UltraFill Lead-Free nozzles are 40% wider than traditional tin/lead nozzles to increase contact length and dwell time. Are also placed closer together to reduce the temperature drop between nozzles – so less heat is needed to reflow solder joints in the second wave. Reportedly deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.
Nitrogen shroud is available as an option – and allows for either air or nitrogen operation without the need to change nozzles. The shroud encompasses the nozzles in the pot and contains the dross in the solder pot. It lifts for easy maintenance and dedrossing – without nozzle removal.
Speedline Technologies, speedlinetech.com
The Quick-Change Solder Pot allows for easy changeover between tin/lead and lead-free alloys. It is inserted in a cart on rollers, making it simple to move the pot to and from a storage location.
Cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 315ºC (600ºF). All stainless steel components that come into contact with the solder are composed of ElectroCoat corrosion-resistive surface conversion as a standard feature, or titanium as an option.
UltraFill Lead-Free nozzles are 40% wider than traditional tin/lead nozzles to increase contact length and dwell time. Are also placed closer together to reduce the temperature drop between nozzles – so less heat is needed to reflow solder joints in the second wave. Reportedly deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.
Nitrogen shroud is available as an option – and allows for either air or nitrogen operation without the need to change nozzles. The shroud encompasses the nozzles in the pot and contains the dross in the solder pot. It lifts for easy maintenance and dedrossing – without nozzle removal.
Speedline Technologies, speedlinetech.com
With the release of BP Win 4.54, all newly manufactured device programmers will ship standard with USB 2.0 communication interface.
The new product line -- 1410/84, 1410/240,1610, 2610, 3610, 4610 -- replaces earlier programmer models that used a parallel port to communicate from the PC to the programmer.
New programmer models also reportedly feature an average increased programming speed of 20%.
USB 2.0 upgrade kits are also available for existing customers using 6th and 7th Generation manual programmers.
New device programmers are supported in Windows 2000 and XP.
BP Microsystems, www.bpmicro.com
Arlink Workstation Systems announces an expanded range of workstation accessories. Over 80 individual items in eight product categories for all standard module widths are offered.
New items include Variable Angle and Packing Bench Shelving, Switchable 2/4 Bulb Lamp Fixtures, Reversible Tack and White Boards, Modular Data Beams, Steel Parts Bin and Pegboard Panels.
All accessories are forward and backward compatible with systems already installed in the field and those shipping today.
Arlink, www.arlink.com
New items include Variable Angle and Packing Bench Shelving, Switchable 2/4 Bulb Lamp Fixtures, Reversible Tack and White Boards, Modular Data Beams, Steel Parts Bin and Pegboard Panels.
All accessories are forward and backward compatible with systems already installed in the field and those shipping today.
Arlink, www.arlink.com
The ECA launched a digital library (available at ec-central.org) that contains more than 300 technical papers taken from proceedings of recent CARTS and ECTC conferences.
It enables visitors to search for individual conference papers by event name, title and keyword. Papers can be purchased as PDFs and downloaded for $10 (ECA members) or $20 (non-members). The library is soon expected to double in size and include papers from additional CARTS and ECTC events, the annual relay and switch forum (IRSTC), and the wire and cable symposium (IWCS).
The Electronic Components, Assemblies & Materials Association (ECA), ec-central.org
XF-581 (1 mil) and XF-582 (2 mil) thermal transfer printable white polyimide label stocks were provided to Zestron America for compatibility tests with water-based and solvent-based agents.
Both materials were tested before and after reflowing various PCBs. In all cases, print remained clear with no visible effects.
The polyimide label materials coated with a permanent pressure-sensitive acrylic adhesive and a high opacity, medium gloss white topcoat are designed for thermal transfer printing. Barcode labels made from the material reportedly demonstrate excellent performance in lead-free wave solder environments, which range from 260º to 290ºC.
Designed for barcode or alphanumeric identification of PCBs or related electronic components. Can withstand mixed circuit board processes on top or bottom side of the board. Said to have excellent resistance to harsh fluxes, cleaning agents, saponifiers and wave solder environments.
Polyonics, www.polyonics.com
Both materials were tested before and after reflowing various PCBs. In all cases, print remained clear with no visible effects.
The polyimide label materials coated with a permanent pressure-sensitive acrylic adhesive and a high opacity, medium gloss white topcoat are designed for thermal transfer printing. Barcode labels made from the material reportedly demonstrate excellent performance in lead-free wave solder environments, which range from 260º to 290ºC.
Designed for barcode or alphanumeric identification of PCBs or related electronic components. Can withstand mixed circuit board processes on top or bottom side of the board. Said to have excellent resistance to harsh fluxes, cleaning agents, saponifiers and wave solder environments.
Polyonics, www.polyonics.com
PowerMod connectors are RoHS compliant for Pb-free reflow soldering and are offered in three to 30 circuits with a maximum current of 30 amps.
Manufactured from high-temperature plastic Polyphenylene Sulfide (PPS). Has 285°C melt temperature, ideal for lead-free processes which may have a peak re-flow temperature of 260°C.
Available in straight PCB, right angle PCB, panel or cable mountings.
Manufactured from high-temperature plastic Polyphenylene Sulfide (PPS). Has 285°C melt temperature, ideal for lead-free processes which may have a peak re-flow temperature of 260°C.
Available in straight PCB, right angle PCB, panel or cable mountings.
Anderson Power Products, www.andersonpower.com
BEST has introduced PCB circuit trace repair kits and materials to repair circuit traces of PCBs.
Kit includes “how to” slides, a large selection of different trace widths and thicknesses and the tools required to make the repairs. Offer a variety of tools to reduce the amount of time spent trimming circuit frames.
Business Electronics Soldering Technologies (BEST), www.solder.net
Kit includes “how to” slides, a large selection of different trace widths and thicknesses and the tools required to make the repairs. Offer a variety of tools to reduce the amount of time spent trimming circuit frames.
Business Electronics Soldering Technologies (BEST), www.solder.net
RoHStat procducts, including containers, mats, cords, wrist straps and heel grounders, are recommended for use in lead-free assembly/production areas. Contain no lead, carbon, cadmium, chromium, bromine, mercury or vinyl plasticizers, meets RoHS and Class Zero U.S. and European standards.
Static Solutions, staticsolutions.com
DEK has reportedly applied its mass imaging techniques to improve the uniformity of Thermal Interface Material (TIM) deposited between a silicon die and its package lid during semiconductor packaging. By using ProFlow DirEKt Imaging to mass image the TIM, semiconductor manufacturers can ensure uniform material thickness across the entire die surface. Advantages include better thermal conductivity between the die and the lid, which improves reliability and delivers greater lid coplanarity.
"Mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM," says Richard Heimsch, president. "Additionally, DEK's process makes it easier to verify uniform spreading and absence of voids before the package lid is assembled."
During the TIM process, die assembled onto substrates enter a flexible printing system that combines three processes - passive attach, TIM and lid sealing - into a single platform. The single printing system allows customers to re-deploy equipment between processes to meet changing manufacturing requirements and allows single-platform operator training.
Compared to traditional, serial dispensing, the parallel mass imaging process is said to increase true throughput and deliver greater control over the volume of material deposited. This technique also allows the shape of the TIM deposit to be more accurately controlled. Because the process does not require the TIM to be spread via lid placement, defects such as material voids or incomplete spreading are reportedly eliminated.
DEK, dek.com
"Mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM," says Richard Heimsch, president. "Additionally, DEK's process makes it easier to verify uniform spreading and absence of voids before the package lid is assembled."
During the TIM process, die assembled onto substrates enter a flexible printing system that combines three processes - passive attach, TIM and lid sealing - into a single platform. The single printing system allows customers to re-deploy equipment between processes to meet changing manufacturing requirements and allows single-platform operator training.
Compared to traditional, serial dispensing, the parallel mass imaging process is said to increase true throughput and deliver greater control over the volume of material deposited. This technique also allows the shape of the TIM deposit to be more accurately controlled. Because the process does not require the TIM to be spread via lid placement, defects such as material voids or incomplete spreading are reportedly eliminated.
DEK, dek.com
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing