IRVINE, CA, Jan. 5 -- Henkel Electronics Group has opened a state-of the-art research and applications center here and relocated its global headquarters to the site. The center will be fully operational later this month.

The 53,000 sq. ft. facility will house R&D and applications engineering for the company's die attach, semiconductor underfill, encapsulant and semiconductor mold compound products.

The company's electronics assembly materials headquarters will also move to the site.

"Combining the research and development operation with applications engineering has many benefits," says Dr. Larry Crane, global director of semiconductor research, development and engineering, in a press statement. "This shared expertise gives us the ability to enhance the coordination of customer projects, streamline product introductions, build and test parts for customers and bring advanced materials to market more quickly."

The facility houses a cutting-edge R&D lab, including an analytical and failure analysis lab. It boasts a 5,000 sq. ft. Class 10,000 cleanroom, for semiconductor applications, and a 2,000 sq. ft. surface mount production line.

Henkel said it plans several new facilities worldwide.

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