by Mike Buetow
Jan. 14, West Haven, CT - Enthone Inc. will discuss the latest in lead-free final finishes and microvia metalization during a series of presentations at an upcoming trade show.

Enthone will sponsor 30-minute presentations at the booth of its parent company, Cookson Electronics, during IPC Apex/Printed Circuits Expo. The sessions will provide the most recent advancements in.  The include:

Presentations will cover advancements in microvia fill applications using patented direct metalization and copper via fill systems, and lead-free silver finish OSPs said to be able of handling multiple reflows.

Presentations will be made on Feb. 22 and 23. Seating is limited; email Barry Lee Cohen at bcohen@cooksonelectronics.com to reserve.

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