FRANKLIN, MA – Speedline Technologies will address the issues involved with the challenge of tin whiskers in SMT manufacturing during a free, live, one-hour Web seminar on Thursday, Nov. 17, at 11 a.m., EST
 
The challenge of tin whiskers – the small protrusions of tin that can grow from tin-plated surfaces, causing electrical short circuits – has plagued the electronics industry for years. Concern has recently accelerated with the use of lead-free solders that are high in tin content.
 
Especially troublesome for high reliability applications such as military, medical and automotive manufacturing, research into the cause – and cure for – tin whiskers continues. Most agree that the whiskers are caused by the compressive stress of the tin-plating process. 
 
Topics will include causes and types of tin whiskers; prevention of whiskers; and where to find additional information on the phenomenon.
 
For more info. and to register, visit speedlinetech.com/seminars

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