FRANKLIN, MA, Dec. 21 - Leading experts will explore SMT process challenges in a new series of free technical webcasts kicking off in January.

The events are sponsored by Speedline Technologies and are open to qualified individuals who register through the company's Web site.

"Speedline has designed these seminars to explore and deliver the in-depth information and how-to insight to help process engineers manage and control the major issues and challenges they will face daily throughout 2005," said Pierre de Villemejane, Speedline's president.

Each of the one-hour seminars will explore one of these challenges in a major manufacturing process - including lead-free wave and reflow, fine-pitch printing and underfill dispensing.

Hosted by experts who have been developing and implementing manufacturing techniques for more than 20 years, the sessions will include discussions of manufacturing floor challenges, new technologies, how-to implementation information and question-and-answer periods. Seminars begin at 11 a.m. Eastern.

• Jan. 19: Statistical Process Control & Design of Experiments
• Feb. 17: Lead-Free Overview
• Mar. 17: Lead-Free Wave Soldering
• Apr. 14: Lead-Free Reflow Soldering
• May 17: Lead-Free Reflow Soldering Power and Nitrogen Consumption
• Jun. 16: Underfill Dispensing
• July 21: Fine Pitch Printing
• Aug. 18: Lead-Free Overview
• Sept. 15: Lead-Free Wave Soldering
• Oct. 20: Lead-Free Reflow Soldering
• Nov. 17: Tin Whiskers
• Dec. 15: Fine Pitch Printing.

To register visit www.speedlinetech.com/seminars or call 508-541-4749.

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