Minneapolis, MN - The SMTA's Pan Pacific Microelectronics Symposium & Exhibit (smta.org/pan_pac/) will take place Jan. 25-27, 2005, at the Sheraton Kauai Resort in Kauai, HI. Kei Biu, of SMT Corp, will give the keynote presentation on Green Electronics in China.

The technical program will consist of sessions on 3-D Chip Stacking, System in Package (SiP), RF & Sensor Technologies, High Performance Packaging and Assembly Management Strategies.

Additional sessions will cover Pb-Free Reliability, Solder and Rework Processes, Pb-free Microstructures and Performance, Pb-free Implementation, Package Solder Joint Reliability and Electronic Adhesives, Chip Attach and Materials Technologies, Cleaning and Surface Treatments, Packaging and Assembly Trends, and Inspection and Test.

The event averages more than 100 participants annually from 15 different countries throughout Europe, the Americas and the Pacific Basin. 

For more information, contact JoAnn Stromberg: 952-920-7682; joann@smta.org.

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