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WILLOW GROVE, PA – A potential low-cost cure for Microsoft’s recently publicized billion-dollar Xbox reliability headache is being recommended by an SMT assembly equipment manufacturer in conjunction with a German rework specialist.
 
The problem, according to these sources, lies in the defective soldering of components to the boards at the point of original manufacture. When several Xbox video game boards were subjected to microscopic x-ray inspection, flaws revealed damaged CSP memory chips mounted on each PCB.
 
These were the conclusions arrived at jointly by Henry Mann, CEO of Manncorp, and Bernhard Martin, a manufacturer and rework equipment and surface mount quality control specialist.
 
According to the pair, the Xbox defects can be easily and inexpensively corrected with rework equipment similar to that used to repair Nokia and Siemens cellphones that also faced service issues. The solution involves individually reheating the improperly soldered devices without their removal, and resoldering each with carefully controlled above and below-board heat. A nozzle is placed above the component to localize this thermal transfer.

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