FORT WASHINGTON, PA – Kulicke & Soffa will acquire Alphasem, supplier of die bonder equipment, from Dover Technologies for $30 million, subject to a working capital adjustment. The acquisition is expected to close around Nov. 3, K&S said today.
 
In a statement, vice president Christian Rheault, called the acquisition “a natural extension of K&S’s core equipment business into die bonding equipment. The die bonding process precedes the wire bonding step in semiconductor chip manufacturing, and normally utilizes adjacent floor space and a common engineering team. This supplier consolidation will enhance our ability to provide solutions to our customers across a greater span of the semiconductor assembly process.” 
 

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