MORRISVILLE, NC – The deadline to complete iNEMI’s survey on low-temperature solder readiness for high-volume board assembly is Dec. 6.
The survey assesses the planning and readiness levels of the electronics manufacturing industry for the implementation of low-temperature solders in high-volume board assembly.
The survey takes approximately 10 minutes to complete and focuses on the timeline to implementation, the level of effort required to ensure high-volume manufacturing capabilities and looks to identify open issues that need to be addressed.
A summary of survey results will be presented in an iNEMI webinar in the first quarter of 2020.
To take the survey, visit https://tinyurl.com/w8gfyvf.