MORRISVILLE, NC – The deadline to complete iNEMI’s survey on low-temperature solder readiness for high-volume board assembly is Dec. 6.

The survey assesses the planning and readiness levels of the electronics manufacturing industry for the implementation of low-temperature solders in high-volume board assembly.

The survey takes approximately 10 minutes to complete and focuses on the timeline to implementation, the level of effort required to ensure high-volume manufacturing capabilities and looks to identify open issues that need to be addressed.

A summary of survey results will be presented in an iNEMI webinar in the first quarter of 2020.

To take the survey, visit


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