Buran B100 screen printer has a print format of 75 x 75mm to 508 x 508mm. Repeatability said to be -/±15μm @ 6 Sigma. Cycle time is 12 sec. (without print). Handles PCB of thicknesses ranging from 1 to 6mm. Single lane conveyor. Optical positioning system consists of two high-resolution cameras: 2D inspection system for post-print and stencil bottom-side control. Automatic programmable stencil cleaning system.

Dial-Electrolux, www.DialElectrolux.ru

MX80 pick-and-place system assembles SMT components from 0201 to 35 x 35mm with a full vision, touchless component centering. Pattern recognition system is easy to use. Built-in intelligent vision system enables picking of bulk (loose) components from container-type feeders or trays. Placement area 325 x 500mm. Has 80 feeder slots for 8 mm tapes + 30 sticks of SO8 - Placement rate 4000 cph. Placement accuracy said to be better than 0.08mm, and X/Y resolution is 5 microns. Linear encoders standard. Automatic fiducial correction and bad mark sensing.

Mechatronika, www.Mechatronika.com.pl

M70 fully automatic SMT placement machine assembly offers flexible Feeding options for bulk components. Optical component centering. Optional fully automatic precision dispenser for solder paste and SMD adhesives. For small to medium volume production. Accepts circuit boards up to 350 x 500mm. Places parts ranging from 0201 to 35 x 35mm and 0.5mm pitch. Has 80 sampling positions for 8mm straps. Placement rate 1,500-1,800 cph. X/Y resolution is 10 microns, and placement accuracy is better than 0.1mm.

Mechatronika, www.mechatronika.com.pl

SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).

Goepel, www.goepel.com

ProtoLaser 3D has a large, height-adjustable working platform and a laser optic, which corresponds to ones used in production systems. Is for series-like 3D rapid prototyping and process optimization. Is based on the ProtoLaser concept, where working chamber is housed vibration-decoupled in a compact body.

LPKF, www.lpkf.com

Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.

Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.

Martin, a Finetech Co., www.martin-smt.de

SpectorBOX bottom-up modular AOI is for inspection of wave and selective soldered plated through-hole and SMT components. Inspects PCBs inside solder frames directly from the conveyor system. Can be equipped with nine cameras, including an optional Z-axis moveable head. XY drive gantry with ball screw mechanics delivers high-speed inspection. 100% simultaneous inspection can be accomplished with two platform modules combined for bottom and top sides. Accommodates board sizes up to 550 x 520mm.

MEK Europe, www.mek-europe.com

3800-MK2 automated programming system combines universal programming technology, 8th gen., with a fine-pitch handling system. Reportedly is capable of processing programmable devices from the largest QFP to the smallest WLBGA. Includes vision and pneumatic systems that provide VSP support. Provides accuracy and repeatability for packages as small as 1mm x 0.5mm. Can simultaneously support tape, tray, tube and marking.

BPM Microsystems, www.bpmmicro.com

5860 multi-strategy test system combines analogue in-circuit test and functional test capabilities. Combines panel and larger cabinet space for additional instrumentation. When coupled with inline fixture, it provides automated production test solution. Is SMEMA-compliant.

Aeroflex Holding Corp., www.aeroflex.com

Multi-Site configurations of TestStation in-circuit test system are available. Support parallel test of two or more boards. Are available for automated inline and manual offline use. Feature zero-footprint test head that fits within existing handler enclosure. Deliver parallel testing for 6-wire performance analog and digital in-circuit test, functional test, boundary scan, flash programming and parametric test options.

Teradyne, www.teradyne.com

Nanofics 110 and Nanofics 120 nanocoatings for conformal coating electronics devices are said to be highly water repellent (water contact angles of 110 and 120 degrees, respectively, according to ASTM D5964) and highly oil repellent (oil repellency levels of 6 and 8, respectively, according to ISO 14419). Are fluoropolymer type coatings, and are deposited by low pressure plasma technology. Are PFOA and PFOS-free. May be applied to components or PCBs, and protect against corrosion from sweat or salt mist. Can be applied to rigid or flexible substrates.

Europlasma, www.europlasma.be

Loctite TAF thermal absorbent films reportedly lower CPU and skin temperature of handheld devices by more than 3°C. Can absorb, spread, insulate and dissipate thermal energy generated by ICs. Create airflow route through which hot air can move out of device. Regulate heat and management of CPU temperature rise and fall. Are available in customized, pre-cut sizes and thicknesses. Film thickness and layer constructions can be adapted to create thinner or thicker solutions with multi-axis contourability.

Henkel, www.henkel.com/electronics