Circuits Assembly Online Magazine - Features

Features Articles

You might say humans are predisposed to chatting. The art has taken a few twists and turns over time: In the past 50 years the back-fence gossip session gave way to party lines (for some), then to online means so popular and ubiquitous it made AOL for a time one of the most valuable companies in the US.

How design miniaturization drives Lean manufacturing and prevailing industry trends.

Anyone with a smartphone, tablet or digital camera recognizes that electronic devices are getting smaller. And, consumer delight with smaller electronics drives miniaturization trends in other industries.

Boundary scan is the present and the future. Are you ready?

Boundary scan has been widely adopted to maintain test coverage and board quality.

3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.

A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.

How to capture color values and light intensity.

The world of light-emitting diodes has seen a plethora of new applications in various devices, with vast improvements in energy efficiency, a wide range of color, longer lifecycles and so on.

Lean principles apply to sourcing strategy and manufacturing execution.

Successfully competing in the market still means having the high-quality products your market wants, when and where they want them. However, the new twist is competing globally for available material, while maintaining enough operational efficiency to price competitively and still make a profit.