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Features Articles


Options abound, but the paradigm of where and how to proceed has changed.

As I begin focusing on the New Year, I can’t help but reflect at least a little on the year just ended. I spent a lot of time in various meetings, workshops, presentations and industry gatherings focused on supply-chain issues.

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You might say humans are predisposed to chatting. The art has taken a few twists and turns over time: In the past 50 years the back-fence gossip session gave way to party lines (for some), then to online means so popular and ubiquitous it made AOL for a time one of the most valuable companies in the US.

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How design miniaturization drives Lean manufacturing and prevailing industry trends.

Anyone with a smartphone, tablet or digital camera recognizes that electronic devices are getting smaller. And, consumer delight with smaller electronics drives miniaturization trends in other industries.

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Boundary scan is the present and the future. Are you ready?

Boundary scan has been widely adopted to maintain test coverage and board quality.

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3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.

A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.

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How to capture color values and light intensity.

The world of light-emitting diodes has seen a plethora of new applications in various devices, with vast improvements in energy efficiency, a wide range of color, longer lifecycles and so on.

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