Forefront
InterNepcon spotlighted advancements in automotive electronics, lighting and wearables.
Cost remains king, even as buildup substrates take hold.
In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages.
Press Releases
- ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
- NCMS Releases White Paper: “Artificial Intelligence to Improve Supply Chain Resilience Throughout American Manufacturing”
- E-tronix Expands Team with Strategic Hires to Strengthen Technical Solutions Support in 2025
- Leading Defence Manufacturer Awards Kitron Order for Deliveries to U.S. Army