As our company celebrates its silver anniversary, I started to reminisce about the progress made in the electronics industry over the last 25 years. It has been a remarkable journey.
A cloudy global economic forecast is causing uncertainty among many corporations, even those in the electronics industry. While last year’s worries were caused by natural disasters, 2012 fears are manmade.
A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.
Once upon a time, there were many major computer makers in the world, and they developed and marketed expensive high end computational systems, spent a lot of money developing cool technology, and had impressive manufacturing operations.
Old technologies never die; they just get new names. Flex circuits have been around for many years in the IC packaging business and have been called almost as many names. In the early days, it was tape automated bonding (TAB).