Forefront
Cost remains king, even as buildup substrates take hold.
In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages.
The author celebrates her quadranscentennial and considers the next one.
As our company celebrates its silver anniversary, I started to reminisce about the progress made in the electronics industry over the last 25 years. It has been a remarkable journey.
The supply chain was hit hard in 2011. It’s unclear whether 2012 will bring a reprieve.
A cloudy global economic forecast is causing uncertainty among many corporations, even those in the electronics industry. While last year’s worries were caused by natural disasters, 2012 fears are manmade.
3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.
A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing