Forefront
The author celebrates her quadranscentennial and considers the next one.
As our company celebrates its silver anniversary, I started to reminisce about the progress made in the electronics industry over the last 25 years. It has been a remarkable journey.
The supply chain was hit hard in 2011. It’s unclear whether 2012 will bring a reprieve.
A cloudy global economic forecast is causing uncertainty among many corporations, even those in the electronics industry. While last year’s worries were caused by natural disasters, 2012 fears are manmade.
3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.
A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.
The money needed to play in the highest-performance space has forced everyone but IBM to the sidelines.
Once upon a time, there were many major computer makers in the world, and they developed and marketed expensive high end computational systems, spent a lot of money developing cool technology, and had impressive manufacturing operations.
The age-old technology is seeing new life in medical and other applications.
Old technologies never die; they just get new names. Flex circuits have been around for many years in the IC packaging business and have been called almost as many names. In the early days, it was tape automated bonding (TAB).
Press Releases
- KYZEN Announces Exclusive Partnership with Manufacturers’ Representative Restronics Florida
- Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany
- Precision Automation & Assembly Appointed as New England Rep for Kubler US
- Precision Automation & Assembly Appointed as New England Rep for Kubler US