Forefront
Cost remains king, even as buildup substrates take hold.
In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages.
The author celebrates her quadranscentennial and considers the next one.
As our company celebrates its silver anniversary, I started to reminisce about the progress made in the electronics industry over the last 25 years. It has been a remarkable journey.
Press Releases
- MaRCTech2 Hires Kiersten Kreusser as Solutions Expert for Oregon and Southwest Washington
- OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology
- ECIA Announces 2026 Executive Conference Core Committee Members
- Arbell Electronics Named Zestron's 2026 Distributor of the Year at APEX EXPO