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LAS VEGAS -- Work on the latest revision to the industry standard for soldered electrical and electronic assemblies has begun, with the task group focused on vertical solder fill for Class 2 product and BGA voiding, among other topics.

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HANOI -- Samsung Electronics will invest $300 million in a new research and development project here in exchange for free rent.

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TAIPEI -- Foxconn will hold a scheduled board meeting this week as its deal to acquire Sharp continues to twist and turn in the financial wind.

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ELK GROVE, CA -- A California-based EMS company is planning a second facility here, enticed by local incentives and industry trends toward onshoring.

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BANNOCKBURN, IL – IPC presented IPC Rising Star Awards at Apex Expo to Steven Bowles, L-3 Fuzing and Ordnance Systems; Stan Rak, Continental Automotive; Matt Turpin, Zentech Manufacturing; and Peter Zhou, Huawei Technologies.

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NORTH YORK, ONTARIO -- ZTest Electronics has decided not to proceed with an expansion of its Permatech Electronics subsidiary and has abandoned a previously announced private placement.

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