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Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.
Sustained ring soldering module permits preassembled solder rings to be placed on and around THT pins, which are then melted by laser, piston or induction soldering, or IR emitters, hot air or thermodes.
RMCA series is AEC-qualified and has excellent long-term reliability for automotive applications.
iPure-1 high-capacity fume extraction system was developed for high-capacity dispensing and conformal coating line applications and adsorption of harmful volatile organic compounds emitted during these processes.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin
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- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization