QuikLaze 50ST2 Laser Cutting System for quick, easy removal of a variety of materialsfeatures multiple wavelength coverage and user-selectable repetition rates from single shot to 50-Hz continuous. Suited for semiconductor design verification, failure analysis and LCD repair. Specific applications include removal of ITO shorts in LCD panels, removal of polyimide prior to FIB edits and color-filter repairs.

Enables precise cutting on a microscopic level. Selectable repetition rates facilitate fast throughput. Multiple user-selectable wavelengths (1064, 532, 355 and/or 266 nm) provide the ability to cut a variety of materials and selectively remove certain materials while leaving others unaffected. A standard, motorized X-Y aperture or high-resolution X-Y aperture allows for accurate cutting control.

The system's intuitive, microprocessor-based remote control panel is optimized for simple, straightforward operation. Alternately, the device can be controlled through an RS-232 interface.
 
Compact laser head mounts on high-volume production gantries as well as on most major-brand FA microscopes. Available with a wide range of options including microscopes, stages and accessories.
 
New Wave Research, www.new-wave.com 

 

• Prev
• Next