News
BINGHAMTON, NY -- Universal Instruments today said its global market share rose nearly 2% year-over- year in the fourth quarter.
SCHAUMBURG, IL -- Sparton reported fiscal second-quarter net income rose 36% to $1.9 million, boosted by higher demand in all its end-markets.
ST. LOUIS -- Viasystems Group forecast December quarter sales of $269 million, up 10% year-over-year and down 4% sequentially on broad-based strength.
HELSINKI -- Nokia will lay off 8% -- some 4,000 employees -- of its workforce in Finland, Hungary and Mexico as part of its now year-long cost-cutting measures.
MINNEAPOLIS, MN – The SMTA is soliciting applications from full-time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant.
TEMPE, AZ – Finetech plans to donate a die bonder in a drawing this summer open to qualified US and Canadian universities and colleges.
The multi-application Pico MA bonder with 5 µm placement accuracy is valued at $100,000. The platform is for advanced packaging and assembly applications, such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging, and precise die bonding.
Finetech celebrates its 20th anniversary this year.
Press Releases
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- ZTEST Electronics Inc. Announces Transition to the OTCID Market
- SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
- Coherix Unveils Industry-First Service Program for Adhesive Dispensing Systems
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