Circuits Assembly Online Magazine - BP Micro to Support ZiLog MCU Devices

NEWS

GPV Reports Solid Q2 Performance

GPV, Europe’s second-largest EMS provider, reported stable sales and higher earnings in the second quarter. The company posted quarterly sal... Read More...

VVDN Expands with New UAE Facility

FREMONT, CA – VVDN Technologies has announced the establishment of a new manufacturing facility in the United Arab Emirates, expanding its g... Read More...

VVDN Acquires GGS Engineering

FREMONT, CA – VVDN Technologies has acquired GGS Engineering Services, expanding its engineering research and development (ER D) portfolio a... Read More...

Kimball Electronics Q4 Sales Down 11.6% YoY

JASPER, IN – Kimball Electronics reported fiscal fourth-quarter 2025 net sales of $380.5 million, down 11.6% from the prior year but up 2% s... Read More...

FPGA Horizons Conference to Colocate with PCB East 2026

PEACHTREE CITY, GA – AUGUST 14, 2025 – The Printed Circuit Engineering Association (PCEA) today announced FPGA Horizons will colocate its te... Read More...

EETech Acquires AI-Driven Breadboard Platform

BOISE, IDAHO – EETech Group has acquired Breadboard, an AI-powered supply chain automation platform, in a move set to create a new category ... Read More...

ASMPT to Shut Shenzhen Plant

SHENZHEN – ASMPT will close its Advanced Semiconductor Equipment (Shenzhen) facility in Bao’an District, affecting about 950 employees as pa... Read More...

Aimtron Electronics Posts 85% YoY Revenue Growth

VADODARA – Aimtron Electronics reported 85% year-over-year revenue growth for the first quarter, reaching ₹43.30, while its order book surge... Read More...

SIA Responds to Proposed Tariffs on Semiconductors

WASHINGTON – The Semiconductor Industry Association (SIA) issued a statement in response to President Trump’s announcement of a proposed 100... Read More...

FEATURES

Agentic AI: The Future of the Electronics Manufacturing Supply Chain

Initiating complex workflows with simple text commands. The 21st century has stress-tested the global supply chain. Climate shocks and geopolitical flare-ups h... Read More...

Elements of PCB Panelization

Panelize to optimize: faster builds, better boards. In the printed circuit board manufacturing stage, panelization – physically linking many smaller, identical... Read More...

Choosing the Right Surface Finish for a PCB

Balancing environmental exposure, component type, shelf life, production volume and regulatory compliance – and cost. While printed circuit board designers oft... Read More...

The Hidden Potential of Excess and Obsolete Component Inventory

Recouping value from excess stock. If manufacturers understood the true value and opportunity of their excess and obsolete (E O) electronic component stock, th... Read More...

When Do You Need Nitrogen in Reflow?

Hint: A good process might be enough. Nitrogen in reflow soldering is often seen as a performance enhancer – offering improved wetting, shinier joints and fewe... Read More...

Breaking the Six Sigma Wall with Causal AI

How Siemens lowered its PCB assembly defect rate through linked data analysis. The introduction of causal AI has opened a new chapter in PCB production. As par... Read More...

Mechatronics Assembly Techniques You Should Be Using in 2025

Ten techniques to ensure a smooth end-to-end process. From medical devices to monitoring systems, products are becoming smaller, smarter and more complex to ma... Read More...

Factors Contributing to Solder Ball Formation: A Guide

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form o... Read More...

Component Land Patterns: A Primer

A manufacturer’s perspective on determining parts layout. A land pattern refers to the footprint or layout of surface-mount components on a printed circuit boa... Read More...