Circuits Assembly Online Magazine - Simclar Turns in Strong June Quarter

NEWS

OH Manufacturer to Invest $2.7M in Production Expansions

LYNCHBURG, OH – Mirac Tabronics, an Ohio-based electronics manufacturer, has announced a $2.7 million investment to enhance its capabilities... Read More...

Flex Announces 2% Increase in Q3 Revenue

AUSTIN, TX – Flex saw revenue of $6.56 billion for the third quarter of its fiscal year, up 2.1% from the same quarter last year. Read More...

Benchmark Sees 3.7% Decline in Annual Revenue

TEMPE, AZ – Benchmark Electronics announced full-year revenue of $2.7 billion, down 3.7% from 2023's revenue. Read More...

CIRCUITS ASSEMBLY Opens Registration for 2025 Service Excellence Awards

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today opened registration for its annual Service Excellence Awards (SEAs) for EMS providers and elect... Read More...

Celestica Announces 21% Increase in Annual Revenue

TORONTO – Celestica reported annual revenue of $9.65 billion, up 21,2% from 2023's total. Read More...

ACT Group Acquires UK-Based Assembler Active-PCB

READING, UK – UK-based electronics manufacturer Active-PCB has announced its acquisition by Agile Circuit Technologies Group. Read More...

Syrma Sees 24% Increase in Quarterly Revenue

CHENNAI, INDIA – Syrma SGS Technology saw revenue of INR8.9 billion ($102.7 million) for the third quarter of its fiscal year, marking a 24%... Read More...

Note Announces 6% Decline in Annual Revenue

STOCKHOLM – Note reported full-year revenue of SEK3.9 billion ($353 million), down 6% from 2023. Read More...

Electronic Component Sales Sentiment Sees Encouraging Start to 2025

ATLANTA – With a score that broke solidly above the 100-point threshold in January for the overall component average, the year got off to an... Read More...

FEATURES

Understanding Solder Paste Viscosity and Thixotropy

Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe... Read More...

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ... Read More...

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te... Read More...

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef... Read More...

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...