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NEWS

PCEA Issues Call for Abstracts for PCB West 2025

PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) today issued a call for abstracts for the PCB West (https://www.pcbw... Read More...

VS Industry on Track for Growth in 2025

SENAI, MALAYSIA – VS Industry will remain on a growth track in 2025 on the back of its leadership in trade diversion and ongoing contract di... Read More...

Flex Completes Acquisition of Power Distribution Firm

AUSTIN, TX – Flex has completed the previously announced acquisition of Crown Technical Systems, a provider of integrated power distribution... Read More...

Nano Dimension Reports Record Q3 Results

WALTHAM, MA – Nano Dimension announced third quarter revenue of $14.9 million, an increase of 22.1% from last year's third quarter. Read More...

CIRCUITS ASSEMBLY Opens 2025 NPI Award Registration

PEACHTREE CITY, GA – Printed Circuit Engineering Association (PCEA) today opened registration for the 2025 New Product Introduction (NPI) Aw... Read More...

Foxconn to Build Facilities in US, Mexico, Taiwan

TAIPEI – Foxconn will build new physical robotics factories in the US, Mexico and Taiwan to meet the demand for Nvidia's new Blackwell chips... Read More...

Jabil Looks to Expand India Investments

ST. PETERSBURG, FL – Jabil has signed a memorandum of understanding with India's Gujarat state government to allow the company to explore lo... Read More...

Foxconn Announces 20% Growth in Q3 Revenue

TAIPEI – Foxconn's third quarter revenue grew 20% year-over-year to total NT1.9 trillion ($58.4 billion). Read More...

SVI Public Sees Flat Q3 Revenue

PATHUMTANI, THAILAND – SVI Public Co. announced third quarter revenue of THB5.6 billion ($161.2 million), remaining flat compared to last ye... Read More...

FEATURES

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...

Reflow Profiling in PCB Assembly

Optimizing temperatures will ensure the best possible conditions for soldering. Verifying and optimizing the temperature profile of a reflow oven ensures an id... Read More...

Identifying Solder Mask Problems with Simple Tests

Diagnosing sources of crazing, delamination and peeling. In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, de... Read More...

Water Quality Matters

A novel approach leverages ion exchange technology with continuous monitoring for superior tank management. Aqueous cleaning operations in printed circuit boar... Read More...

Dendrite Growth Dynamics

Are industry standards sufficient for characterizing the effects of cleanliness at high voltages? The increasing popularity of high-voltage electronics, partic... Read More...

Stretching Solder Capabilities

Solder paste dispensing can solve the challenges posed by differing component sizes. While stencil printing has long been the cornerstone of applying solder pa... Read More...

‘A Legacy of Innovation’

Indium Corporation celebrates its 90th anniversary with a look at its past and future innovations. A sense of curiosity and discovery drove the founding of Ind... Read More...