Circuits Assembly Online Magazine - Yardsticks for Gauging AOI Effectiveness

NEWS

Semiconductor Manufacturing Industry Sees Solid Q4 Results, SEMI Reports

MILPITAS, CA – The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-over-year growt... Read More...

Electronics Industry Demand Rises in February

BANNOCKBURN, IL – Orders, capacity utilization, and backlogs all increased in the past month, pushing electronics industry demand higher acc... Read More...

Scanfil Reports 13.5% Decline in Annual Sales

OULU, FINLAND – Scanfil reported €779.8 million ($816.9 million) in full-year sales, a decrease of 13.5% compared to the previous year. ... Read More...

North American PCB Industry Sales Up 20% in January

BANNOCKBURN, IL – North American PCB shipments in January were up 19.9% compared to January 2024, IPC announced in findings from its North A... Read More...

Flex Opens New Facility in Dallas

DALLAS – Flex has expanded its US manufacturing operations with a new 400,000 sq. ft. facility here, aimed at enhancing its production capab... Read More...

Vexos Expands Manufacturing Capacity in Vietnam, US

NEW YORK – Vexos has announced expansions of its Ho Chi Minh City, Vietnam, and Vancouver, WA, facilities to meet increasing customer demand... Read More...

Libra to Close Northeast OH Facility

MENTOR, OH – Libra Industries is set to close its facility in Northeast Ohio, resulting in the permanent loss of 17 jobs. Read More...

North American EMS Industry Down 2.4% in January

BANNOCKBURN, IL – Total North American EMS shipments in January were down 2.4% compared to the same month last year, according to IPC's find... Read More...

SIIX Reports 2% Decline in Annual Revenue

OSAKA, JAPAN – SIIX announced annual revenue of JPY302.3 billion ($2 billion), down 2.4% from 2023's total. Read More...

FEATURES

Understanding Solder Paste Viscosity and Thixotropy

Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe... Read More...

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ... Read More...

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te... Read More...

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef... Read More...

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...