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NEWS

Syrma SGS and Elemaster Launch India JV for High-Reliability Electronics

Syrma SGS and Elemaster Launch India JV for High-Reliability Electronics

BENGALURU – Syrma SGS Technology has signed a joint venture agreement with Italy-based Elemaster to form Syrma SGS Elemaster Private Limited...  Read More...

PCB West 2025 Exhibition Floor Sells Out in Silicon Valley

PCB West 2025 Exhibition Floor Sells Out in Silicon Valley

PEACHTREE CITY, GA – The exhibition floor space is sold out for PCB West (https://www.pcbwest.com), the largest exhibition and conference fo...  Read More...

Key Tronic Posts Lower Revenue Amid Tariff Uncertainty

Key Tronic Posts Lower Revenue Amid Tariff Uncertainty

SPOKANE VALLEY, WA – Key Tronic Corporation reported fourth-quarter and full-year results showing softer demand and tariff-related delays we...  Read More...

North American EMS Shipments Slip 4.1% in July

North American EMS Shipments Slip 4.1% in July

BANNOCKBURN, IL – North American EMS shipments in July fell 4.1% on a 90-day moving average versus a year ago. Shipments declined 5.1% seque...  Read More...

North American PCB Shipments Surge 20.7% in July

North American PCB Shipments Surge 20.7% in July

BANNOCKBURN, IL – North American PCB shipments in July rose 20.7% on a 90-day moving average versus a year ago. Shipments increased 11.3% se...  Read More...

Key Tronic Opens Springdale Center of Excellence

Key Tronic Opens Springdale Center of Excellence

SPRINGDALE, AR – Key Tronic Corporation opened a new US Center of Excellence in Springdale, Arkansas, marking an expansion of its EMS footpr...  Read More...

Smartphone Shipments to Rise 1%

Smartphone Shipments to Rise 1%

NEEDHAM, MA – Worldwide smartphone shipments are set to grow 1.0% year over year to 1.24 billion units, according to IDC’s Worldwide Quarter...  Read More...

Clarkson Researchers Unveil TASChips to Tackle Chip Overheating

Clarkson Researchers Unveil TASChips to Tackle Chip Overheating

POTSDAM, NY – Clarkson University researchers are developing TASChips, an open-source tool that performs real-time thermal analysis on moder...  Read More...

GPV Reports Solid Q2 Performance

GPV Reports Solid Q2 Performance

GPV, Europe’s second-largest EMS provider, reported stable sales and higher earnings in the second quarter. The company posted quarterly sal...  Read More...

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FEATURES

Smart Factory Evolution: Innovations in Automated Production

Smart Factory Evolution: Innovations in Automated Production

Maintaining stable production through error and predictive detection. As industry shifts from the Internet of things, entailing machine-to-machine (M2M) and pe...  Read More...

Where Market Intelligence Meets Distribution

Where Market Intelligence Meets Distribution

Component Dynamics is showing how independent distributors can guide their customers in tricky times. It’s well-established that the Covid component crisis for...  Read More...

Cold Solder Joints

Cold Solder Joints

Why they occur, and what to do about them. Soldering, the process of joining two or more metals through the application of heat, has been around for millennia,...  Read More...

Agentic AI: The Future of the Electronics Manufacturing Supply Chain

Agentic AI: The Future of the Electronics Manufacturing Supply Chain

Initiating complex workflows with simple text commands. The 21st century has stress-tested the global supply chain. Climate shocks and geopolitical flare-ups h...  Read More...

The Hidden Potential of Excess and Obsolete Component Inventory

The Hidden Potential of Excess and Obsolete Component Inventory

Recouping value from excess stock. If manufacturers understood the true value and opportunity of their excess and obsolete (E O) electronic component stock, th...  Read More...

When Do You Need Nitrogen in Reflow?

When Do You Need Nitrogen in Reflow?

Hint: A good process might be enough. Nitrogen in reflow soldering is often seen as a performance enhancer – offering improved wetting, shinier joints and fewe...  Read More...

Breaking the Six Sigma Wall with Causal AI

Breaking the Six Sigma Wall with Causal AI

How Siemens lowered its PCB assembly defect rate through linked data analysis. The introduction of causal AI has opened a new chapter in PCB production. As par...  Read More...

Mechatronics Assembly Techniques You Should Be Using in 2025

Mechatronics Assembly Techniques You Should Be Using in 2025

Ten techniques to ensure a smooth end-to-end process. From medical devices to monitoring systems, products are becoming smaller, smarter and more complex to ma...  Read More...

Factors Contributing to Solder Ball Formation: A Guide

Factors Contributing to Solder Ball Formation: A Guide

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form o...  Read More...

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PRODUCTS

LongCloud Engineering Rolls Out SMT Spool Tool-Less Fastening Solution

LongCloud Engineering Rolls Out SMT Spool Tool-Less Fastening Solution

LongCloud Engineering’s SMT Spool is a tool-less fastening standoff. Enables precise, rapid horizontal board alignment. Align to the mounting hole, slide latera...  Read More...

NECTEC Launches Next-Gen SMT Line Solution with LED and X-ray Technology

NECTEC Launches Next-Gen SMT Line Solution with LED and X-ray Technology

Nectec's SMT lineup adds smart pick-and-place (desktop, high-speed, multi-function, odd-form and LED/DOB/LED-lens models up to 1500 mm), one-click feeder-cart c...  Read More...

Aven Releases Inspector UV Magnifying Lamp

Aven Releases Inspector UV Magnifying Lamp

Aven InspectorUV magnifying lamp combines 5-diopter (2.25x) magnification with dual-mode LED lighting – standard white light and ultraviolet – for conformal coa...  Read More...

Hirose Releases Multi-Power BK11 Series

Hirose Releases Multi-Power BK11 Series

Hirose's BK11 Series multi-power hybrid FPC-to-board connector delivers a footprint up to 46% smaller than conventional designs. Supporting two main power conta...  Read More...

Yincae Unveils Advanced Liquid Metal TIM – TM 150LM

Yincae Unveils Advanced Liquid Metal TIM – TM 150LM

YINCAE's TM 150LM is a Liquid Metal Thermal Interface Material (TIM). Delivers improved printability, thermal stability and reliability in high-power electronic...  Read More...

ViTrox Launches Smart 3D AOI platforms – V510Ai DST, V510Ai ST and V510Ai R

ViTrox Launches Smart 3D AOI platforms – V510Ai DST, V510Ai ST and V510Ai R

ViTrox launched three Smart 3D AOI platforms – V510Ai DST, V510Ai ST and V510Ai R – designed to advance back-end PCB assembly inspection through dual-sided, AI-...  Read More...

Indium Corp. Releases WS-910 Flip-Chip Flux

Indium Corp. Releases WS-910 Flip-Chip Flux

Indium WS-910 water-soluble flip-chip dipping flux is said to be compatible with molded and capillary underfill.  Read More...

Metcal Releases BH-4000 & BH-8000 Board Holders

Metcal Releases BH-4000 & BH-8000 Board Holders

Metcal BH-4000 and BH-8000 board holders provide adjustable support systems for PCB positioning during rework and assembly. Designed for directional flexibility...  Read More...

Kyocera AVX Releases 6780-000 Series T1 Industrial SPE Connectors

Kyocera AVX Releases 6780-000 Series T1 Industrial SPE Connectors

Kyocera AVX 6780-000 Series IP20 T1 industrial single-pair ethernet (SPE) connectors and cable assemblies enable data and power transmission over a single twist...  Read More...

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