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NEWS

RiverSide Merges 3 Firms as RiverSide Integrated Solutions

RiverSide Merges 3 Firms as RiverSide Integrated Solutions

RIVERSIDE, CA – RiverSide Electronics, RiverStar, and RiverBend Electronics are now operating under a single brand: RiverSide Integrated Sol...  Read More...

SMTC CEO Says Busy in Mexico, But Mixed Elsewhere

SMTC CEO Says Busy in Mexico, But Mixed Elsewhere

TORONTO – SMTC is expanding its capacity in Mexico, but its other North American plants remain moderately full.  Read More...

GlobalData: Intel Falls Behind, Opens Door to AMD, Nvidia

GlobalData: Intel Falls Behind, Opens Door to AMD, Nvidia

SANTA CLARA, CA – Intel has fallen behind in its ability to make commercially ready, leading-edge chips in sufficient volumes, opening the d...  Read More...

Amtech Reports Fiscal Q3 Net Revenue Down 28%

Amtech Reports Fiscal Q3 Net Revenue Down 28%

TEMPE, AZ – Amtech Systems reported fiscal third quarter net revenue of $15.2 million, down 28% year-over-year and 5% sequentially.  Read More...

Foxconn Reported Record July Revenues Up 1%

Foxconn Reported Record July Revenues Up 1%

TAIPEI – Foxconn Electronics reported consolidated revenues of NT$403.4 billion (US$13.7 billion) for July, up 1.3% year-over-year and 11.9%...  Read More...

Scanfil Reports Q2 Revenue Up 9%

Scanfil Reports Q2 Revenue Up 9%

SIEVI, FINLAND – Scanfil reported second quarter revenue of €155.6 million (US$183.4 million), up 9.1% year-over-year.  Read More...

SMTC Posts Q2 Revenue Nearly Flat YoY

SMTC Posts Q2 Revenue Nearly Flat YoY

TORONTO – SMTC Corp. posted second quarter revenue of $90.4 million, down 0.6% year-over-year and 5% sequentially.  Read More...

Global Semi Sales Up 5% in June

Global Semi Sales Up 5% in June

WASHINGTON — Worldwide sales of semiconductors were $34.5 billion in June, up 5.1% year-over-year and down 0.3% sequentially, according to t...  Read More...

IEC Reports Fiscal Q3 Revenues Up 17%

IEC Reports Fiscal Q3 Revenues Up 17%

NEWARK, NY – IEC Electronics Corp. reported fiscal third quarter revenues of $47.4 million, an increase of 17% year-over-year and 7% sequent...  Read More...

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FEATURES

Hidden Trouble in a BGA Package

Hidden Trouble in a BGA Package

Does a small node suggest anomalies – and potential failure?  Read More...

Leveraging Systems and Processes to Evolve NPI

Leveraging Systems and Processes to Evolve NPI

A cross-functional team approach for completing prototypes and ramping to production.  Read More...

FPGA Issues and Concerns: A Real Danger and a Call to Action

FPGA Issues and Concerns: A Real Danger and a Call to Action

The reality of a brittle supply chain could mean harsh consequences for failure to deliver.  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

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PRODUCTS

Creative Materials Introduces 813-76 Thermal Adhesive

Creative Materials Introduces 813-76 Thermal Adhesive

813-76 is a two-component room-temp.-curing thermally conductive and electrically insulating adhesive.  Read More...

Koki Releases Lead-free Soldering Process Development and Reliability Book

Koki Releases Lead-free Soldering Process Development and Reliability Book

Lead-free Soldering Process Development and Reliability, edited by Jasbir Bath, covers Pb-free soldering, such as developments in process engineering, solder al...  Read More...

Koki Delivers TF-M881R Tack Flux

Koki Delivers TF-M881R Tack Flux

TF-M881R tack flux is for BGA/CSP component applications.  Read More...

Kemet Releases Tantalum Stack Polymer O 7360-43

Kemet Releases Tantalum Stack Polymer O 7360-43

Tantalum Stack Polymer O 7360-43 surface mount capacitor is suited and sized for use in high-voltage power management applications such as buck boost converters...  Read More...

Tektronix Debuts TBS1000C Digital Storage Oscilloscope

Tektronix Debuts TBS1000C Digital Storage Oscilloscope

TBS1000C digital storage oscilloscope has 7" WVGA color display with up to 1GS/s sample rate and bandwidths from 50MHz to 200MHz.  Read More...

Hioki Offers IM9202 Test Fixture

Hioki Offers IM9202 Test Fixture

IM9202 test fixture makes high-frequency measurements of surface-mount and leaded components.  Read More...

CalcuQuote Adds ShopCQ Ordering API Integrations

CalcuQuote Adds ShopCQ Ordering API Integrations

ShopCQ supply chain management software now includes ordering API integrations for faster, simpler purchasing when placing online orders with several leading co...  Read More...

Zestron Launches Vigon NX 700 pH Neutral Cleaning Agent

Zestron Launches Vigon NX 700 pH Neutral Cleaning Agent

Vigon NX 700 a pH neutral defluxing agent can be used in inline and batch cleaning systems.  Read More...

Henkel Debuts Bergquist Gap Pad TGP 12000ULM TIM

Henkel Debuts Bergquist Gap Pad TGP 12000ULM TIM

Bergquist Gap Pad TGP 12000ULM thermal interface material is for high-power-density designs such as hyperscale and cloud-scale data centers and 5G telecom infra...  Read More...

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Tweets by Mike Buetow

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