Circuits Assembly Online Magazine

NEWS

Global Semiconductor Equipment Billings Up 9% in Q3, SEMI Reports

MILPITAS, CA – Global semiconductor equipment billings rose 7% year-over-year to $28.75 billion in the third quarter, SEMI announced today. ... Read More...

ECIA Publishes Publishes China Tariff Avoidance and Recovery Process Document

ATLANTA — The ECIA’s Global Industry Practices Committee (GIPC) has published a document to update members on best practices as companies in... Read More...

TechSearch Releases Advanced Packaging Update

AUSTIN, TX — TechSearch International's latest Advanced Packaging Update describes some of the thermal challenges facing the industry from m... Read More...

Tata Reportedly in Talks to Acquire Wistron's India Facility

MUMBAI — Tata Group is in talks with Wistron to acquire the Taipei-based corporation's facility in Karnataka, India, for up to 50 billion ru... Read More...

Saki Opens New Solution Center in Thailand

TOKYO — Saki Corporation held the opening ceremony for its new solution center in Nonthaburi, Thailand on November 29. The Saki Solution Cen... Read More...

Pemtron Goes Public on KOSDAQ Stock Market

GARDENA, CA ― Pemtron Technology, a developer and manufacturer of inspection equipment, went public on the Korea Stock Exchange (KRX) on Nov... Read More...

Scanfil CEO to Step Down by End of 2023

OULU, FINLAND — Scanfil on Monday said its chief executive officer is stepping down by the end of 2023 after being with the Finnish electron... Read More...

PCB West 2023 Show Floor Selling Out

PEACHTREE CITY, GA – The exhibition floor space for PCB West (https://www.pcbwest.com) 2023 is more than 50% sold, the Printed Circuit Engin... Read More...

Katek to Acquire EMS Supplier Nextek

MUNICH — Katek SE has signed a purchase agreement with the owners of Nextek Inc. to acquire all shares in the company, with the closing of t... Read More...

FEATURES

The Heat is Off: Could a New Platform Revolutionize Soldering?

New technology from Safi-Tech means cold solder joints might no longer mean defects. I’ve been covering the soldering industry for more than 30 years. During t... Read More...

Why I4.0 and Reshoring Go Hand in Hand

The path to digitize a factory is both closer and cheaper than most engineers realize. Reshoring has been a buzzword for a few years now. But when supply chain... Read More...

Robust Tacking Material Technology to Reduce Tool and Fixturing Complexity in Power Module Assembly

A solution for flux-free formic acid reflow? Growing performance demands for power electronics systems, driven by rapid advancements in application areas su... Read More...

M2M Communication is Here. Do We Still Need Judgment Calls?

Data-driven processes require IP coordination among vendors – and that means humans. We hear a lot these days about smart manufacturing, but is there a broad c... Read More...

Tackling Head-in-Pillow Defects with Vapor Phase Reflow

An EMS finds VPS dramatically reduced HiP in BGA/LGA connectors. Head-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boa... Read More...

Defluxing of Copper Pillar Bumped Flip-Chips

A case study showed a well-balanced aqueous cleaning agent removed Pb-free, water-soluble tack flux residues better than straight DI water. Solder bump technol... Read More...