SuperBoost for FlashCORE III decreases programming times for e.MMC and SD devices. Is a field-upgradeable feature that re-architects and optimizes the programming engine without making hardware changes. Can achieve the highest programming speeds available. High production throughput can be achieved despite programming huge date file sizes. Devices using Jedec e.MMC interface benefit, including e.MMC 4.41, Samsung MoviNAND, Toshiba e.MMC, Micron e.MMC, Hynix e-NAND, Phison ECC-NAND and SanDisk iNAND.
Data I/O Corp., www.dataio.com
RL132 radial insertion machine has a lead chuck system, providing insertion at 25,700 cph (0.14 sec./component), a reported 33% reduction in printed circuit board transfer time. Supports PCBs up to 650 x 381 mm, four pitch insertion (2.5/5.0/7.5/10.0 mm), and component verification and part binning.
Panasonic Factory Solutions Company of America, www.panasonicfa.com
KFS-VAF volumetric atomized flux applicator is for selective soldering. Controls and dispenses atomized flux material on demand via a user-programmable control system. Does not require any mechanical adjustments. Spray volume and width is set by user-programmed control parameters; varying amounts of coverage can be accomplished as needed on the same printed circuit board. Can be used with all known fluxes, even up to 33% solids. Can be integrated with the KFSDJ drop jet fluxer.
ACE Production Technologies Inc., www.ace-protech.com