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New nozzle geometries for wave soldering machines include single solder nozzles and a combination of different nozzle geometries. Said to reduce typical soldering defects such as insufficient fillings, open solder joints and soldering bridges. Improves wetting times and heat input. Speeds throughput up to 40%. Suitable for Pb-free alloys.

Seho Systems, www.seho.de

Test interface simulation optimizes test interfaces. Signal integrity simulation shows test interface performance. Provides PCB layouts and ensures optimum overall test interfaces. Dedicated simulations may be applied. Verification simulation is a post-layout solution that uses a library of previously simulated models to determine whether an interface meets bandwidth requirements. A limited amount of optimization that compares the PCB material and contactor type also can be incorporated. Interface features can be customized, such as component footprints, contactors and trace topology. Optimization simulation is a 3-D electromagnetic system-level method of ensuring the test interface works the first time.

Multitest, www.multitest.com

Atron AC 207 surfactant PCB cleaner reportedly has a bath life three to 10 times longer than that of traditional surfactants. Offers cleaning results in high and medium pressure inline and batch cleaning processes at low concentrations and temperatures. Removes a variety of Pb-free and eutectic flux residues and unsoldered solder pastes.

Zestron, www.zestron.com

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