APT-9411 flying probe tester uses four high-speed, independently moving probes, thus eliminating bed-of-nails fixtures. Positioning resolution on x and y axes has been enhanced to 1.25 μm. Flying height has been increased to 40 mm. Comes with four moving probes, two IC opens on the top side, and one camera for vision alignment/inspection. TOS-5 upgrade provides second top-side camera with wider viewing angle, permitting faster visual inspection over a greater area. Standard system inspects individual components at approximately three images per second; TOS-5 option inspects groups of components at same speed. Can be connected to boundary scan and extra power supplies and instruments for digital or limited functional testing.
Takaya, www.takaya.co.jp
F08 Poly-form flexible preform adhesive meets IEC 61249-2-21. Supports efforts to reduce chlorine and bromine levels in component assemblies. Halogen-free adhesives are designed for bonding metals, plastics and glass. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is consistent. Facilitates manual and automated handling. Can be pre-shaped in multiform configurations to accommodate a broad range of applications.
Multi-Seal, www.multi-seals.com
StikNPeel single-use flexible rework stencil is adhesive-backed. Tacky adhesive makes sure the stencil stays coplanar to the board during paste printing; solder does not smear underneath the stencil. Can be placed in crowded areas of the PCB without relying on tape down or fixturing methods. Made from Mylar and available in 0.004", 0.005" and 0.006" thicknesses. QFPs and other devices and areas down to 0.5 mm pitch can be fabricated. Each stencil is cut to order from customer datasheets, Gerbers or dxf/dwg files. Max. stencil size is 4" x 4". Twenty pieces per package.
BEST, www.solder.net