Products
PACTECH PCB310 is for placement and daisy chain continuity testing after assembly. Substrate has 28 mounting sites for 10 x 10 mm flip chips; is companion to PACTECH dummy flip chips. Test die are combined with test boards for testing a variety of specs and processes. There are two rows of seven pads. Depending on die, they have either 184 bumps and a bump pitch of 200 µm or 572 bumps and a pitch of 200 µm/400 µm. Evaluation board is 6.3" x 3.95"; has two layers and is 0.062" thick. Board material is high temp Tg. Standard board finish is OSP Entek CU-A-HT.
Practical Components Inc., www.practicalcomponents.com
The Mixed Technology Training Kit is now available in both Pb-free and SnPb versions. Offers a mixture of through-hole and SMT. Contains common components found in mature technology applications. Parts are packaged in static shield bags.
STI Electronics Inc., www.stielectronicsinc.com
PCB123 v4 advanced software design tool has an intuitive CAD interface for freedom and flexibility in schematic and layout editing. Features 500,000 new parts, improved search functionality with complete access to parts libraries, automated BoM, data importer that imports DXF files from mechanical CAD tools. Integrates DRC/DfM rules into the software. Offers research, availability and pricing for each component registered in the Digi-Key database. Is free and requires no license.
Sunstone Circuits, www.sunstone.com
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