Products
Generation 88 through-hole placement machine offers improved speed, throughput and functionality with a new control architecture and operating system. Includes Radial 88, VCD/Sequencer 88, and the Single-head Jumper Wire 88. Is suited for LED and other solid state lighting placement. Has low PPM levels. Available in standalone and pass-through configurations.
Universal Instruments, www.uic.com
Ablestik C100 series conductive die attach films come in 30 and 15 µm thicknesses. Can process thinner die and facilitate greater bondline control. Die sizes range from 1 x 1mm up to 6 x 6mm for a variety of package types, including QFNs and QFPs. Reportedly show excellent wetting ability and low bonding temperature; robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.
Henkel, www.henkel.com/electronics
MC-392LED is for populating extra-long LED panel assemblies in a single pass. Optional CT-150 conveyor extension unit enables two-stage assembly of LED boards of up to 1.2m (47.25”) long. Dual-head placement rate is 6,400 cph. Features ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm @3 Sigma. Cognex-based “on-the-fly” vision system views packages from 01005 to 16 x 14mm, including CSPs and µBGAs. Optional upward-looking vision cameras align components up to 150 x 100mm, including large BGAs and QFPs to 0.3.mm (0.012”) lead pitch. Vision inspection camera selectively checks solder paste printing and component placement accuracy. Has 192 tape feeder capacity.
Manncorp, www.manncorp.com/pick-and-place/mc392led
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