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Products

Correct-A-Chip series Fine Pitch Bump Adapters accommodate pitches down to 0.40 mm. Can use higher pitch devices on smaller pitch boards. Tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints including TSSOP and QFP with pitches down to 0.40 mm. Bottom has raised connection pads up to 0.010". Integrate higher pitch BGA devices with boards laid out with smaller pitches. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Come in tape and reel. Standard line and trace spacing down to 0.003" can be used. Available in panelized form, adapter only, or with devices mounted.

Aries, www.arieselec.com

Paradigm v.3.7 with a system alerts module is an ERP solution that now includes a plan by MRP function; generates and automates an action list of the required transactions that result after running MRP. Includes a non-nettable raw material processing feature; categorizes raw materials suspected of being defective, so as to not be used in MRP reporting. Various usability and user interface enhancements were also incorporated. The SAM module delivers real-time notifications via mobile device or PC; includes more than 50 alerts regarding sales, production, quality, materials, finance and maintenance; is compatible with Paradigm v.3.4 and higher.

Consona Corp., www.consona.com

Tacki ESD Pak comes in a 2" x 2" box with the tacky surface on the inside. Stores small components such as SMT discretes or ICs. Tacki Pads are 4" x 4" and 9" x 9" trays with a tacky surface for storing multiple types of components on the lab bench. Can take parts from both using tweezers without jarring components out of enclosures. Provide non-adhesive tacky surface that limits component movement. Are reusable. ESD-safe properties are 105 to 109 ohms. Tack level is 6 to 9 ft. lbs. of force.

SchmartBoard, www.schmartboard.com