Products
Ablestik C100 series conductive die attach films come in 30 and 15 µm thicknesses. Can process thinner die and facilitate greater bondline control. Die sizes range from 1 x 1mm up to 6 x 6mm for a variety of package types, including QFNs and QFPs. Reportedly show excellent wetting ability and low bonding temperature; robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.
Henkel, www.henkel.com/electronics
MC-392LED is for populating extra-long LED panel assemblies in a single pass. Optional CT-150 conveyor extension unit enables two-stage assembly of LED boards of up to 1.2m (47.25”) long. Dual-head placement rate is 6,400 cph. Features ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm @3 Sigma. Cognex-based “on-the-fly” vision system views packages from 01005 to 16 x 14mm, including CSPs and µBGAs. Optional upward-looking vision cameras align components up to 150 x 100mm, including large BGAs and QFPs to 0.3.mm (0.012”) lead pitch. Vision inspection camera selectively checks solder paste printing and component placement accuracy. Has 192 tape feeder capacity.
Manncorp, www.manncorp.com/pick-and-place/mc392led
Mydata replacement inline filters increase vacuum and air performance in equipment; last longer than OEM versions. Are capable of capturing particles as small as 0.1 µm. Include K-012-0015 (includes housing, o-ring, mesh filter and two couplers) and K-012-0016 (pack of 12 filters with enhanced air performance and durability).
Count on Tools, www.cotinc.com
Press Releases
- VJ Electronix Expands U.S. Coverage with MaRC Technologies Representation in the Pacific Northwest
- Absolute EMS Adopts Luminovo to Modernize and Streamline Quoting
- Iiris Heiskanen Appointed as New CFO of Scanfil
- CE3S Expands Electrostatic Measurement Offering with Next-Generation Compact Static Field Meter from Desco Industries