Products
The heating head for the HR 600 XL supports controlled rework of large-format and high-density assemblies. Designed for BGAs, QFNs, connectors and complex components, the heating head integrates with vision alignment and process control for repeatable thermal profiles.
The VERSAFLEX 2.0 solder module enables independent, parallel processing of two PCBs within a single selective soldering system. Supports automatic nozzle changing and matrix-controlled preheating to improve throughput, setup consistency and repeatability in high-mix production environments.
The MicroVue 2.0 digital microscope is designed for PCB inspection, rework and quality verification in electronics assembly environments. The system integrates a 13.3in HD monitor with a camera-based inspection platform, allowing eyepiece-free operation for inspection tasks. The system includes a magnetic ring light with sector control and optional UV illumination to support inspection of solder joints, surface features, contamination and coating coverage. A taller post with 0.5x lens support increases working distance, while fine focus adjustment supports detailed inspection and analysis. Updated software supports image capture, video recording, measurement and annotation for use across production, engineering and quality workflows.
Press Releases
- Distron Corporation Expands In-House Capabilities with Automated Conformal Coating for Complex PCB Assemblies
- Eastek International Corporation Appoints David Strabel as Vice President of Manufacturing
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Koh Young Announces Two Sales and Service Changes to Strengthen its Customers in the US and Canada