Products
The Mydata Midas tool 2026-5652 supports placement of the N61381US component in SMT assembly processes. The tool features a 0.125" outside diameter and 0.047" inside diameter with a 90° V-cut profile designed to align and seat components during placement. It is pinned to D121 to maintain alignment and positioning consistency during pick-and-place operations. The geometry supports stable handling of specialized components and consistent vacuum performance for automated assembly environments. The tool is designed for use on MYDATA systems and supports applications requiring precise component placement and handling of non-standard geometries.
Boardera API PCB project analyzer automates fabrication analysis, BOM processing, assembly planning and project pricing for electronics manufacturing workflows. The system extracts fabrication requirements including layer stackup, board dimensions, copper area, drill data and pad features from design files. BOM tools map component data, generate procurement links, assess availability and end-of-life risk and flag compliance with RoHS and REACH. Assembly planning functions calculate part counts, placement volumes, and package classifications to support process planning. Pricing modules support PCB-only, assembly-only, and turnkey configurations with models aligned to fabrication and EMS operations. The API integrates into manufacturer systems to support design analysis, quoting and production planning across PCB fabricators, assemblers and OEMs.
Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.
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