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The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one platform. Expands capability to accommodate 12-inch wafers and large-format printed circuit boards up to L510 × W460mm. Combines bare-die handling and SMT placement functions, delivering a bare-chip placement speed of up to 14,000 components per hour when supplied with wafers, along with placement accuracy of ±15µm. Designed for flexible production environments. 

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The TR7600FB SII is a 3D automated X-ray inspection system. Optimized for specialized substrates, fine-pitch BGAs, multilayer boards and system-in-package (SiP) devices. Incorporates a newly developed X-ray imaging structure that allows the X-ray tube to operate in close proximity to the board surface without structural interference. This architecture supports detailed inspection of critical components requiring precise internal visibility. Powered by TRI’s AI Ecosystem, combining AI-driven inspection algorithms with metrology-based measurement capabilities. Supports AI Smart Programming.

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PF606-P266J is a solder paste developed for high-speed jet dispensing applications in advanced electronics manufacturing. Designed for non-contact solder deposition. The formulation meant to maintain process stability across a broad range of jetting parameters. The solder paste uses a halogen-free flux system that supports strong wetting behavior and low residue levels. PF606-P266J supports ultra-fine solder powders from Type 5 through Type 7. The product is available in multiple alloy options, including SAC305, high-reliability alloys for automotive and industrial electronics and low-temperature alloys.

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