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ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.

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Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform.

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MacDermid Alpha Electronics Solutions Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-performance computing.

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