A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.
SchmartSolder is said to make hand-soldering through-hole components simple. Is loops of solder produced to fit over component leads. Reportedly melts and flows into the hole quickly.
The scanner-based FA-Inspector optical inspection system uses a high-res scanner and computer-based image processor to provide image acquisition, fault identification and SPC reporting. Incorporates proprietary optics, custom illumination and AOI Software. Board handling is said to be up to 19" x 24" with area of inspection of 11" x 16" in a single scan. Defect coverage includes SMT and PTH parts down to 0402, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences. Two modes of operation: AOI and Comparator.