Products
‘Soft Landing’ technology on the Condor flying probe test platform addresses concerns manufacturers face over test coverage on complex and high density boards, as well as unwanted damage that can occur with conventional probe techniques.
With ‘Soft Landing,’ the test nail travels towards the component or pad at normal speed until approximately 1 to 2 mm above its target landing position. The speed of the nail is then reduced to soften its impact with the board. This protects delicate components and minimizes the ‘footprint’ where the nail touches the board. In tests, adding a soft landing to an existing nail contact reduced the visible ‘footprint’ by more than a third.
A smaller footprint means more precise positioning in highly dense areas. It also lowers the chance of shorting leads in close proximity to each other, invalidating the test and creating potential damage.
Test coverage increases as more test points can be reached without being damaged or scratched. It only affects the z-axis of travel; Digitaltest MTS system test programs can be updated to take advantage of the technique with minimal additional programming.
Digitaltest GmbH, digitaltest.com
With ‘Soft Landing,’ the test nail travels towards the component or pad at normal speed until approximately 1 to 2 mm above its target landing position. The speed of the nail is then reduced to soften its impact with the board. This protects delicate components and minimizes the ‘footprint’ where the nail touches the board. In tests, adding a soft landing to an existing nail contact reduced the visible ‘footprint’ by more than a third.
A smaller footprint means more precise positioning in highly dense areas. It also lowers the chance of shorting leads in close proximity to each other, invalidating the test and creating potential damage.
Test coverage increases as more test points can be reached without being damaged or scratched. It only affects the z-axis of travel; Digitaltest MTS system test programs can be updated to take advantage of the technique with minimal additional programming.
Digitaltest GmbH, digitaltest.com
JPSA’s large-format laser beam switching module can quickly, accurately switch the entire beam from one path to another (i.e., between two different experiments, or between two separate processes). Has 50 x 50 mm clear aperture for passage of a larger-diameter homogenized beam without beam corner clipping. A vacuum UV (VUV) product, can be used with short-wavelength UV excimer beams including 157, 193 and 248 nm. There is no grease or oil VUV beam delivery designs, and all organic materials have been removed to prevent degradation by UV radiation and contamination of the optics and interior chamber. This switching module can be purged with high-purity gases such as nitrogen.
The industrial-grade product is designed for 24/7 service. Designed for integration into a laser beam delivery system and can deflect the beam out of production when desired to perform beam diagnostics, check beam homogeneity, pulse width or other beam characteristics, since an excimer laser beam changes characteristics over time and usage.
Remote control allows the user to insert or remove a beam splitter; is magnetically pre-mounted so the beam splitter will be accurately located. It has a true gimbal design and allows either a 90-degree turn or straight-through beam path. Switching is mechanical and the unit holds accurate tolerance swing when switching from one path to the next.
JPSA Laser, jpsalaser.com
Electrolock-ESD material is RoHS-compliant to meet regulatory demands for lead-free manufacturing.
Rich Reed, business unit manager, said: "When the 2006 lead-free requirements go into effect, high-temperature performance will become a more critical issue for electronic contract manufacturers. Our Electrolock-ESD material was designed to deliver consistent performance at temperatures in excess of 550°F, without deflection, which ensures a rigid, even surface and optimum machinability."
Rich Reed, business unit manager, said: "When the 2006 lead-free requirements go into effect, high-temperature performance will become a more critical issue for electronic contract manufacturers. Our Electrolock-ESD material was designed to deliver consistent performance at temperatures in excess of 550°F, without deflection, which ensures a rigid, even surface and optimum machinability."
Unlike conventional material solutions, the compound reportedly yields a smooth surface without the need for sanding. Durable surface is impervious to chemical reactions and eliminates glass blooming associated with traditional solder pallet materials.
Comes in a variety of sizes to accommodate a range of applications.
Electolock Inc., electrolock.com
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