Products
Novatec, a French research laboratory, announces an new tool for board support ¾ VacuNest Shape Memory Tooling.
Board support is critical in printers, dispensers and pick-and-place machines to run a repeatable process.
The shape memory tool combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules.
Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will hold for weeks/days/months until the vacuum is released. The modules return to their original form, awaiting the next version of board.
Cuts risk of damage to a component due to the pin/printing pressure; supports forces evenly spread over the entire board.
Can handle high-density boards and requires little to no lead-time.
Guarantees board flatness and is not sensitive to solder paste contamination.
Novatec, novatec-eap.com
AirMax VS high-speed connector system includes mezzanine, co-planar, high-power, I/O and backplane header versions. Said to offer scalability, flexibility, high density and performance headroom through its use of air as the dielectric and its Insert Molded Leadframe Assembly (IMLA).
Uses edge-coupling technology and an air dielectric between adjacent conductors, delivering high signal density with low insertion loss and low crosstalk, without metal shields.
Dual-beam receptacle contact provides two points of contact, one on each side of the header blade. Vertical header features a robust housing providing generous “lead in.” Comes with protective cover that also serves as press-in block during connector installation.
Comprised of a full set of building blocks for backplane, co-planar, mezzanine and cable-to-board applications. Are scaleable to the number of columns; available with housings in various IMLA counts.
Allow for custom pin assignments (differential or single-ended signals as well as power), so system data rates can grow from 2.5 Gb/s to over 12 Gb/s without re-design of the basic platform.
FCI, fciconnect.com/airmax
FCI, fciconnect.com/airmax
Owens Design partnered with Questar Products International to develop a line of automatic wire bonders built on Kulicke and Soffa’s former Hybrid bonder platforms. Capabilities include fine pitch, large table travel and ball bumping, with user friendly, customizable software. The Questar Q2100 series bonders are designed for a range of complex devices.
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
Questar Products International, questarinc.com
Owens Design, owensdesign.com
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
Questar Products International, questarinc.com
Owens Design, owensdesign.com
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