Products
Practical Components now supplies the AIM print test board and kit designed to include printing challenges commonly encountered on manufacturers’ assemblies. In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release. AIM has included the standard IPC slump test pattern to further challenge the properties of any product tested. This print pattern is more “real life” and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the “thermometer” method. A number on the board indicates the distances between pads.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.
Practical Components, practicalcomponents.com
Onyx 29 semi-automated selective soldering machine provides high-performance rework of standard SMD components, but also handles problem components such as 80-mm SMD connection boards.
Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.
Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.
Zevac AG, zevac.ch
92-XCON OA flux is formulated for Pb-free soldering, and designed to withstand the high temperatures associated with Pb-free processing without breaking down or losing its activity. Said to offer a robust process window and combine freely rinsable, thermally stable synthetic polymers with a well-tuned activator system. Delivers metallurgically sound solder joints with a shiny appearance even under high thermal load. Cleans easily in a straight aqueous process, yielding circuit assemblies with extreme ionic cleanliness. Passes the Silver Chromate test for halides and is categorized as an IPC-Jstd-004 ORH0 product.
Cobar BV, cobar.com
Cobar BV, cobar.com
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