A 1 mm centerline Card Edge Connector meets the high performance point-to-point full duplex I/O Bus standard for PCI Express Architecture. The PCI Express standard allows customers to reach the high bandwidth required by modern equipment. Applications include graphics cards in serial bus applications, I/O client cards for applications requiring higher speeds than the popular PCI Bus, computers (both desktop and server) and telecommunications switches and routers. Available for all standard PCI Express slot sizes (x1, x4, x8 and x16); comes with plastic locating posts or metal hold-downs. Available in straddle-mount or right angle configurations and with three different tail lengths (2.3, 3.1 and 3.56 mm).
Quadrus Verifier is designed for Department of Defense (DoD) suppliers to verify the compliance of their Data Matrix codes as specified by MIL STD 130 L Change 1. The fully integrated unit measures the quality of a Data Matrix symbol against the criteria for symbol quality established in ISO/IEC 15415 and AS9132 standards.
Is the only ISO/IEC 15426-2 certified Data Matrix verifier, a significant breakthrough for DoD suppliers as well as automotive, electronics and aerospace manufacturers required to verify Data Matrix codes applied to parts and components.
Unlike most bench-top verifiers that are mounted on stands designed for the lab environment, the Quadrus is a fully-contained, compact device that is easy to integrate into the production environment.
To ensure consistent results on the manufacturing floor, it has preset focus and illumination. Fully-enclosed illumination chamber is engineered to produce the illumination angles required by ISO/IEC 15415. Features compact, lightweight design and flexible mounting. No optical or lighting engineering experience is needed because no on-site calibration of optics or lighting is required. Factory-calibrated illumination and optics to ISO/IEC 15426-2 guarantees accurate verification results of every Data Matrix code.
Datacon has added Laurier’s ultra high precision flip chip die bonder to its portfolio. Designed to meet the needs of high accuracy bonding applications, specifically in the optoelectronics and semiconductor industries, the M9 delivers sub micron resolution (0.5 micron placement accuracy).
Michael Auer, VP of sales at of Datacon, believes that the M9 will prove to be a popular choice for universities and other research establishments: “The M9 is incredibly flexible and comes in a manual option which keeps the cost low. It is also very easy to use so that with as little as a day’s training a student or technician can operate the basic system. Its small foot print means that it takes up very little clean room space.”
Other features include; handling forces of up to 200Kg, temperatures of up to 500°C, Split Optics System and Brightfield/Darkfield Illumination, Air Bearing Components, Tip/Tilt adjustment, Closed Loop Feedback Temperature and Force Maintenance, Motorized Stages and Windows XP.
Typical application areas include optoelectronics (transmitters, receivers, MEMS, pump lasers, detectors) and semiconductors, low force focal plane arrays, LCD displays, automotive, RF devices and biomedical applications.