Products
SCC-700 Cooling Conveyor station provides a quick PCB cool down that occupies a minimal amount of floor space.
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
Promation, Pro-mation-Inc.com
Designed to quickly cool down PCBs after reflow or high-temp curing, allowing operators to hand remove for final disposition.
Is 1000 mm long; incorporates cooling fans and a small refrigeration unit. The cooling temperature output may be selected through a digital readout panel and the conveyor transports the PCB or pallet on 3 mm edge contact.
A vertical lift door seals in the cold air, but provides easy access.
Promation, Pro-mation-Inc.com
DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Hover-Davis, hoverdavis.com
ETCO Mighty-T Press is a bench-top semi-automatic press and wire terminal applicator for low volume users that replaces hand crimping. Features a rigid one-piece cast iron frame, employs a 40 mm stroke with 4,450 lbs. of crimping force and includes a footswitch, safety interlock and reel arm. Wire terminal applicator has a two-piece anvil to crimp wire and insulation ear sections in a single stroke. Eliminates hand crimping and has an open architecture for easy feed adjustment and tooling changes.
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
ETCO Inc., etco.com
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
ETCO Inc., etco.com
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