Products
ASHBURN, VA – Zestron America will showcase its latest lead-free cleaning process solutions at booth 5609 during ATExpo from Sept. 27-29 in Rosemont, IL. The company will also feature its recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
DEK will launch the VectorGuard Nickel Laser Cut stencil range at ATExpo on Sept. 27-29. The event will include DEK’s high accuracy mass imaging solutions in booth 5400.
The stencils are designed to address the challenges presented by lead-free, accommodating the effects of changing paste rheology on aperture release characteristics. Said to deliver a high level of paste volume repeatability to optimize process yield and uniformity.
DEK representatives will provide lead-free advice to delegates wanting to learn more. Clive Ashmore, global applied process engineering group manager at DEK, will also be presenting a lead-free paper - Mass Imaging of Lead-Free Material.
DEK, dek.com
Haverhill, MA – Ultrasonic Systems’ Optima Fluxing System has an Ultra-Spray head that produces a more vertical spray pattern, ensuring through-hole penetration on the wide, thick circuit boards.
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
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