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Multicore MP218 halide-free, no-clean solder paste is optimized for SnPb processes yet compatible with Pb-free device finishes. Is comprised of similar raw materials, activators and other components as used in next generation Pb-free solders. Offers wider reflow capabilities to overcome wetting issues caused by the combination of SnPb solder and Pb-free device finishes.


Is designed to operate under elevated Pb-free temperatures (up to 260°C). Is said to have high humidity resistance. Anti-tombstoning formulation is designed to extend the liquidus time of solder during reflow, increasing the wetting window for each end of the component.


Newark InOne, a small-quantity distributor of electronic components and test equipment in North America and a subsidiary of global Premier Farnell, has posted a downloadable Guide to the WEEE Directive on its RoHS Express website: newarkinone.com/rohs.
 
The guide was designed to help U.K. businesses comply with the WEEE legislation, which has a newly extended deadline of June 2006. The guide also has relevance for North American companies, as the need for recycling solutions will grow along with the number of e-recycling (electronics recycling) laws in the U.S. and Canada .
 
Unlike its sister directive, RoHS, each E.U. member state will differ in how it implements WEEE, which deals with the collection, treatment and recovery of nearly any electrical or electronic product that ends up in a landfill. Similarly, in the absence of national legislation, 28 states are writing their own WEEE-type laws. The RoHS Express site offers a guide to pending and existing environmental legislation in the U.S. and Canada.
 
 
Newark InOne, newarkinone.com
DEK is expanding its range of tooling options for its printers by introducing the smaller, cost-effective Grid-Lok technology.
 
The new tooling system features reduced dimensions, moving from the current modules of 6 x 18 in. to 4 x 12 in. in the new system.
 
Features a modular array of pneumatically controlled tooling pins that conform to the underside of the board including contact with components. Each of the 12 tooling pins is tipped with anti-static material and locked independently. Pressure exerted by each pin during lift is approximately 5 g. Capable of working with boards from 50 x 50 mm to 500 x 500 mm. The conforming sequence is initiated by the operator, and is ready for use within 2 sec.
 
In fully automatic mode the system is controlled through the Instinctiv interface which can set its profile for every product passing through the machine.
 
 
Grid-Lok is compatible with Horizon, Infinity API, Micron Class Galaxy and Europa platforms.
 
 
DEK, dek.com

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