Products
Haverhill, MA – Ultrasonic Systems’ Optima Fluxing System has an Ultra-Spray head that produces a more vertical spray pattern, ensuring through-hole penetration on the wide, thick circuit boards.
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
FRANKLIN, MA – Speedline Technologies will showcase MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo booth 5710.
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
EFD introduces SN89/SB10.5/CU0.5 high-temperature, lead-free solder paste with a solidus temperature of 242ºC, 22°C delta above SAC. May be used for multiple-step component assembly where the component will later be attached to a PCB using SAC alloy.
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC.
Available in all flux systems and alloy types II, III, IV and V.
EFD, efdsolder.com
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC.
Available in all flux systems and alloy types II, III, IV and V.
EFD, efdsolder.com
Press Releases
- KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
- ECIA Executive Conference Announces Session on eCrime Tradecraft
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing